KR920013709U - 다이본더의 리드프레임의 이송장치 - Google Patents

다이본더의 리드프레임의 이송장치

Info

Publication number
KR920013709U
KR920013709U KR2019900020578U KR900020578U KR920013709U KR 920013709 U KR920013709 U KR 920013709U KR 2019900020578 U KR2019900020578 U KR 2019900020578U KR 900020578 U KR900020578 U KR 900020578U KR 920013709 U KR920013709 U KR 920013709U
Authority
KR
South Korea
Prior art keywords
lead frame
die bonder
frame feeder
bonder lead
feeder
Prior art date
Application number
KR2019900020578U
Other languages
English (en)
Other versions
KR940001268Y1 (ko
Inventor
임남진
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019900020578U priority Critical patent/KR940001268Y1/ko
Publication of KR920013709U publication Critical patent/KR920013709U/ko
Application granted granted Critical
Publication of KR940001268Y1 publication Critical patent/KR940001268Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
KR2019900020578U 1990-12-22 1990-12-22 다이본더의 리드프레임의 이송장치 KR940001268Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900020578U KR940001268Y1 (ko) 1990-12-22 1990-12-22 다이본더의 리드프레임의 이송장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900020578U KR940001268Y1 (ko) 1990-12-22 1990-12-22 다이본더의 리드프레임의 이송장치

Publications (2)

Publication Number Publication Date
KR920013709U true KR920013709U (ko) 1992-07-27
KR940001268Y1 KR940001268Y1 (ko) 1994-03-09

Family

ID=19307517

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900020578U KR940001268Y1 (ko) 1990-12-22 1990-12-22 다이본더의 리드프레임의 이송장치

Country Status (1)

Country Link
KR (1) KR940001268Y1 (ko)

Also Published As

Publication number Publication date
KR940001268Y1 (ko) 1994-03-09

Similar Documents

Publication Publication Date Title
EP0452903A3 (en) Lead frame for semiconductor device
DE69106343D1 (de) Drahtvorschubeinrichtung.
KR920013709U (ko) 다이본더의 리드프레임의 이송장치
KR920010440U (ko) 다이접착에 적합한 리드프레임 구조
KR910009946U (ko) 리드프레임
KR930010573U (ko) 반도체 리이드프레임 성형용 금형
KR920003426U (ko) 반도체의 리드 프레임 다이구조
KR900010984A (ko) 리드프레임의 가공방법
KR930007514U (ko) 다이본딩 장치
KR970046858U (ko) 리드 프레임 이송 장치
KR910021034U (ko) 리드 프레임
EP0410116A3 (en) Semiconductor device including lead frames
KR890018227U (ko) 리이드 프레임 이송장치
GB9115389D0 (en) Semiconductor lead frame
KR910021022U (ko) 리드프레임용 몰드다이구조
KR910009945U (ko) 리드프레임
KR920013768U (ko) 반도체 리이드 프레임
KR930001535U (ko) 반도체 리드 프레임
KR970046871U (ko) 리드 프레임 이송장치
KR970003218U (ko) 리드 프레임 공급 장치
KR920020305U (ko) 반도체용 리드프레임
KR940025553U (ko) 반도체 프레임 이송장치
KR970025836U (ko) 리드 프레임 스트립 이송장치
KR930016256U (ko) 리드 프레임
KR930003590U (ko) 리드프레임 메가진

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20030218

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee