KR930020628A - 집적 회로 이송 매체용 개별 건조제 - Google Patents

집적 회로 이송 매체용 개별 건조제 Download PDF

Info

Publication number
KR930020628A
KR930020628A KR1019930004135A KR930004135A KR930020628A KR 930020628 A KR930020628 A KR 930020628A KR 1019930004135 A KR1019930004135 A KR 1019930004135A KR 930004135 A KR930004135 A KR 930004135A KR 930020628 A KR930020628 A KR 930020628A
Authority
KR
South Korea
Prior art keywords
rail
length
desiccant
extending
housed inside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019930004135A
Other languages
English (en)
Korean (ko)
Inventor
데이빗 게르케 로버트
무어 스토버 메리
Original Assignee
빈센트 비. 인그라시아
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈센트 비. 인그라시아, 모토로라 인코포레이티드 filed Critical 빈센트 비. 인그라시아
Publication of KR930020628A publication Critical patent/KR930020628A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
KR1019930004135A 1992-03-31 1993-03-18 집적 회로 이송 매체용 개별 건조제 Withdrawn KR930020628A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86087092A 1992-03-31 1992-03-31
US860,870 1992-03-31

Publications (1)

Publication Number Publication Date
KR930020628A true KR930020628A (ko) 1993-10-20

Family

ID=25334237

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930004135A Withdrawn KR930020628A (ko) 1992-03-31 1993-03-18 집적 회로 이송 매체용 개별 건조제

Country Status (4)

Country Link
EP (1) EP0563629A1 (forum.php)
JP (1) JPH0648463A (forum.php)
KR (1) KR930020628A (forum.php)
TW (1) TW222342B (forum.php)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6861289B2 (en) * 2002-07-25 2005-03-01 Delphi Technologies, Inc. Moisture-sensitive device protection system
WO2011134030A2 (pt) 2010-04-26 2011-11-03 Whirlpool S.A. Sistema de refrigeração de um refrigerador e sistema de aspiração para um fluido compressor
JP2012084751A (ja) * 2010-10-13 2012-04-26 Murata Mfg Co Ltd 電子部品収納テープ
JP5541093B2 (ja) * 2010-10-14 2014-07-09 株式会社村田製作所 電子部品実装装置及び電子部品実装方法
US8337219B2 (en) 2011-02-19 2012-12-25 Laird Technologies, Inc. Card guide grounding strips
JP2022504968A (ja) 2018-10-18 2022-01-13 シーエスピー テクノロジーズ，インコーポレイティド リール上の吸湿剤連行ポリマーを有するテープを用いて電子部品を包装する装置および方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939014A (en) * 1987-12-16 1990-07-03 Ford Motor Company Composite polymer/desiccant coatings for IC encapsulation
JPH0219271A (ja) * 1988-07-06 1990-01-23 Toshiba Corp 半導体装置用テーピング部品

Also Published As

Publication number Publication date
EP0563629A1 (en) 1993-10-06
JPH0648463A (ja) 1994-02-22
TW222342B (forum.php) 1994-04-11

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19930318

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid