KR930012107U - 프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조 - Google Patents

프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조

Info

Publication number
KR930012107U
KR930012107U KR2019910019459U KR910019459U KR930012107U KR 930012107 U KR930012107 U KR 930012107U KR 2019910019459 U KR2019910019459 U KR 2019910019459U KR 910019459 U KR910019459 U KR 910019459U KR 930012107 U KR930012107 U KR 930012107U
Authority
KR
South Korea
Prior art keywords
preheaterless
die structure
transfer mold
mold die
manual transfer
Prior art date
Application number
KR2019910019459U
Other languages
English (en)
Other versions
KR940007754Y1 (ko
Inventor
장근용
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019910019459U priority Critical patent/KR940007754Y1/ko
Priority to US07/960,649 priority patent/US5366368A/en
Priority to JP1992078209U priority patent/JP2584777Y2/ja
Publication of KR930012107U publication Critical patent/KR930012107U/ko
Application granted granted Critical
Publication of KR940007754Y1 publication Critical patent/KR940007754Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR2019910019459U 1991-11-14 1991-11-14 프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조 KR940007754Y1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR2019910019459U KR940007754Y1 (ko) 1991-11-14 1991-11-14 프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조
US07/960,649 US5366368A (en) 1991-11-14 1992-10-14 Multi-plunger manual transfer mold die
JP1992078209U JP2584777Y2 (ja) 1991-11-14 1992-11-13 マルチプランジャー手動トランスファモールドダイ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910019459U KR940007754Y1 (ko) 1991-11-14 1991-11-14 프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조

Publications (2)

Publication Number Publication Date
KR930012107U true KR930012107U (ko) 1993-06-25
KR940007754Y1 KR940007754Y1 (ko) 1994-10-24

Family

ID=19322209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910019459U KR940007754Y1 (ko) 1991-11-14 1991-11-14 프리히터레스 매뉴얼 트랜스퍼 몰드 다이(Preheaterless Manual Transfer Mold Die)구조

Country Status (3)

Country Link
US (1) US5366368A (ko)
JP (1) JP2584777Y2 (ko)
KR (1) KR940007754Y1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5480296A (en) * 1992-02-15 1996-01-02 Goldstar Electron Co., Ltd. Transfer molding apparatus for encapsulating an electrical element in resin
KR970003691B1 (en) * 1994-04-22 1997-03-21 Han Mi Mold & Tool Co Ltd A molding device of semiconductor package
KR0157929B1 (ko) * 1995-12-30 1999-01-15 문정환 다층금형방식의 반도체패키지 몰딩장치
US5925384A (en) * 1997-04-25 1999-07-20 Micron Technology, Inc. Manual pellet loader for Boschman automolds
US6306331B1 (en) 1999-03-24 2001-10-23 International Business Machines Corporation Ultra mold for encapsulating very thin packages
CN100515717C (zh) * 1999-12-16 2009-07-22 第一精工株式会社 树脂封装方法
US6808661B2 (en) * 2001-12-11 2004-10-26 Asm Technology Singapore Pte Ltd. Method for encapsulating leadframe-mounted integrated circuits
JP3786946B1 (ja) 2005-01-24 2006-06-21 株式会社三井ハイテック 永久磁石の樹脂封止方法
US8043545B2 (en) * 2007-12-31 2011-10-25 Texas Instruments Incorporated Methods and apparatus to evenly clamp semiconductor substrates
WO2015108579A2 (en) * 2013-10-14 2015-07-23 United Technologies Corporation Assembly and method for transfer molding
CN113732276A (zh) * 2021-08-10 2021-12-03 泰兴市九羊机械设备有限公司 一种带有自动拨正功能的铸件成型装置
CN114347341B (zh) * 2021-12-31 2024-04-09 佛山市国星光电股份有限公司 一种分立器件塑封装置及塑封方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3427688A (en) * 1966-11-25 1969-02-18 Harry W Wilson Means for producing an illustrated molded product
JPS5850582B2 (ja) * 1979-08-24 1983-11-11 道男 長田 半導体封入成形方法とその金型装置
JPS5886315U (ja) * 1981-12-07 1983-06-11 坂東　一雄 半導体樹脂封入成形用金型装置
US4388265A (en) * 1981-12-14 1983-06-14 Kazuo Bandoh Process and apparatus for molding plastics
JPS59195834A (ja) * 1983-04-21 1984-11-07 Seiei Kosan Kk タブレツトロ−ダ−
JPS59225913A (ja) * 1983-06-08 1984-12-19 Y K C:Kk 複数のプランジヤにて複数の成形型に同時に合成樹脂を注入成形する方法および装置
JPS6038717U (ja) * 1983-08-25 1985-03-18 ロ−ム株式会社 マルチ式トランスフア成形装置
DE3336173C2 (de) * 1983-10-05 1985-08-29 Maschinenfabrik Lauffer GmbH & Co KG, 7240 Horb Presse mit mehreren Spritzkolben zur gleichzeitigen Herstellung mehrerer Kunststoffpreßteile
US4580964A (en) * 1984-07-26 1986-04-08 Microdot Inc. Press loading apparatus
JPS61214439A (ja) * 1985-03-19 1986-09-24 Oki Electric Ind Co Ltd 半導体製造装置
US4708613A (en) * 1985-03-27 1987-11-24 Kabushiki Kaisha Toshiba Plunger for a multi-plunger type resin mold device
JPS62195135A (ja) * 1986-02-21 1987-08-27 Nec Corp 半導体樹脂封止装置
US4793785A (en) * 1986-04-11 1988-12-27 Michio Osada Apparatus of multiplunger type for enclosing semiconductor elements with resin
JPH0729326B2 (ja) * 1986-07-23 1995-04-05 日立マイクロコンピユ−タエンジニアリング株式会社 成形装置
JPS6382717A (ja) * 1986-09-26 1988-04-13 Yazaki Corp トランスファー成形型の金型装置
JPH02174238A (ja) * 1988-12-27 1990-07-05 Yamada Seisakusho:Kk 半導体封止装置
NL193526C (nl) * 1991-02-26 2000-01-04 Boschman Tech Bv Inrichting voor het omhullen van elektronische onderdelen met een kunststof.

Also Published As

Publication number Publication date
US5366368A (en) 1994-11-22
KR940007754Y1 (ko) 1994-10-24
JP2584777Y2 (ja) 1998-11-05
JPH0558238U (ja) 1993-08-03

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