KR940001809B1 - 반도체 칩의 테스터 - Google Patents

반도체 칩의 테스터 Download PDF

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Publication number
KR940001809B1
KR940001809B1 KR1019910012274A KR910012274A KR940001809B1 KR 940001809 B1 KR940001809 B1 KR 940001809B1 KR 1019910012274 A KR1019910012274 A KR 1019910012274A KR 910012274 A KR910012274 A KR 910012274A KR 940001809 B1 KR940001809 B1 KR 940001809B1
Authority
KR
South Korea
Prior art keywords
semiconductor chip
tester
probe tip
probe
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019910012274A
Other languages
English (en)
Korean (ko)
Other versions
KR930003311A (ko
Inventor
김정일
고준수
Original Assignee
금성일렉트론 주식회사
문정환
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사, 문정환 filed Critical 금성일렉트론 주식회사
Priority to KR1019910012274A priority Critical patent/KR940001809B1/ko
Priority to TW081105352A priority patent/TW221719B/zh
Priority to JP18660092A priority patent/JP3148370B2/ja
Priority to DE4223658A priority patent/DE4223658B4/de
Publication of KR930003311A publication Critical patent/KR930003311A/ko
Application granted granted Critical
Publication of KR940001809B1 publication Critical patent/KR940001809B1/ko
Priority to US08/272,106 priority patent/US5428298A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
KR1019910012274A 1991-07-18 1991-07-18 반도체 칩의 테스터 Expired - Fee Related KR940001809B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019910012274A KR940001809B1 (ko) 1991-07-18 1991-07-18 반도체 칩의 테스터
TW081105352A TW221719B (enExample) 1991-07-18 1992-07-06
JP18660092A JP3148370B2 (ja) 1991-07-18 1992-07-14 半導体チップテスター
DE4223658A DE4223658B4 (de) 1991-07-18 1992-07-17 Testvorrichtung für Halbleiter-Chips
US08/272,106 US5428298A (en) 1991-07-18 1994-07-07 Probe structure for testing a semiconductor chip and a press member for same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910012274A KR940001809B1 (ko) 1991-07-18 1991-07-18 반도체 칩의 테스터

Publications (2)

Publication Number Publication Date
KR930003311A KR930003311A (ko) 1993-02-24
KR940001809B1 true KR940001809B1 (ko) 1994-03-09

Family

ID=19317441

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910012274A Expired - Fee Related KR940001809B1 (ko) 1991-07-18 1991-07-18 반도체 칩의 테스터

Country Status (5)

Country Link
US (1) US5428298A (enExample)
JP (1) JP3148370B2 (enExample)
KR (1) KR940001809B1 (enExample)
DE (1) DE4223658B4 (enExample)
TW (1) TW221719B (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940001341A (ko) * 1992-06-29 1994-01-11 디. 아이. 캐플란 전자 장치로의 빠른 전기 접근을 위한 순간 접속법
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5876580A (en) * 1996-01-12 1999-03-02 Micromodule Systems Rough electrical contact surface
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US5926029A (en) * 1997-05-27 1999-07-20 International Business Machines Corporation Ultra fine probe contacts
US6137299A (en) * 1997-06-27 2000-10-24 International Business Machines Corporation Method and apparatus for testing integrated circuit chips
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6107812A (en) * 1998-03-05 2000-08-22 International Business Machines Corporation Apparatus and method for testing integrated circuit components of a multi-component card
JP3553791B2 (ja) 1998-04-03 2004-08-11 株式会社ルネサステクノロジ 接続装置およびその製造方法、検査装置並びに半導体素子の製造方法
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
JP4007704B2 (ja) 1998-11-10 2007-11-14 ナブテスコ株式会社 光学的立体造形用の光硬化性樹脂組成物
US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
EP1417499A2 (en) * 2001-08-13 2004-05-12 Honeywell International, Inc. Providing current control over wafer borne semiconductor devices using overlayer patterns
US7700379B2 (en) 2001-08-13 2010-04-20 Finisar Corporation Methods of conducting wafer level burn-in of electronic devices
US8039277B2 (en) 2001-08-13 2011-10-18 Finisar Corporation Providing current control over wafer borne semiconductor devices using overlayer patterns
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US7554347B2 (en) * 2002-03-19 2009-06-30 Georgia Tech Research Corporation High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
KR100864916B1 (ko) 2002-05-23 2008-10-22 캐스케이드 마이크로테크 인코포레이티드 피시험 디바이스를 테스트하기 위한 프로브
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
DE112004002554T5 (de) 2003-12-24 2006-11-23 Cascade Microtech, Inc., Beaverton Active wafer probe
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
WO2006031646A2 (en) 2004-09-13 2006-03-23 Cascade Microtech, Inc. Double sided probing structures
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
WO2006137979A2 (en) 2005-06-13 2006-12-28 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
KR100996924B1 (ko) * 2008-04-21 2010-11-26 윌테크놀러지(주) 프로브 기판 및 이를 포함하는 프로브 카드
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US10680383B2 (en) 2013-03-14 2020-06-09 Apex Technologies, Inc. Linear electrode systems for module attachment with non-uniform axial spacing
US10132452B2 (en) * 2013-03-14 2018-11-20 Apex Technologies, Inc. Suspended track and planar electrode systems and methods
CN108562766B (zh) * 2018-03-15 2025-06-03 昆山精讯电子技术有限公司 芯片测试压接头及其探针机构
US11315652B1 (en) * 2020-11-19 2022-04-26 Winbond Electronics Corp. Semiconductor chip burn-in test with mutli-channel

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD132718A3 (de) * 1977-03-21 1978-10-25 Werner Seewald Nadeltraeger zum pruefen von halbleiterchips
US4443755A (en) * 1981-12-07 1984-04-17 Wooten James F Test apparatus for circuit board racks
US4785137A (en) * 1984-04-30 1988-11-15 Allied Corporation Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
DE3702184A1 (de) * 1986-01-27 1987-07-30 Feinmetall Gmbh Pruefeinrichtung zur wafer-pruefung
US4912399A (en) * 1987-06-09 1990-03-27 Tektronix, Inc. Multiple lead probe for integrated circuits in wafer form
US4804132A (en) * 1987-08-28 1989-02-14 Difrancesco Louis Method for cold bonding
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
JPH075545Y2 (ja) * 1989-01-18 1995-02-08 ティアツク株式会社 光学ヘッド
US5189363A (en) * 1990-09-14 1993-02-23 Ibm Corporation Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester
US5196785A (en) * 1990-12-12 1993-03-23 Hewlett-Packard Company Tape automated bonding test apparatus for thermal, mechanical and electrical coupling
US5087877A (en) * 1991-02-25 1992-02-11 Motorola Inc. Test contact fixture using flexible circuit tape

Also Published As

Publication number Publication date
DE4223658A1 (de) 1993-01-21
JPH05196691A (ja) 1993-08-06
KR930003311A (ko) 1993-02-24
US5428298A (en) 1995-06-27
TW221719B (enExample) 1994-03-11
DE4223658B4 (de) 2005-11-03
JP3148370B2 (ja) 2001-03-19

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