KR930016256U - 리드 프레임 - Google Patents

리드 프레임

Info

Publication number
KR930016256U
KR930016256U KR2019910024160U KR910024160U KR930016256U KR 930016256 U KR930016256 U KR 930016256U KR 2019910024160 U KR2019910024160 U KR 2019910024160U KR 910024160 U KR910024160 U KR 910024160U KR 930016256 U KR930016256 U KR 930016256U
Authority
KR
South Korea
Prior art keywords
lead frame
lead
frame
Prior art date
Application number
KR2019910024160U
Other languages
English (en)
Other versions
KR0119271Y1 (ko
Inventor
고진성
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019910024160U priority Critical patent/KR0119271Y1/ko
Publication of KR930016256U publication Critical patent/KR930016256U/ko
Application granted granted Critical
Publication of KR0119271Y1 publication Critical patent/KR0119271Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019910024160U 1991-12-26 1991-12-26 리드 프레임 KR0119271Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910024160U KR0119271Y1 (ko) 1991-12-26 1991-12-26 리드 프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910024160U KR0119271Y1 (ko) 1991-12-26 1991-12-26 리드 프레임

Publications (2)

Publication Number Publication Date
KR930016256U true KR930016256U (ko) 1993-07-28
KR0119271Y1 KR0119271Y1 (ko) 1998-07-01

Family

ID=19325831

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910024160U KR0119271Y1 (ko) 1991-12-26 1991-12-26 리드 프레임

Country Status (1)

Country Link
KR (1) KR0119271Y1 (ko)

Also Published As

Publication number Publication date
KR0119271Y1 (ko) 1998-07-01

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Legal Events

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