KR930016204U - Wire Bonder Multi Heater Block - Google Patents

Wire Bonder Multi Heater Block

Info

Publication number
KR930016204U
KR930016204U KR2019910023607U KR910023607U KR930016204U KR 930016204 U KR930016204 U KR 930016204U KR 2019910023607 U KR2019910023607 U KR 2019910023607U KR 910023607 U KR910023607 U KR 910023607U KR 930016204 U KR930016204 U KR 930016204U
Authority
KR
South Korea
Prior art keywords
heater block
wire bonder
multi heater
bonder
wire
Prior art date
Application number
KR2019910023607U
Other languages
Korean (ko)
Other versions
KR0128255Y1 (en
Inventor
박상빈
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019910023607U priority Critical patent/KR0128255Y1/en
Priority to JP1992088368U priority patent/JP2569317Y2/en
Publication of KR930016204U publication Critical patent/KR930016204U/en
Application granted granted Critical
Publication of KR0128255Y1 publication Critical patent/KR0128255Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
KR2019910023607U 1991-12-23 1991-12-23 Multi-heater block of wire bonder KR0128255Y1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR2019910023607U KR0128255Y1 (en) 1991-12-23 1991-12-23 Multi-heater block of wire bonder
JP1992088368U JP2569317Y2 (en) 1991-12-23 1992-12-24 Multi heater block of wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910023607U KR0128255Y1 (en) 1991-12-23 1991-12-23 Multi-heater block of wire bonder

Publications (2)

Publication Number Publication Date
KR930016204U true KR930016204U (en) 1993-07-28
KR0128255Y1 KR0128255Y1 (en) 1998-12-01

Family

ID=19325307

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910023607U KR0128255Y1 (en) 1991-12-23 1991-12-23 Multi-heater block of wire bonder

Country Status (2)

Country Link
JP (1) JP2569317Y2 (en)
KR (1) KR0128255Y1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980085414A (en) * 1997-05-29 1998-12-05 윤종용 Wire bonding device to fix heater block adapter by elastic force
JP5972153B2 (en) * 2012-11-21 2016-08-17 新日本無線株式会社 Wire bonding equipment

Also Published As

Publication number Publication date
KR0128255Y1 (en) 1998-12-01
JP2569317Y2 (en) 1998-04-22
JPH0563046U (en) 1993-08-20

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Legal Events

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Payment date: 20040719

Year of fee payment: 7

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