KR930016209U - 몰드 다이 - Google Patents
몰드 다이Info
- Publication number
- KR930016209U KR930016209U KR2019910025164U KR910025164U KR930016209U KR 930016209 U KR930016209 U KR 930016209U KR 2019910025164 U KR2019910025164 U KR 2019910025164U KR 910025164 U KR910025164 U KR 910025164U KR 930016209 U KR930016209 U KR 930016209U
- Authority
- KR
- South Korea
- Prior art keywords
- mold die
- mold
- die
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910025164U KR940006176Y1 (ko) | 1991-12-30 | 1991-12-30 | 몰드 다이 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910025164U KR940006176Y1 (ko) | 1991-12-30 | 1991-12-30 | 몰드 다이 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930016209U true KR930016209U (ko) | 1993-07-28 |
KR940006176Y1 KR940006176Y1 (ko) | 1994-09-10 |
Family
ID=19326687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019910025164U KR940006176Y1 (ko) | 1991-12-30 | 1991-12-30 | 몰드 다이 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR940006176Y1 (ko) |
-
1991
- 1991-12-30 KR KR2019910025164U patent/KR940006176Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR940006176Y1 (ko) | 1994-09-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20040820 Year of fee payment: 11 |
|
LAPS | Lapse due to unpaid annual fee |