KR920012269A - Thermosetting Epoxy Resin Composition - Google Patents

Abstract

No content

Description

Thermosetting Epoxy Resin Composition

Since this is an open matter, no full text was included.

1 is an apparatus diagram for measuring sedimentation by the main sedimentation method.

Claims (9)

A mixture consisting of organic additives such as bisphenol A epoxy resin, pre-reactant of dibromo glycidyl ether and polybutadiene, epoxy reactive diluent and polyester-modified polyurethane-based dispersant, crystalline silica, antimony oxide and aluminum hydroxide A two-component thermosetting epoxy resin composition for a high voltage electric component, comprising a main body composed of a composite filler including a curing accelerator and an acid anhydride-based filler. The thermosetting epoxy resin composition according to claim 1, wherein the bisphenol A epoxy resin has an epoxy equivalent of 180 to 210, and the compounding amount thereof is 20 to 40% by weight of the total main components. The dibromo glycidyl ether of the prereactant is an epoxy equivalent of 300-400, a Br content of 35-55%, the polybutadiene has a molecular weight of about 1,600-4,000, and Thermosetting epoxy resin composition, characterized in that the compounding amount is 2 to 20% by weight of the total main ingredient. The thermosetting epoxy resin composition according to claim 1 or 3, wherein the pre-reactant is composed of 50-85 wt% dibromo glycidyl ether and 15-50 wt% polybutadiene. The thermosetting epoxy resin composition according to claim 1, wherein the epoxy-based reactive diluent has one or more epoxy functional groups and an epoxy equivalent of about 100 to 300, and a compounding amount thereof is 1 to 10% by weight of the total main ingredient. The thermosetting epoxy resin composition according to claim 1, wherein the polyester-modified polyurethane-based wet dispersant is added with 30 to 50% by weight of the total organic additive. Wherein Rn is a polyester-modified polyurethane, R ₁ is a halogen substituent as C ₁ -C ₆ alkyl, R ₂ is a hydroxy or halogen substituent as C ₁ -C ₆ alkyl, and R ₃ is C Alkyl, alkylene, aromatic or heterocyclic compounds of _{12 to} C ₃₀ are hydroxy or halogen substituents. The composite filler according to claim 1, wherein the composite filler has an average particle size of 0.5 to 20 µm of each component, 10 to 60 wt% of crystalline silica, 1 to 20 wt% of antimony oxide, and 30 to 80 wt% of hydroxide. It consists of aluminum, and the compounding quantity is 40 to 80 weight% of all the main components, The thermosetting epoxy resin composition characterized by the above-mentioned. The method of claim 1, wherein the curing agent is a liquid methyltetra hydro phthalic anhydride, methylhexahydro phthalic anhydride or methyl cyclopentadiene phthalic anhydride at room temperature, the compounding amount is 1 equivalent of epoxy in the main component A thermosetting epoxy resin composition comprising an acid anhydride in an amount of 0.7 to 1.3 equivalents. The thermosetting epoxy resin according to claim 1, wherein the curing accelerator is a tertiary amine compound, an imidazole compound, or a BF ₃ -complex salt compound, and the compounding amount is 0.5 to 1.0 wt% based on the acid anhydride used as the curing agent. Resin composition ※ Note: The disclosure is based on the initial application.