KR950028721U - 반도체 제조용 리드프레임 구조 - Google Patents
반도체 제조용 리드프레임 구조Info
- Publication number
- KR950028721U KR950028721U KR2019940006421U KR19940006421U KR950028721U KR 950028721 U KR950028721 U KR 950028721U KR 2019940006421 U KR2019940006421 U KR 2019940006421U KR 19940006421 U KR19940006421 U KR 19940006421U KR 950028721 U KR950028721 U KR 950028721U
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- frame structure
- semiconductor manufacturing
- semiconductor
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940006421U KR970006523Y1 (ko) | 1994-03-29 | 1994-03-29 | 반도체 제조용 리드프레임 구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940006421U KR970006523Y1 (ko) | 1994-03-29 | 1994-03-29 | 반도체 제조용 리드프레임 구조 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950028721U true KR950028721U (ko) | 1995-10-20 |
KR970006523Y1 KR970006523Y1 (ko) | 1997-06-25 |
Family
ID=19379895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940006421U KR970006523Y1 (ko) | 1994-03-29 | 1994-03-29 | 반도체 제조용 리드프레임 구조 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970006523Y1 (ko) |
-
1994
- 1994-03-29 KR KR2019940006421U patent/KR970006523Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR970006523Y1 (ko) | 1997-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20081009 Year of fee payment: 12 |
|
EXPY | Expiration of term |