KR930703114A - 점착제 - Google Patents

점착제

Info

Publication number
KR930703114A
KR930703114A KR1019930701654A KR930701654A KR930703114A KR 930703114 A KR930703114 A KR 930703114A KR 1019930701654 A KR1019930701654 A KR 1019930701654A KR 930701654 A KR930701654 A KR 930701654A KR 930703114 A KR930703114 A KR 930703114A
Authority
KR
South Korea
Prior art keywords
group
sensitive adhesive
solvent
pressure
hydroxyl
Prior art date
Application number
KR1019930701654A
Other languages
English (en)
Other versions
KR970001560B1 (ko
Inventor
비. 뮬렌 3세 윌리암
비. 서펠자 안토니
더블유. 펜니시 로버트
Original Assignee
다니엘 케이. 니콜스
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다니엘 케이. 니콜스, 모토로라 인코포레이티드 filed Critical 다니엘 케이. 니콜스
Publication of KR930703114A publication Critical patent/KR930703114A/ko
Application granted granted Critical
Publication of KR970001560B1 publication Critical patent/KR970001560B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

점착제는 전자 부품을 일시적으로 부착시키고 전자 조립품을 납땜하기 위한 용제 특성을 제공하기 위해 제공 되었다. 점착제는 용제 및 점착성 부여제를 포함한다. 용제는 하기 일반식(I)의 하나 이상의 카복실산을 함유한다. 점착성 부여제는 하나 이상의 알콜, 방향족 탄화수소 용매, 지방족 탄화수소 용매 또는 중합체를 포함한다. 점착제를 인쇄 배선 회로판 또는 또 다른 기재에 침착시킨 다음 전자 부품을 침착된 점착제 위애 위치시켜 납땜한다. 땜납이 환류하는 동안, 용제는 납땜 공정시 용제작용을 하며 점착성 부여제는 휘발하여 인쇄 배선 회로판에 잔사가 거의 남지 않게 된다.
상기식에서, R은 C1내지 Ce의 알킬 그룹이고, R′는 수소 및 하이드록실로 이루어진 그룹으로부터 선택되며, R″는 수소, 하이드록실 및 키복실로 이루어진 그룹으로부터 선택된다.

Description

점착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (11)

  1. 필수적으로 주위온도 내지 300˚C에서 증발하거나 분해하는 특성을 갖는 땜납 용제로서 작용하기에 유효한양의 카복실산 화합물과 카복실산 화합물의 점성 용액(여기서, 점성용액의 점도는 20내지 약 1500cps이다)또는 현탁액을 형성시키기에 적합한 하나 이상의 하이드록실 그룹을 갖는 알콜농조화제(여기서, 알콜 농조화제는 주위온도 내지 300˚C에서 증발하거나 분해하여 일시적인 용매로서 작용한다) 하나 이상으로 이루어진 땜납 용제로서 작용하며 전자 부품을 일시적으로 고정시키기에 적합한 점착제.
  2. 제1항에 있어서, 폴리이소부틸렌, 폴리아크릴레이트, α―치환된 폴리에스테르, 폴리테르펜 및 유기 카보네이트로 이루어진 그룹으로 부터 선택된 하나 이상의 물질을 추가로 포함하는 점착제.
  3. 제1항에 있어서, 융점이 약 45내지 약 260˚C이며 전기적으로 비전도성인 캠슐형 물질을 추가로 포함하는 점착제.
  4. 제1항에 있어서, 폴리에스테르, 폴리아크릴레이트 및 디엔 수지로 이루어진 그룹으로부터 선택된 광분해성 중합체를 추가로 포함하는 점착제.
  5. 필수적으로 하기 일반식(I)의 디카복실산 화합물로 이루어진 용체(여기서, 디카복실산의 비율은 점착제의 약 0.1내지 약 10중량%의 범위이다)와 일반식 R-OH 또는 HO-R-OH의 알콜(여기서, R은 C1내지 C12의 알킬 그룹이거나 방향족 그룹이다) ; 폴리이소부틸렌, 폴리아크릴레이트, α-치환된 폴리에스테르, 폴리테르펜 및 유기 카보네이트로 이루어진 그룹으로부터 선택된 물질; 방향족 탄화수소 용매 및 지방족 탄화수소 용매로 이루어진 그룹으로부터 선택된 하나 이상의 물질을 포함하는 디카복실산의 점성 용액 또는 현탁액을 형성시키기에 적합한 점착성 부여제로 이루어진 땜납 용제로서 작용하고 일시적으로 부품을 부착시키는데 사용하기 위한 점착제.
    상기식에서, R은 C1내지 C6의 그룹이며, R´는 수소 및 하이드록실로 이루어진 그룹으로부터 선택되고, R˝는 수소, 하이드록실 및 카복실로 이루어진 그룹으로부터 선택된다.
  6. 제5항에 있어서, 카복실산 화합물이 말산을 포함하는 점착제.
  7. 제5항에 있어서, 카르나우바 왁스를 추카로 포함하는 점착제.
  8. 제5항에 있어서, 광분해성 중합체를 추가로 포함하는 점착제.
  9. 말산(여기서, 말산의 비율은 점착제의 약 0.1내지 약 10중량%의 범위이다) ; 폴리이소부틸렌, 폴리아크릴레이트, α-치환된 폴리에스테르, 폴리테르펜 및 유기 카보네이트로 이루어진 그룹으로부터 선택된 농조화제 및 말산 및 농조화제의 점성 액 및 현탄액(여기서, 점성 용액 또는 현탁액의 점도는 약 20내지 약 1500cps이다)을 형성시키기에 적합한 용매(여기서, 용매는 전자 조립품을 납땜하는 동안 증발된다)를 포함하는 전자 조립품 납땜용 점착제.
  10. 제9항에 있어서, 유기 화합물이 일반식 R-OH의 알콜(여기서, R은 C1내지 C12의 알킬 그룹이거나 방향족 그룹이다)인 점착제.
  11. 제9항에 있어서, 폴리에스테르, 폴리아크릴레이트 카보네이트 중합체, 유기 카보네이트 및 디엔 수지로 이루어진 그룹으로부터 선택된 광분해성 중합체를 추가로 포함하는 점착제.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930701654A 1990-12-03 1991-11-15 점착제 KR970001560B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US07/622,027 1990-12-03
US07/622,027 US5177134A (en) 1990-12-03 1990-12-03 Tacking agent
US7/622,027 1990-12-03
PCT/US1991/008567 WO1992009400A1 (en) 1990-12-03 1991-11-15 Tacking agent

Publications (2)

Publication Number Publication Date
KR930703114A true KR930703114A (ko) 1993-11-29
KR970001560B1 KR970001560B1 (ko) 1997-02-11

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ID=24492643

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Application Number Title Priority Date Filing Date
KR1019930701654A KR970001560B1 (ko) 1990-12-03 1991-11-15 점착제

Country Status (7)

Country Link
US (1) US5177134A (ko)
EP (1) EP0560861B1 (ko)
JP (1) JP2694385B2 (ko)
KR (1) KR970001560B1 (ko)
AU (1) AU9050291A (ko)
DE (1) DE69129589T2 (ko)
WO (1) WO1992009400A1 (ko)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3923023A1 (de) * 1989-07-12 1991-01-24 Siemens Ag Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren
US5435481A (en) * 1994-01-18 1995-07-25 Motorola, Inc. Soldering process
US5674326A (en) * 1994-09-21 1997-10-07 Motorola, Inc. Solder paste
US5499756A (en) * 1995-02-03 1996-03-19 Motorola, Inc. Method of applying a tacking agent to a printed circuit board
JP3104606B2 (ja) 1995-03-24 2000-10-30 株式会社デンソー 基板と被接続材との接続方法及びその接続構造及びその接続用補助材料
DE19511898C2 (de) * 1995-03-31 1999-09-23 Fraunhofer Ges Forschung Verfahren zur Verbindung von Kontaktflächen eines elektronischen Bauelements und eines Substrats
US5686226A (en) * 1995-08-03 1997-11-11 Motorola, Inc. Method of forming an applicator for applying tacking media to a circuit substrate
US5704116A (en) * 1996-05-03 1998-01-06 Motorola, Inc. Method of holding a component using an anhydride fluxing agent
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
US5985043A (en) * 1997-07-21 1999-11-16 Miguel Albert Capote Polymerizable fluxing agents and fluxing adhesive compositions therefrom
US6017634A (en) * 1997-07-21 2000-01-25 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive
US5985456A (en) * 1997-07-21 1999-11-16 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits
JPH11121915A (ja) * 1997-10-08 1999-04-30 Tdk Corp 電子部品の実装方法及び電子部品実装用フラックス
US6410627B1 (en) 1999-04-09 2002-06-25 National Starch And Chemical Investment Holding Corporation Use of high hydroxyl compounds for water sensitive hot melt adhesives
ES2154593B1 (es) * 1999-06-08 2001-10-16 Mecanismos Aux Es Ind S L Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.
JP3649087B2 (ja) * 1999-07-28 2005-05-18 株式会社デンソー 熱可塑性樹脂材料の接着方法および接着構造体
US6610559B2 (en) 2001-11-16 2003-08-26 Indium Corporation Of America Integrated void-free process for assembling a solder bumped chip
US20030196752A1 (en) * 2002-04-17 2003-10-23 Freund Joseph Michael Epoxy tacking for optoelectronic device placement
US7740713B2 (en) * 2004-04-28 2010-06-22 International Business Machines Corporation Flux composition and techniques for use thereof
US20090294515A1 (en) * 2008-05-30 2009-12-03 Prack Edward R Mounting integrated circuit components on substrates
WO2012019092A1 (en) * 2010-08-06 2012-02-09 Promerus Llc Polymer composition for microelectronic assembly
US8535454B2 (en) * 2010-11-23 2013-09-17 Promerus, Llc Polymer composition for microelectronic assembly
US9579738B2 (en) 2011-02-25 2017-02-28 International Business Machines Corporation Flux composition and techniques for use thereof
US9815149B2 (en) 2011-02-25 2017-11-14 International Business Machines Corporation Flux composition and techniques for use thereof
JP5969018B2 (ja) * 2011-06-15 2016-08-10 プロメラス， エルエルシー 熱活性化塩基発生剤を包含する熱分解性ポリマー組成物
EA027655B1 (ru) 2011-07-04 2017-08-31 Сэн-Гобэн Гласс Франс Способ изготовления оконного стекла с электрическим присоединительным элементом
US9505948B2 (en) 2012-12-17 2016-11-29 Promerus, Llc Thermally decomposable polymer compositions for forming microelectronic assemblies
CN105143387B (zh) * 2013-09-10 2017-05-24 Lg化学株式会社 包含聚碳酸亚烃酯的树脂组合物及由此生产的自粘膜
JP6374298B2 (ja) 2014-10-31 2018-08-15 千住金属工業株式会社 フラックス及びフラックスを用いた接合方法
JP6264705B2 (ja) * 2015-06-24 2018-01-24 リンテック株式会社 粘着剤及び粘着シート
WO2019170211A1 (de) 2018-03-05 2019-09-12 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung einer sandwichanordnung
EP3762171B1 (de) 2018-03-05 2023-06-21 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung einer sandwichanordnung
WO2019170212A1 (de) 2018-03-05 2019-09-12 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung einer sandwichanordnung
US11824037B2 (en) 2020-12-31 2023-11-21 International Business Machines Corporation Assembly of a chip to a substrate
US11545444B2 (en) 2020-12-31 2023-01-03 International Business Machines Corporation Mitigating cooldown peeling stress during chip package assembly

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4269870A (en) * 1974-05-13 1981-05-26 Cooper Industries, Inc. Solder flux and method
US4071489A (en) * 1976-03-08 1978-01-31 Rohm And Haas Company Coating compositions from dicyclopentenyl acrylate and/or methacrylate
US4261872A (en) * 1977-03-28 1981-04-14 Rohm And Haas Company Autoxidizable compositions
US4145503A (en) * 1977-03-28 1979-03-20 Rohm And Haas Company Autoxidizable compositions
US4216035A (en) * 1977-12-23 1980-08-05 International Business Machines Corporation Removable protective coating and process of using same
DE3205315A1 (de) * 1982-02-15 1983-08-25 Siemens AG, 1000 Berlin und 8000 München Flussmittel zur verwendung beim weichloeten
US4557767A (en) * 1983-10-31 1985-12-10 Scm Corporation Fusible powdered metal paste
SE457335B (sv) * 1984-07-20 1988-12-19 Ytkemiska Inst Flussmedel foer mjukloedning samt foerfarande foer mjukloedning med anvaendning av flussmedlet
US4619715A (en) * 1984-09-11 1986-10-28 Scm Corporation Fusible powdered metal paste
US4720324A (en) * 1985-10-03 1988-01-19 Hayward John S Process for manufacturing printed circuit boards
JPS62267354A (ja) * 1986-05-15 1987-11-20 Mitsubishi Plastics Ind Ltd シ−トモ−ルデイングコンパウンド用樹脂組成物
DE3806738C1 (ko) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
KR930006435B1 (ko) * 1989-04-11 1993-07-16 휴우즈 에어크라프트 캄파니 금속 표면을 보호하고 납땜성을 향상시키는 방법 및 조성물
JP2503099B2 (ja) * 1989-08-08 1996-06-05 日本電装株式会社 はんだ付け用フラックス
US4995921A (en) * 1990-05-11 1991-02-26 Motorola, Inc. Solder pastes using alcohol blends as rheological aids

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JP2694385B2 (ja) 1997-12-24
KR970001560B1 (ko) 1997-02-11
EP0560861A4 (ko) 1994-01-19
EP0560861A1 (en) 1993-09-22
DE69129589D1 (de) 1998-07-16
DE69129589T2 (de) 1998-12-03
JPH06503039A (ja) 1994-04-07
US5177134A (en) 1993-01-05
WO1992009400A1 (en) 1992-06-11
EP0560861B1 (en) 1998-06-10
AU9050291A (en) 1992-06-25

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