KR920008360Y1 - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
KR920008360Y1
KR920008360Y1 KR2019890017652U KR890017652U KR920008360Y1 KR 920008360 Y1 KR920008360 Y1 KR 920008360Y1 KR 2019890017652 U KR2019890017652 U KR 2019890017652U KR 890017652 U KR890017652 U KR 890017652U KR 920008360 Y1 KR920008360 Y1 KR 920008360Y1
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KR
South Korea
Prior art keywords
lead
lead frame
package
neighboring
leads
Prior art date
Application number
KR2019890017652U
Other languages
Korean (ko)
Other versions
KR910009948U (en
Inventor
변광유
Original Assignee
현대전자산업 주식회사
정몽헌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 현대전자산업 주식회사, 정몽헌 filed Critical 현대전자산업 주식회사
Priority to KR2019890017652U priority Critical patent/KR920008360Y1/en
Publication of KR910009948U publication Critical patent/KR910009948U/en
Application granted granted Critical
Publication of KR920008360Y1 publication Critical patent/KR920008360Y1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용 없음.No content.

Description

리드프레임Leadframe

제1도는 종래의 리드프레임에 패케이지를 형성한 도면.1 is a diagram in which a package is formed in a conventional lead frame.

제2도는 본 고안에 의한 리드프레임에 패케이지를 형성한 도면.2 is a view showing a package formed on the lead frame according to the present invention.

* 도면의주요부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

1,1' : 리드프레임 2,2' : 리드프레임1,1 ': Leadframe 2,2': Leadframe

3,3' : 리드 4,4' : 리드3,3 ': lead 4,4': lead

본 고안은 IC의 리드프레임에 관한 것으로, 특히 리드프레임의 리드가 이웃하는 리드프레임의 리드와 각각 접속되어 있는 것을 각각 분리하여 형성한 리드프레임에 관한 것이다.The present invention relates to a lead frame of an IC, and more particularly, to a lead frame formed by separately separating the leads of the lead frame from the leads of the neighboring lead frames, respectively.

종래에 사용되는 리드프레이의 리드는 이웃하는 리드프레임의 리드와 접속되어 있어, 몰드공정 후 댐바를 제거하고 상기 이웃하는 리드와 리드간의 접속부는 펀치를 사용하여 각각 분리시킨 후 상기 분리된 리드를 절곡시켜 IC를 완성한다.The lead of a conventional lead play is connected to a lead of a neighboring lead frame. After the mold process, the dam bar is removed, and the connection between the neighboring lead and the lead is separated using a punch, and then the separated lead is bent. To complete the IC.

그러나, 상기의 이웃하는 리드와 접속된 리드를 분리시키기 위하여 펀치를 사용할때, 그 충격이 성형된 패케이지에 전달되어 패케이지와 리드사이에 크랙이나 갭을 형성시켜 수분이 패케이지 내부로 침투되는 문제점이 발생되었다.However, when a punch is used to separate the lead connected to the neighboring lead, the impact is transmitted to the molded package, forming a crack or a gap between the package and the lead, so that moisture penetrates into the package. A problem has occurred.

따라서, 본 고안은 상기의 문제점을 해결하기 위하여 각각 리드프레임을 이웃하는 리드프레임의 리드와 분리시켜 형상함으로서 그로인하여 리드 절단공정을 생략하고 발생되는 충격을 방지할수 있는 리드프레임을 제공하는 데 그 목적이 있다.Accordingly, the present invention is to provide a lead frame that can avoid the impact caused by omitting the lead cutting process by forming each lead frame separated from the lead of the neighboring lead frame to solve the above problems. There is this.

이하, 첨부된 도면을 참고하여 상세히 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings in detail as follows.

제1도는 종래의 리드프레임(1 및 2)을 이용하여 칩마운드, 와이어 및 몰드공정을 진행시켜 패케이지(5)를 형성한 상태의 도면으로서 종래에 일반적으로 사용되는 리드프레임(1)의 리드(3)는 그 이웃하는 리드프레임(1)의 리드(4)의 접속된 상태를 도시한다.FIG. 1 is a view of a state in which a package 5 is formed by performing chip mount, wire, and mold processes using the lead frames 1 and 2 of the related art, and leads of the lead frame 1 generally used in the related art. (3) shows the connected state of the lead 4 of the neighboring lead frame 1.

이러한 구조는 상술한 바와같이 후공정의 절단공정시 발생되는 미세한 충격을 방지할수가 없다.Such a structure cannot prevent the minute impact generated during the cutting process of the post process as described above.

제2도는 본 고안에 의해 제조된 리드프레임(1' 및 2')을 이용하여 칩마운트, 와이어본딩, 및 몰드공정을 진행시켜 패케이지(5')를 형성한 상태의 도면으로서, 리드프레이(1')의 리드(3')가 그 이웃하는 리드프레임(2')의 리드(4')와 소정거리 만큼 떨어진 상태로 형성된 것을 도시한다. 이는 금형에 의한 제작시 상기 리드(4')간의 거리를 소정거리 이격된 상태로 하여 제조할수가 있다.2 is a view showing a state in which the package 5 'is formed by performing chip mount, wire bonding, and mold processes using the lead frames 1' and 2 'manufactured according to the present invention. The lead 3 'of 1' is formed to be spaced apart from the lead 4 'of the neighboring lead frame 2' by a predetermined distance. This can be manufactured in a state in which the distance between the leads (4 ') is a predetermined distance apart during manufacturing by the mold.

상기한 바와 같이 본 고안은 리드프레임의 리드를 각각 이격시켜 형성함으로써, 몰드공정후 절단공정을 생략할수 있어서 패케이지의 리드사이에 크랙이나 갭이 발생되는 문제점을 해결할수가 있으므로 반도체 소자의 안정성을 더욱 높일수 있다.As described above, the present invention is formed by separating the leads of the lead frame, so that the cutting process after the mold process can be omitted, thereby solving the problem that cracks or gaps are generated between the leads of the package, thereby improving stability of the semiconductor device. You can increase it.

Claims (1)

다수의 연결된 리드프레임에 있어서, 몰드공정후 절단공정으로 리드의 외측단부를 절단할때 발생되는 충격을 방지하기 위하여, 리드프레임(1')의 리드 외측단부(3')와 이웃하는 리드프레임(2')의 리드 외측단부(4')가 서로 접속되지 않도록 형성된 것을 특징으로 하는 리드프레임.In a plurality of connected lead frames, the lead frame adjacent to the lead outer end 3 'of the lead frame 1' in order to prevent the impact generated when the outer end of the lead is cut by the cutting process after the mold process ( A lead frame, characterized in that the lead outer ends 4 'of 2') are formed so as not to be connected to each other.
KR2019890017652U 1989-11-28 1989-11-28 Lead frame KR920008360Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019890017652U KR920008360Y1 (en) 1989-11-28 1989-11-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019890017652U KR920008360Y1 (en) 1989-11-28 1989-11-28 Lead frame

Publications (2)

Publication Number Publication Date
KR910009948U KR910009948U (en) 1991-06-29
KR920008360Y1 true KR920008360Y1 (en) 1992-11-20

Family

ID=19292395

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019890017652U KR920008360Y1 (en) 1989-11-28 1989-11-28 Lead frame

Country Status (1)

Country Link
KR (1) KR920008360Y1 (en)

Also Published As

Publication number Publication date
KR910009948U (en) 1991-06-29

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