KR950034344U - Mega-bonding device of wire bonding machine - Google Patents

Mega-bonding device of wire bonding machine

Info

Publication number
KR950034344U
KR950034344U KR2019940010255U KR19940010255U KR950034344U KR 950034344 U KR950034344 U KR 950034344U KR 2019940010255 U KR2019940010255 U KR 2019940010255U KR 19940010255 U KR19940010255 U KR 19940010255U KR 950034344 U KR950034344 U KR 950034344U
Authority
KR
South Korea
Prior art keywords
mega
bonding
machine
wire bonding
wire
Prior art date
Application number
KR2019940010255U
Other languages
Korean (ko)
Other versions
KR0116973Y1 (en
Inventor
박기범
최의영
Original Assignee
엘지반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체 주식회사 filed Critical 엘지반도체 주식회사
Priority to KR2019940010255U priority Critical patent/KR0116973Y1/en
Publication of KR950034344U publication Critical patent/KR950034344U/en
Application granted granted Critical
Publication of KR0116973Y1 publication Critical patent/KR0116973Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78601—Storing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019940010255U 1994-05-09 1994-05-09 Wire bonding machine KR0116973Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940010255U KR0116973Y1 (en) 1994-05-09 1994-05-09 Wire bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940010255U KR0116973Y1 (en) 1994-05-09 1994-05-09 Wire bonding machine

Publications (2)

Publication Number Publication Date
KR950034344U true KR950034344U (en) 1995-12-18
KR0116973Y1 KR0116973Y1 (en) 1998-04-27

Family

ID=19382845

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940010255U KR0116973Y1 (en) 1994-05-09 1994-05-09 Wire bonding machine

Country Status (1)

Country Link
KR (1) KR0116973Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100799206B1 (en) * 2001-12-24 2008-01-29 삼성테크윈 주식회사 Structure and method for adjusting magazine guide

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100799206B1 (en) * 2001-12-24 2008-01-29 삼성테크윈 주식회사 Structure and method for adjusting magazine guide

Also Published As

Publication number Publication date
KR0116973Y1 (en) 1998-04-27

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090102

Year of fee payment: 12

EXPY Expiration of term