KR930024364U - Lead frame fixing device - Google Patents

Lead frame fixing device

Info

Publication number
KR930024364U
KR930024364U KR2019920006199U KR920006199U KR930024364U KR 930024364 U KR930024364 U KR 930024364U KR 2019920006199 U KR2019920006199 U KR 2019920006199U KR 920006199 U KR920006199 U KR 920006199U KR 930024364 U KR930024364 U KR 930024364U
Authority
KR
South Korea
Prior art keywords
fixing device
lead frame
frame fixing
lead
frame
Prior art date
Application number
KR2019920006199U
Other languages
Korean (ko)
Other versions
KR950003777Y1 (en
Inventor
오용영
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR92006199U priority Critical patent/KR950003777Y1/en
Publication of KR930024364U publication Critical patent/KR930024364U/en
Application granted granted Critical
Publication of KR950003777Y1 publication Critical patent/KR950003777Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR92006199U 1992-04-15 1992-04-15 Leadframe fixing apparatus KR950003777Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92006199U KR950003777Y1 (en) 1992-04-15 1992-04-15 Leadframe fixing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92006199U KR950003777Y1 (en) 1992-04-15 1992-04-15 Leadframe fixing apparatus

Publications (2)

Publication Number Publication Date
KR930024364U true KR930024364U (en) 1993-11-27
KR950003777Y1 KR950003777Y1 (en) 1995-05-15

Family

ID=19331753

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92006199U KR950003777Y1 (en) 1992-04-15 1992-04-15 Leadframe fixing apparatus

Country Status (1)

Country Link
KR (1) KR950003777Y1 (en)

Also Published As

Publication number Publication date
KR950003777Y1 (en) 1995-05-15

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050422

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee