KR910012059A - Thermosetting Epoxy Resin Compositions for High Voltage Electrical Components - Google Patents

Thermosetting Epoxy Resin Compositions for High Voltage Electrical Components Download PDF

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KR910012059A
KR910012059A KR1019890020577A KR890020577A KR910012059A KR 910012059 A KR910012059 A KR 910012059A KR 1019890020577 A KR1019890020577 A KR 1019890020577A KR 890020577 A KR890020577 A KR 890020577A KR 910012059 A KR910012059 A KR 910012059A
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South Korea
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weight
component
epoxy resin
high voltage
resin composition
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KR1019890020577A
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Korean (ko)
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육문수
김세경
유창준
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김충세
고려화학 주식회사
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Priority to KR1019890020577A priority Critical patent/KR910012059A/en
Publication of KR910012059A publication Critical patent/KR910012059A/en

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음No content

Description

고전압 전기 부품용 열경화성 에폭시 수지 조성물Thermosetting Epoxy Resin Compositions for High Voltage Electrical Components

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (9)

(a) 비스 페놀 A형 에폭시 수지, (b) 디 브로모 글리시딜 에테르와 (c) 폴리 부타디엔의 2성분계 예비 반응물 및 (d) 에폭시계 반응성 희석제의 혼합물에 (e) 수산화 알루미늄, (f) 결정성 실리카 및 (g) 산화 안티몬의 복합충진제로 배합하는 주제에 (h) 경화 촉진제 및 (i) 산무수물계 경화제로 구성되는 것을 특징으로 하는 2액형 고전압 전기 부품용 열경화성 에폭시 수지 조성물.(e) aluminum hydroxide, (f) in a mixture of (a) a bisphenol A epoxy resin, (b) a bicomponent pre-reactant of dibromo glycidyl ether and (c) a polybutadiene, and (d) an epoxy-based reactive diluent A thermosetting epoxy resin composition for two-component high voltage electrical parts, comprising: (h) a curing accelerator and (i) an acid anhydride-based curing agent in a subject blended with a composite filler of crystalline silica and (g) antimony oxide. 제1항에 있어서, (a) 비스 페놀 A형 에폭시 수지는 에폿시 당량이 180~210범위의 것으로 그 배합량이 주제성분의 20~30중량%인 것을 특징으로 하는 2액형 고전압 전기 부품용 열경화성 에폭시 수지 조성물.2. The thermosetting epoxy for two-component high voltage electrical component according to claim 1, wherein the bisphenol A epoxy resin has an epoxy equivalent in the range of 180 to 210, and its blending amount is 20 to 30% by weight of the main component. Resin composition. 제1항에 있어서, (b) 디 브로모 글리시딜 에테르는 구조식(Ⅰ) 또는 (Ⅱ)로서, 에폭시 당량이 300~400, Br 함량이 35~55%범위의 것이고, (c) 폴리 부타디엔은 구조식(Ⅲ)으로서, 분자량이 1600~4,000범위의 것으로, (b)와 (c)의 2성분계 예비 반응물 의 배합량은 주제 성분의 7~10중량%인 것을 특징으로 하는 2액형 고전압 전기 부품용 열경화성 에폭시 수지 조성물.The dibromo glycidyl ether according to claim 1, wherein the dibromo glycidyl ether is represented by the formula (I) or (II), having an epoxy equivalent in the range of 300 to 400, Br content in the range of 35 to 55%, and (c) polybutadiene Is a structural formula (III), the molecular weight is in the range of 1600 to 4,000, the compounding quantity of the two-component pre-reactant of (b) and (c) is 7 to 10% by weight of the main component for two-component high-voltage electrical parts Thermosetting epoxy resin composition. 디 브로모 페닐글리시딜 에테르 (여기서, R1=-H, -CH3,일수 있다.)Dibromo phenylglycidyl ether, wherein R 1 = -H, -CH 3 , Can be.) 폴리 부타디엔Polybutadiene (여기서 n=0~1, m~7, z=0~10, x,y=0~5이고, R2=-COOH, -OH, -NCO, -NH2또는 -SH이며, R3=-COOH 또는 -CH=CH2일수 있다.)(Where n = 0-1, m-7, z = 0-10, x, y = 0-5, R 2 = -COOH, -OH, -NCO, -NH 2 or -SH, R 3 = May be -COOH or -CH = CH 2. ) 제1항 또는 제3항에 있어서, 상기 (b) 디브로모 글리시딜 에테르가 상기 2성분계 예비반응물의 50~85중량%이며, (c) 폴리 부타디엔이 상기 2성분계 예비 반응물의 15~50중량%로 구성되는 것을 특징으로 하는 2액형 고전압 전기 부품용 열경화성 에폭시 수지 조성물.The method according to claim 1 or 3, wherein (b) dibromo glycidyl ether is 50 to 85% by weight of the bicomponent prereactant, and (c) polybutadiene is 15 to 50 of the bicomponent preliminary reactant. A thermosetting epoxy resin composition for two-component high voltage electrical parts, characterized in that it comprises by weight percent. 제1항에 있어서, 상기 (d)에폭시계 반응성 희석제는 에폭시 관능기가 1개이상으로 에폭시 당량이 100~300범위의 것으로 그 배합량이 주제성분의 1~5중량%인 것을 특징으로 하는 2액형 고전압 전기 부품용 열경화성 에폭시 수지 조성물.The two-component high voltage according to claim 1, wherein the (d) epoch-reactive diluent has one or more epoxy functional groups and an epoxy equivalent in the range of 100 to 300, with a compounding amount of 1 to 5% by weight of the main component. Thermosetting epoxy resin composition for electrical parts. 제1항에 있어서, (e) 수산화 알루미늄, (f)결정성 실리카, (g) 산화 안티몬의 복합충진제는 각각 평균입자 크기가 0.5~20㎛범위의 것으로 그 배합량은 수산화 알루미늄이 주제성분의 20~50중량%, 결정성 실리카가 주제성분의 10~40중량%, 산화 안티몬이 주제성분의 3~5중량%로 구성되는 것을 특징으로 하는 2액형 고전압The composite filler of (e) aluminum hydroxide, (f) crystalline silica, and (g) antimony oxide, respectively, wherein the average particle size is in the range of 0.5-20 µm. ~ 50% by weight, crystalline silica is 10-40% by weight of the main component, antimony oxide is composed of 3 to 5% by weight of the main component, two-component high voltage 제1항 또는 제6항에 있어서, (e) (f) (g) 의 복합 충진제의 배합비가 주제성분의 40~70중량%인 것을 특징으로 하는 2액형 고전압 전기 부품용 열경화성 에폭시 수지 조성물.The thermosetting epoxy resin composition for two-component high voltage electric parts according to claim 1 or 6, wherein the blending ratio of the composite filler of (e) (f) (g) is 40 to 70% by weight of the main component. 제1항에 있어서, (h) 경화촉진제는 3급아민계 화합물, 이미다졸계 화합물 또는 BF3-착염계 화합물이며, 그 배합량은 주제성분의 0.1~0.5중량%인 것을 특징으로 하는 2액형 고전압 전기 부품용 열경화성 에폭시 수지 조성물.2. The two-component high voltage according to claim 1, wherein the curing accelerator (h) is a tertiary amine compound, an imidazole compound, or a BF 3 -complex salt compound, and the compounding amount is 0.1 to 0.5% by weight of the main component. Thermosetting epoxy resin composition for electrical parts. 제1항에 있어서, (i) 경화제는 산무수물계로 상온에서 액상인 메틸테트라하이드로 프탈릭 안하이드라이드 (MTHPA), 메틸헥사하이드로 프탈릭 안하이드라이드(MHHPA) 또는 메틸 하이막 안하이드라이드(MHAC)이며, 그 배합량은 주제성분의 25~35중량%인 것을 특징으로 하는 2액형 고전압 전기 부품용 열경화성 수지 조성물.The method of claim 1, wherein (i) the curing agent is an acid anhydride-based liquid methyltetrahydro phthalic anhydride (MTHPA), methylhexahydro phthalic anhydride (MHHPA) or methyl high film anhydride (MHAC) ), And its blending amount is 25 to 35% by weight of the main component of the thermosetting resin composition for two-component high-voltage electric parts. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890020577A 1989-12-30 1989-12-30 Thermosetting Epoxy Resin Compositions for High Voltage Electrical Components KR910012059A (en)

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KR1019890020577A KR910012059A (en) 1989-12-30 1989-12-30 Thermosetting Epoxy Resin Compositions for High Voltage Electrical Components

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KR1019890020577A KR910012059A (en) 1989-12-30 1989-12-30 Thermosetting Epoxy Resin Compositions for High Voltage Electrical Components

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000045210A (en) * 1998-12-30 2000-07-15 유현식 Epoxy resin composition for semiconductor encapsulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000045210A (en) * 1998-12-30 2000-07-15 유현식 Epoxy resin composition for semiconductor encapsulation

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