KR930009314B1 - 열전도성 복합재 - Google Patents

열전도성 복합재 Download PDF

Info

Publication number
KR930009314B1
KR930009314B1 KR1019900009277A KR900009277A KR930009314B1 KR 930009314 B1 KR930009314 B1 KR 930009314B1 KR 1019900009277 A KR1019900009277 A KR 1019900009277A KR 900009277 A KR900009277 A KR 900009277A KR 930009314 B1 KR930009314 B1 KR 930009314B1
Authority
KR
South Korea
Prior art keywords
thermally conductive
thermally
sheet
conductive composite
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019900009277A
Other languages
English (en)
Korean (ko)
Other versions
KR910011448A (ko
Inventor
야수유키 나까무라
켄지 히라노
Original Assignee
스미토모 토크슈 킨조크 가부시기가이샤
아오야기 테쓰오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 토크슈 킨조크 가부시기가이샤, 아오야기 테쓰오 filed Critical 스미토모 토크슈 킨조크 가부시기가이샤
Publication of KR910011448A publication Critical patent/KR910011448A/ko
Application granted granted Critical
Publication of KR930009314B1 publication Critical patent/KR930009314B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/931—Components of differing electric conductivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Resistance Heating (AREA)
  • Laminated Bodies (AREA)
KR1019900009277A 1989-12-12 1990-06-20 열전도성 복합재 Expired - Fee Related KR930009314B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1-323283 1989-12-12
JP32328389 1989-12-12
JP323283 1989-12-12

Publications (2)

Publication Number Publication Date
KR910011448A KR910011448A (ko) 1991-08-07
KR930009314B1 true KR930009314B1 (ko) 1993-09-27

Family

ID=18153060

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900009277A Expired - Fee Related KR930009314B1 (ko) 1989-12-12 1990-06-20 열전도성 복합재

Country Status (5)

Country Link
US (1) US5106433A (enExample)
EP (2) EP0634794B1 (enExample)
KR (1) KR930009314B1 (enExample)
AT (2) ATE142371T1 (enExample)
DE (2) DE69028378T2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100217422B1 (ko) * 1996-12-19 1999-09-01 윤종용 교환기의 데이터 베이스 생성 방법
KR100217424B1 (ko) * 1996-12-23 1999-09-01 윤종용 사설교환기와 외부 장치간의 정합 방법

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0509860B1 (fr) * 1991-03-27 1996-06-05 Seb S.A. Article constitué à partir d'une plaque réalisée en un métal relativement mou et récipient culinaire constituant un tel article
EP0537965B1 (en) * 1991-10-12 1997-03-05 Sumitomo Special Metals Company Limited Process of manufacturing a heat-conductive material
US5156923A (en) * 1992-01-06 1992-10-20 Texas Instruments Incorporated Heat-transferring circuit substrate with limited thermal expansion and method for making
US5480496A (en) * 1994-03-29 1996-01-02 Reynolds Metals Company Method of making twin roll cast clad material using drag cast liner stock and article produced thereby
JPH09312361A (ja) * 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
JP2907186B2 (ja) * 1997-05-19 1999-06-21 日本電気株式会社 半導体装置、その製造方法
US6129993A (en) * 1998-02-13 2000-10-10 Hitachi Metals, Ltd. Heat spreader and method of making the same
US6326685B1 (en) * 1998-05-04 2001-12-04 Agere Systems Guardian Corp. Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix
JP4030200B2 (ja) * 1998-09-17 2008-01-09 株式会社ルネサステクノロジ 半導体パッケージおよびその製造方法
US6221507B1 (en) * 1999-04-06 2001-04-24 Lockhart Industries High temperature laminated structural panels and method of producing the same
ATE281303T1 (de) 2000-01-26 2004-11-15 Nippon Metal Ind Verfahren zur herstellung eines metallbleches mit einer feinen verbundstruktur, und hergestelltes metallblech
US6647310B1 (en) * 2000-05-30 2003-11-11 Advanced Micro Devices, Inc. Temperature control of an integrated circuit
US6786233B1 (en) * 2001-02-23 2004-09-07 Schwing America, Inc. Boom utilizing composite material construction
EP1406298A1 (en) * 2002-10-03 2004-04-07 Kabushiki Kaisha Toyota Jidoshokki Semiconductor module and plate-shaped lead
US7527090B2 (en) * 2003-06-30 2009-05-05 Intel Corporation Heat dissipating device with preselected designed interface for thermal interface materials
CN100435324C (zh) * 2004-12-20 2008-11-19 半导体元件工业有限责任公司 具有增强散热性的半导体封装结构
CA2609252C (en) * 2005-05-23 2012-01-10 Neomax Materials Co., Ltd. Cu-mo substrate and method for producing same
US7960032B2 (en) * 2005-05-24 2011-06-14 Demers Joseph R High thermal conductivity, high yield strength, metal composite and method
US10611124B2 (en) * 2015-10-06 2020-04-07 Fourté International SDN. BHD Multiple layered alloy/non alloy clad materials and methods of manufacture
JP6458759B2 (ja) * 2016-03-31 2019-01-30 日立金属株式会社 応力緩和構造体及び熱電変換モジュール
JP6455896B1 (ja) 2017-11-18 2019-01-23 Jfe精密株式会社 放熱板及びその製造方法
CN112776432A (zh) * 2019-11-05 2021-05-11 宝武特种冶金有限公司 一种低膨胀高导热复合金属材料、其制备方法及应用
CN111849428B (zh) * 2020-06-18 2021-11-05 上海大陆天瑞激光表面工程有限公司 一种热界面材料
CN121311050A (zh) * 2021-05-06 2026-01-09 苏州锝耀电子有限公司 双向tvs半导体器件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4025997A (en) * 1975-12-23 1977-05-31 International Telephone & Telegraph Corporation Ceramic mounting and heat sink device
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
JPS6027151A (ja) * 1983-07-25 1985-02-12 Sumitomo Electric Ind Ltd 半導体素子搭載用複合金属条
US4811166A (en) * 1986-07-02 1989-03-07 Texas Instruments Incorporated Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member
JPH02231751A (ja) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd リードフレーム用材料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100217422B1 (ko) * 1996-12-19 1999-09-01 윤종용 교환기의 데이터 베이스 생성 방법
KR100217424B1 (ko) * 1996-12-23 1999-09-01 윤종용 사설교환기와 외부 장치간의 정합 방법

Also Published As

Publication number Publication date
EP0634794A3 (enExample) 1995-02-15
ATE182720T1 (de) 1999-08-15
US5106433A (en) 1992-04-21
EP0432867B1 (en) 1996-09-04
DE69033226D1 (de) 1999-09-02
DE69028378D1 (de) 1996-10-10
KR910011448A (ko) 1991-08-07
EP0634794B1 (en) 1999-07-28
EP0432867A2 (en) 1991-06-19
DE69028378T2 (de) 1997-03-06
ATE142371T1 (de) 1996-09-15
EP0432867A3 (en) 1991-08-21
EP0634794A2 (en) 1995-01-18
DE69033226T2 (de) 2000-02-17

Similar Documents

Publication Publication Date Title
KR930009314B1 (ko) 열전도성 복합재
US5844310A (en) Heat spreader semiconductor device with heat spreader and method for producing same
EP0537965B1 (en) Process of manufacturing a heat-conductive material
US5633528A (en) Lead frame structure for IC devices with strengthened encapsulation adhesion
EP1909321B1 (en) Metal-ceramic composite substrate and method for manufacturing same
US20130134572A1 (en) Semiconductor device including cladded base plate
US5300809A (en) Heat-conductive composite material
US6045927A (en) Composite material for electronic part and method of producing same
EP1770773A2 (en) Heat spreader module and method of manufacturing same
JPH0313331A (ja) 熱膨張係数及び熱伝導率可変複合材料
JPH09266280A (ja) 半導体素子実装用リードフレーム
JP2006516361A (ja) 非セラミック系窓枠を有する半導体パッケージ
US7083759B2 (en) Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
JP3462308B2 (ja) 熱伝導複合材料の製造方法
JP2005064441A (ja) 半導体装置
EP1231633A1 (en) Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same
JPH03227621A (ja) 熱伝導複合材料
JP2602161B2 (ja) 高放熱性集積回路パッケージ
JPH03218031A (ja) 半導体集積回路装置およびそれに用いられるプリフォーム接合材
JPH05109947A (ja) 熱伝導材料とその製造方法
JPH0924500A (ja) 熱伝導複合材料の製造方法
JP3037485B2 (ja) 熱伝導材料とその製造方法
JPH0575008A (ja) 熱伝導材料とその製造方法
JP2675077B2 (ja) 半導体装置用リードフレーム
JPH09232485A (ja) 電子部品用複合材料およびその製造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

FPAY Annual fee payment

Payment date: 20080925

Year of fee payment: 16

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20090928

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20090928

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000