KR930016269U - 리드 프레임 - Google Patents

리드 프레임

Info

Publication number
KR930016269U
KR930016269U KR2019910024158U KR910024158U KR930016269U KR 930016269 U KR930016269 U KR 930016269U KR 2019910024158 U KR2019910024158 U KR 2019910024158U KR 910024158 U KR910024158 U KR 910024158U KR 930016269 U KR930016269 U KR 930016269U
Authority
KR
South Korea
Prior art keywords
lead frame
lead
frame
Prior art date
Application number
KR2019910024158U
Other languages
English (en)
Other versions
KR0131890Y1 (ko
Inventor
방홍엽
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019910024158U priority Critical patent/KR0131890Y1/ko
Publication of KR930016269U publication Critical patent/KR930016269U/ko
Application granted granted Critical
Publication of KR0131890Y1 publication Critical patent/KR0131890Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385Shape, e.g. interlocking features

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019910024158U 1991-12-26 1991-12-26 리드 프레임 KR0131890Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910024158U KR0131890Y1 (ko) 1991-12-26 1991-12-26 리드 프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910024158U KR0131890Y1 (ko) 1991-12-26 1991-12-26 리드 프레임

Publications (2)

Publication Number Publication Date
KR930016269U true KR930016269U (ko) 1993-07-28
KR0131890Y1 KR0131890Y1 (ko) 1998-12-01

Family

ID=19325830

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910024158U KR0131890Y1 (ko) 1991-12-26 1991-12-26 리드 프레임

Country Status (1)

Country Link
KR (1) KR0131890Y1 (ko)

Also Published As

Publication number Publication date
KR0131890Y1 (ko) 1998-12-01

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