KR920010691B1 - 접촉완충장치 부착 세정장치 - Google Patents

접촉완충장치 부착 세정장치 Download PDF

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Publication number
KR920010691B1
KR920010691B1 KR1019890000131A KR890000131A KR920010691B1 KR 920010691 B1 KR920010691 B1 KR 920010691B1 KR 1019890000131 A KR1019890000131 A KR 1019890000131A KR 890000131 A KR890000131 A KR 890000131A KR 920010691 B1 KR920010691 B1 KR 920010691B1
Authority
KR
South Korea
Prior art keywords
cleaning
load
cleaning device
cleaned
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019890000131A
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English (en)
Korean (ko)
Other versions
KR890012358A (ko
Inventor
마사미 오타니
마사미 니시다
Original Assignee
다이닛뽕스쿠링세이소오 가부시키기이샤
이시다 도쿠지로오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이닛뽕스쿠링세이소오 가부시키기이샤, 이시다 도쿠지로오 filed Critical 다이닛뽕스쿠링세이소오 가부시키기이샤
Publication of KR890012358A publication Critical patent/KR890012358A/ko
Application granted granted Critical
Publication of KR920010691B1 publication Critical patent/KR920010691B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

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  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1019890000131A 1988-01-08 1989-01-07 접촉완충장치 부착 세정장치 Expired KR920010691B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1988001579U JPH01107129U (https=) 1988-01-08 1988-01-08
JP?63-1579 1988-01-08
JPU88-1579 1988-01-08

Publications (2)

Publication Number Publication Date
KR890012358A KR890012358A (ko) 1989-08-26
KR920010691B1 true KR920010691B1 (ko) 1992-12-12

Family

ID=11505425

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890000131A Expired KR920010691B1 (ko) 1988-01-08 1989-01-07 접촉완충장치 부착 세정장치

Country Status (2)

Country Link
JP (1) JPH01107129U (https=)
KR (1) KR920010691B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111002164A (zh) * 2019-12-09 2020-04-14 国网智能科技股份有限公司 一种变电站触头打磨机构、打磨机器人、系统及方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2746670B2 (ja) * 1989-07-20 1998-05-06 東京エレクトロン株式会社 洗浄装置
JP2824210B2 (ja) * 1994-05-31 1998-11-11 日新製鋼株式会社 金属帯表面の付着塵埃の吸引除去方法および装置
JP2887197B2 (ja) * 1994-09-20 1999-04-26 大日本スクリーン製造株式会社 回転式基板洗浄装置
KR100403517B1 (ko) * 2000-12-29 2003-10-30 (주)케이.씨.텍 웨이퍼 세정 장치
JP7153616B2 (ja) * 2019-07-22 2022-10-14 株式会社荏原製作所 基板洗浄装置および基板洗浄方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111002164A (zh) * 2019-12-09 2020-04-14 国网智能科技股份有限公司 一种变电站触头打磨机构、打磨机器人、系统及方法
CN111002164B (zh) * 2019-12-09 2020-11-17 国网智能科技股份有限公司 一种变电站触头打磨机构、打磨机器人、系统及方法

Also Published As

Publication number Publication date
KR890012358A (ko) 1989-08-26
JPH01107129U (https=) 1989-07-19

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