KR930026517U - Wire bonder lead frame fixing device - Google Patents
Wire bonder lead frame fixing deviceInfo
- Publication number
- KR930026517U KR930026517U KR2019920008256U KR920008256U KR930026517U KR 930026517 U KR930026517 U KR 930026517U KR 2019920008256 U KR2019920008256 U KR 2019920008256U KR 920008256 U KR920008256 U KR 920008256U KR 930026517 U KR930026517 U KR 930026517U
- Authority
- KR
- South Korea
- Prior art keywords
- fixing device
- lead frame
- frame fixing
- wire bonder
- bonder lead
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019920008256U KR0125862Y1 (en) | 1992-05-14 | 1992-05-14 | Lead frame fixing device of wire bonder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019920008256U KR0125862Y1 (en) | 1992-05-14 | 1992-05-14 | Lead frame fixing device of wire bonder |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930026517U true KR930026517U (en) | 1993-12-28 |
KR0125862Y1 KR0125862Y1 (en) | 1998-11-02 |
Family
ID=19333144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019920008256U KR0125862Y1 (en) | 1992-05-14 | 1992-05-14 | Lead frame fixing device of wire bonder |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0125862Y1 (en) |
-
1992
- 1992-05-14 KR KR2019920008256U patent/KR0125862Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0125862Y1 (en) | 1998-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20060522 Year of fee payment: 9 |
|
EXPY | Expiration of term |