KR920003426U - 반도체의 리드 프레임 다이구조 - Google Patents

반도체의 리드 프레임 다이구조

Info

Publication number
KR920003426U
KR920003426U KR2019900010404U KR900010404U KR920003426U KR 920003426 U KR920003426 U KR 920003426U KR 2019900010404 U KR2019900010404 U KR 2019900010404U KR 900010404 U KR900010404 U KR 900010404U KR 920003426 U KR920003426 U KR 920003426U
Authority
KR
South Korea
Prior art keywords
lead frame
die structure
semiconductor lead
frame die
semiconductor
Prior art date
Application number
KR2019900010404U
Other languages
English (en)
Other versions
KR940003395Y1 (ko
Inventor
노길섭
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019900010404U priority Critical patent/KR940003395Y1/ko
Publication of KR920003426U publication Critical patent/KR920003426U/ko
Application granted granted Critical
Publication of KR940003395Y1 publication Critical patent/KR940003395Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019900010404U 1990-07-16 1990-07-16 반도체의 리드 프레임 다이구조 KR940003395Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900010404U KR940003395Y1 (ko) 1990-07-16 1990-07-16 반도체의 리드 프레임 다이구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900010404U KR940003395Y1 (ko) 1990-07-16 1990-07-16 반도체의 리드 프레임 다이구조

Publications (2)

Publication Number Publication Date
KR920003426U true KR920003426U (ko) 1992-02-25
KR940003395Y1 KR940003395Y1 (ko) 1994-05-23

Family

ID=19301078

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900010404U KR940003395Y1 (ko) 1990-07-16 1990-07-16 반도체의 리드 프레임 다이구조

Country Status (1)

Country Link
KR (1) KR940003395Y1 (ko)

Also Published As

Publication number Publication date
KR940003395Y1 (ko) 1994-05-23

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