KR920010440U - 다이접착에 적합한 리드프레임 구조 - Google Patents

다이접착에 적합한 리드프레임 구조

Info

Publication number
KR920010440U
KR920010440U KR2019900017391U KR900017391U KR920010440U KR 920010440 U KR920010440 U KR 920010440U KR 2019900017391 U KR2019900017391 U KR 2019900017391U KR 900017391 U KR900017391 U KR 900017391U KR 920010440 U KR920010440 U KR 920010440U
Authority
KR
South Korea
Prior art keywords
lead frame
frame structure
die bonding
structure suitable
die
Prior art date
Application number
KR2019900017391U
Other languages
English (en)
Other versions
KR940002773Y1 (ko
Inventor
차기본
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019900017391U priority Critical patent/KR940002773Y1/ko
Publication of KR920010440U publication Critical patent/KR920010440U/ko
Application granted granted Critical
Publication of KR940002773Y1 publication Critical patent/KR940002773Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
KR2019900017391U 1990-11-13 1990-11-13 다이접착에 적합한 리드프레임 구조 KR940002773Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900017391U KR940002773Y1 (ko) 1990-11-13 1990-11-13 다이접착에 적합한 리드프레임 구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900017391U KR940002773Y1 (ko) 1990-11-13 1990-11-13 다이접착에 적합한 리드프레임 구조

Publications (2)

Publication Number Publication Date
KR920010440U true KR920010440U (ko) 1992-06-17
KR940002773Y1 KR940002773Y1 (ko) 1994-04-23

Family

ID=19305346

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900017391U KR940002773Y1 (ko) 1990-11-13 1990-11-13 다이접착에 적합한 리드프레임 구조

Country Status (1)

Country Link
KR (1) KR940002773Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102182123B1 (ko) 2019-06-03 2020-11-23 박숙희 가구형 다목적 홈트레이닝 기구

Also Published As

Publication number Publication date
KR940002773Y1 (ko) 1994-04-23

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