KR950015652U - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
KR950015652U
KR950015652U KR2019930025851U KR930025851U KR950015652U KR 950015652 U KR950015652 U KR 950015652U KR 2019930025851 U KR2019930025851 U KR 2019930025851U KR 930025851 U KR930025851 U KR 930025851U KR 950015652 U KR950015652 U KR 950015652U
Authority
KR
South Korea
Prior art keywords
wire bonding
bonding device
wire
bonding
Prior art date
Application number
KR2019930025851U
Other languages
Korean (ko)
Other versions
KR0136528Y1 (en
Inventor
남수근
Original Assignee
삼성항공산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업주식회사 filed Critical 삼성항공산업주식회사
Priority to KR2019930025851U priority Critical patent/KR0136528Y1/en
Publication of KR950015652U publication Critical patent/KR950015652U/en
Application granted granted Critical
Publication of KR0136528Y1 publication Critical patent/KR0136528Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019930025851U 1993-11-30 1993-11-30 Wire bonding apparatus KR0136528Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930025851U KR0136528Y1 (en) 1993-11-30 1993-11-30 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930025851U KR0136528Y1 (en) 1993-11-30 1993-11-30 Wire bonding apparatus

Publications (2)

Publication Number Publication Date
KR950015652U true KR950015652U (en) 1995-06-19
KR0136528Y1 KR0136528Y1 (en) 1999-03-20

Family

ID=19369381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930025851U KR0136528Y1 (en) 1993-11-30 1993-11-30 Wire bonding apparatus

Country Status (1)

Country Link
KR (1) KR0136528Y1 (en)

Also Published As

Publication number Publication date
KR0136528Y1 (en) 1999-03-20

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20071029

Year of fee payment: 10

EXPY Expiration of term