KR950023960U - Wire bonder's lead frame clamping device - Google Patents

Wire bonder's lead frame clamping device

Info

Publication number
KR950023960U
KR950023960U KR2019940001138U KR19940001138U KR950023960U KR 950023960 U KR950023960 U KR 950023960U KR 2019940001138 U KR2019940001138 U KR 2019940001138U KR 19940001138 U KR19940001138 U KR 19940001138U KR 950023960 U KR950023960 U KR 950023960U
Authority
KR
South Korea
Prior art keywords
clamping device
lead frame
wire bonder
frame clamping
bonder
Prior art date
Application number
KR2019940001138U
Other languages
Korean (ko)
Other versions
KR960009290Y1 (en
Inventor
박기범
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019940001138U priority Critical patent/KR960009290Y1/en
Publication of KR950023960U publication Critical patent/KR950023960U/en
Application granted granted Critical
Publication of KR960009290Y1 publication Critical patent/KR960009290Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
KR2019940001138U 1994-01-21 1994-01-21 Lead frame clamping device of a wire bonder KR960009290Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940001138U KR960009290Y1 (en) 1994-01-21 1994-01-21 Lead frame clamping device of a wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940001138U KR960009290Y1 (en) 1994-01-21 1994-01-21 Lead frame clamping device of a wire bonder

Publications (2)

Publication Number Publication Date
KR950023960U true KR950023960U (en) 1995-08-23
KR960009290Y1 KR960009290Y1 (en) 1996-10-16

Family

ID=19376069

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940001138U KR960009290Y1 (en) 1994-01-21 1994-01-21 Lead frame clamping device of a wire bonder

Country Status (1)

Country Link
KR (1) KR960009290Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030018206A (en) * 2001-08-27 2003-03-06 삼성전자주식회사 Lead frame clamping apparatus for wire bonding

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726768B1 (en) * 2001-04-06 2007-06-11 삼성테크윈 주식회사 The appratus for gripping a window clamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030018206A (en) * 2001-08-27 2003-03-06 삼성전자주식회사 Lead frame clamping apparatus for wire bonding

Also Published As

Publication number Publication date
KR960009290Y1 (en) 1996-10-16

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040920

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee