KR950021409U - Wire bonder capillaries - Google Patents

Wire bonder capillaries

Info

Publication number
KR950021409U
KR950021409U KR2019930028387U KR930028387U KR950021409U KR 950021409 U KR950021409 U KR 950021409U KR 2019930028387 U KR2019930028387 U KR 2019930028387U KR 930028387 U KR930028387 U KR 930028387U KR 950021409 U KR950021409 U KR 950021409U
Authority
KR
South Korea
Prior art keywords
capillaries
wire bonder
bonder
wire
bonder capillaries
Prior art date
Application number
KR2019930028387U
Other languages
Korean (ko)
Other versions
KR970003184Y1 (en
Inventor
김춘산
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019930028387U priority Critical patent/KR970003184Y1/en
Publication of KR950021409U publication Critical patent/KR950021409U/en
Application granted granted Critical
Publication of KR970003184Y1 publication Critical patent/KR970003184Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019930028387U 1993-12-17 1993-12-17 Wire bonding capillary KR970003184Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930028387U KR970003184Y1 (en) 1993-12-17 1993-12-17 Wire bonding capillary

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930028387U KR970003184Y1 (en) 1993-12-17 1993-12-17 Wire bonding capillary

Publications (2)

Publication Number Publication Date
KR950021409U true KR950021409U (en) 1995-07-28
KR970003184Y1 KR970003184Y1 (en) 1997-04-14

Family

ID=19371591

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930028387U KR970003184Y1 (en) 1993-12-17 1993-12-17 Wire bonding capillary

Country Status (1)

Country Link
KR (1) KR970003184Y1 (en)

Also Published As

Publication number Publication date
KR970003184Y1 (en) 1997-04-14

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080619

Year of fee payment: 12

EXPY Expiration of term