KR960032746U - Wire bonding tools - Google Patents

Wire bonding tools

Info

Publication number
KR960032746U
KR960032746U KR2019950005200U KR19950005200U KR960032746U KR 960032746 U KR960032746 U KR 960032746U KR 2019950005200 U KR2019950005200 U KR 2019950005200U KR 19950005200 U KR19950005200 U KR 19950005200U KR 960032746 U KR960032746 U KR 960032746U
Authority
KR
South Korea
Prior art keywords
wire bonding
bonding tools
tools
wire
bonding
Prior art date
Application number
KR2019950005200U
Other languages
Korean (ko)
Other versions
KR0132402Y1 (en
Inventor
김영선
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950005200U priority Critical patent/KR0132402Y1/en
Publication of KR960032746U publication Critical patent/KR960032746U/en
Application granted granted Critical
Publication of KR0132402Y1 publication Critical patent/KR0132402Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019950005200U 1995-03-23 1995-03-23 A wire bonding tool KR0132402Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950005200U KR0132402Y1 (en) 1995-03-23 1995-03-23 A wire bonding tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950005200U KR0132402Y1 (en) 1995-03-23 1995-03-23 A wire bonding tool

Publications (2)

Publication Number Publication Date
KR960032746U true KR960032746U (en) 1996-10-24
KR0132402Y1 KR0132402Y1 (en) 1999-02-01

Family

ID=19409736

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950005200U KR0132402Y1 (en) 1995-03-23 1995-03-23 A wire bonding tool

Country Status (1)

Country Link
KR (1) KR0132402Y1 (en)

Also Published As

Publication number Publication date
KR0132402Y1 (en) 1999-02-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090828

Year of fee payment: 12

EXPY Expiration of term