KR920020600A - Planarization method of semiconductor device - Google Patents
Planarization method of semiconductor device Download PDFInfo
- Publication number
- KR920020600A KR920020600A KR1019910005716A KR910005716A KR920020600A KR 920020600 A KR920020600 A KR 920020600A KR 1019910005716 A KR1019910005716 A KR 1019910005716A KR 910005716 A KR910005716 A KR 910005716A KR 920020600 A KR920020600 A KR 920020600A
- Authority
- KR
- South Korea
- Prior art keywords
- oxide film
- semiconductor device
- etched
- upper portion
- silicon substrate
- Prior art date
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- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 본 발명에 의한 평탄화 공정 단면도.2 is a cross-sectional view of the planarization process according to the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910005716A KR920020600A (en) | 1991-04-10 | 1991-04-10 | Planarization method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910005716A KR920020600A (en) | 1991-04-10 | 1991-04-10 | Planarization method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR920020600A true KR920020600A (en) | 1992-11-21 |
Family
ID=67400347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910005716A KR920020600A (en) | 1991-04-10 | 1991-04-10 | Planarization method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR920020600A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100458700B1 (en) * | 2000-12-29 | 2004-12-03 | 어플라이드 머티어리얼즈 인코포레이티드 | Method for monitoring thickness change in a film on substrate |
US7037403B1 (en) | 1992-12-28 | 2006-05-02 | Applied Materials Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
KR100665655B1 (en) * | 2004-11-09 | 2007-01-10 | 동부일렉트로닉스 주식회사 | Method for manufacturing Semiconductor device |
-
1991
- 1991-04-10 KR KR1019910005716A patent/KR920020600A/en not_active Application Discontinuation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7037403B1 (en) | 1992-12-28 | 2006-05-02 | Applied Materials Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
US7569119B2 (en) | 1992-12-28 | 2009-08-04 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
US7582183B2 (en) | 1992-12-28 | 2009-09-01 | Applied Materials, Inc. | Apparatus for detection of thin films during chemical/mechanical polishing planarization |
KR100458700B1 (en) * | 2000-12-29 | 2004-12-03 | 어플라이드 머티어리얼즈 인코포레이티드 | Method for monitoring thickness change in a film on substrate |
KR100665655B1 (en) * | 2004-11-09 | 2007-01-10 | 동부일렉트로닉스 주식회사 | Method for manufacturing Semiconductor device |
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WITN | Withdrawal due to no request for examination |