KR930026525U - 반도체 패키지용 리드프레임 - Google Patents

반도체 패키지용 리드프레임

Info

Publication number
KR930026525U
KR930026525U KR2019920008257U KR920008257U KR930026525U KR 930026525 U KR930026525 U KR 930026525U KR 2019920008257 U KR2019920008257 U KR 2019920008257U KR 920008257 U KR920008257 U KR 920008257U KR 930026525 U KR930026525 U KR 930026525U
Authority
KR
South Korea
Prior art keywords
lead frame
semiconductor package
package
semiconductor
lead
Prior art date
Application number
KR2019920008257U
Other languages
English (en)
Other versions
KR950006442Y1 (ko
Inventor
김진성
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR92008257U priority Critical patent/KR950006442Y1/ko
Publication of KR930026525U publication Critical patent/KR930026525U/ko
Application granted granted Critical
Publication of KR950006442Y1 publication Critical patent/KR950006442Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
KR92008257U 1992-05-14 1992-05-14 반도체 패키지용 리드프레임 KR950006442Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92008257U KR950006442Y1 (ko) 1992-05-14 1992-05-14 반도체 패키지용 리드프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92008257U KR950006442Y1 (ko) 1992-05-14 1992-05-14 반도체 패키지용 리드프레임

Publications (2)

Publication Number Publication Date
KR930026525U true KR930026525U (ko) 1993-12-28
KR950006442Y1 KR950006442Y1 (ko) 1995-08-10

Family

ID=19333146

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92008257U KR950006442Y1 (ko) 1992-05-14 1992-05-14 반도체 패키지용 리드프레임

Country Status (1)

Country Link
KR (1) KR950006442Y1 (ko)

Also Published As

Publication number Publication date
KR950006442Y1 (ko) 1995-08-10

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E701 Decision to grant or registration of patent right
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