KR910021022U - 리드프레임용 몰드다이구조 - Google Patents

리드프레임용 몰드다이구조

Info

Publication number
KR910021022U
KR910021022U KR2019900006035U KR900006035U KR910021022U KR 910021022 U KR910021022 U KR 910021022U KR 2019900006035 U KR2019900006035 U KR 2019900006035U KR 900006035 U KR900006035 U KR 900006035U KR 910021022 U KR910021022 U KR 910021022U
Authority
KR
South Korea
Prior art keywords
lead frame
die structure
mold die
mold
lead
Prior art date
Application number
KR2019900006035U
Other languages
English (en)
Other versions
KR960009291Y1 (ko
Inventor
장근용
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019900006035U priority Critical patent/KR960009291Y1/ko
Publication of KR910021022U publication Critical patent/KR910021022U/ko
Application granted granted Critical
Publication of KR960009291Y1 publication Critical patent/KR960009291Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR2019900006035U 1990-05-09 1990-05-09 리드프레임용 몰드다이구조 KR960009291Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900006035U KR960009291Y1 (ko) 1990-05-09 1990-05-09 리드프레임용 몰드다이구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900006035U KR960009291Y1 (ko) 1990-05-09 1990-05-09 리드프레임용 몰드다이구조

Publications (2)

Publication Number Publication Date
KR910021022U true KR910021022U (ko) 1991-12-20
KR960009291Y1 KR960009291Y1 (ko) 1996-10-16

Family

ID=19298486

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900006035U KR960009291Y1 (ko) 1990-05-09 1990-05-09 리드프레임용 몰드다이구조

Country Status (1)

Country Link
KR (1) KR960009291Y1 (ko)

Also Published As

Publication number Publication date
KR960009291Y1 (ko) 1996-10-16

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
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FPAY Annual fee payment

Payment date: 20040920

Year of fee payment: 9

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