JPS60161645A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS60161645A
JPS60161645A JP1520884A JP1520884A JPS60161645A JP S60161645 A JPS60161645 A JP S60161645A JP 1520884 A JP1520884 A JP 1520884A JP 1520884 A JP1520884 A JP 1520884A JP S60161645 A JPS60161645 A JP S60161645A
Authority
JP
Japan
Prior art keywords
lead
tab
tab hanging
semiconductor device
suspension lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1520884A
Other languages
Japanese (ja)
Inventor
Kazuhiko Sasaki
和彦 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1520884A priority Critical patent/JPS60161645A/en
Publication of JPS60161645A publication Critical patent/JPS60161645A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To contrive to reduce inferior products, and to reduce the manhour of a visual inspection at manufacture of a semiconductor device by a method wherein the separating part of a tab hanging lead is provided a little inner side than the side wall of a resin sealed part, and the breaking area of the separating part thereof is made smaller than the sectional area of the tab hanging lead. CONSTITUTION:The separating part 2 of a tab hanging head 1 is provided a little inner side than the side wall of a molded part 4. Moreover, the separating part 2 provided to a lead frame 7 is formed in a shape opened with a quadrilateral hole 1C as to form fine frames 1A, 1B of two pieces of width narrower than width of the tab hanging lead 1 as not to apply damage as much as possible to the molded part 4 when the tab hanging lead 1 mentioned above and the lead frame 7 are to be separated. By forming the lead in the shape providing with V-shaped notches at the prescribed positions of the fine frames 1A, 1B of two pieces thereof, breaking force is made small, and moreover, the breaking area of the exposed part is also made small. Moreover, by opening a triangular hole 1D as to make the corners thereof to come to both the edges of the tab hanging lead 1, or by making the tab hanging lead 1 in a half cut condition provided with a step difference, the effect the same with as said above can be obtained.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は、半導体技術、さらには、樹脂封止型半導体装
置に適用して特に有効な技術に関するものであり、例え
ば、タブ吊りリードを有するリードフレームに利用して
有効な技術に関するものである。[Detailed Description of the Invention] [Technical Field] The present invention relates to semiconductor technology, and more particularly, to technology that is particularly effective when applied to resin-sealed semiconductor devices. It concerns techniques that can be effectively utilized.

〔背景技術〕[Background technology]

樹脂封止型半導体装置の製造は、まずリードフレームの
外枠と接続したタブ吊りリードで支持されたタブに半導
体素子（以下、ペレットという）を取り付ける。この取
り付けられたペレットのポンディングパッドにワイヤを
ボンディングし、樹脂封止（以下、モールドという）し
た後、前記タブ吊りリードを切断して前記リードフレー
ム外枠とパッケージを分離する（たとえば、工業調査会
発行ｒＩＣ化実装技術Ｊ　Ｐ１３７〜１４０）。To manufacture a resin-sealed semiconductor device, first, a semiconductor element (hereinafter referred to as a pellet) is attached to a tab supported by a tab suspension lead connected to the outer frame of a lead frame. After bonding a wire to the bonding pad of the attached pellet and sealing it with resin (hereinafter referred to as molding), the tab hanging lead is cut to separate the lead frame outer frame and the package (for example, in an industrial survey). rIC implementation technology JP, published by the Society, P137-140).

この場合、前記分離方法の一つとして、切断刃で切断す
るのではなく、あらかじめリードフレームの分離部（ピ
ンチオフ部）にノツチを入れておき、分離時にモールド
部を加圧することにより破断を進行させて切断すること
が考えられる。また、分離後のパッケージは半田に浸漬
して、リードの外部に露出している部分の表面に半田層
を形成している。In this case, as one of the separation methods described above, instead of cutting with a cutting blade, a notch is made in advance in the separation part (pinch-off part) of the lead frame, and the mold part is pressurized during separation to advance the breakage. It is conceivable to cut it by Furthermore, the separated package is dipped in solder to form a solder layer on the surface of the externally exposed portion of the lead.

しかしながら、前記封止型半導体装置では、本発明者の
検討によれば次の問題がある。タブ吊りリードの分離部
の、ノツチは、７字形の刃でコイニング加工して作るの
が安価で簡単であるが、刃の先端が摩耗して丸くなりや
すい。この先端が摩耗したものでノツチを入れたものは
、切断力が大きくなり、モールド部の欠けが生じる。ま
た、前記分離部がモールド部側壁と同一面に設けられて
おり、その破断面が大きく、半田浸漬時に、この破断面
に半田が多く付着して製品の不良が発生するとともに、
これを選別する外観検査工数がかかる。However, the sealed semiconductor device has the following problems, according to the inventor's study. The notch at the separation part of the tab hanging lead can be made by coining with a 7-shaped blade, which is cheap and easy, but the tip of the blade tends to wear out and become rounded. If the tip is worn and notched, the cutting force will be large, causing chipping of the mold part. In addition, the separation part is provided on the same surface as the side wall of the mold part, and its fractured surface is large, and when immersed in solder, a large amount of solder adheres to this fractured surface, resulting in product defects.
It takes a lot of time for visual inspection to sort these out.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、前記タブ吊りリードの分離部を封止部
側壁より内側に設け、該分離部の破断面積をタブ吊りリ
ードの断面積よりも小さくした封止型半導体装置を提供
することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a sealed semiconductor device in which a separation portion of the tab suspension lead is provided inside the side wall of the sealing portion, and the rupture area of the separation portion is smaller than the cross-sectional area of the tab suspension lead. be.

本発明の他の目的は、前記タブ吊りリードの分離部にあ
らかじめ三角形、長方形等の穴をあけておくか、あるい
は、半切断状態にしておくことにより、モールド後のタ
ブ吊りリード切断時にこの部分に応力を集中させて容易
に切断が可能なリードフレームを用いたモールド型半導
体装置を提供することにある。Another object of the present invention is to make a triangular, rectangular, etc. hole in advance in the separated part of the tab hanging lead, or to cut the tab hanging lead in a half-cut state, so that when cutting the tab hanging lead after molding, this part can be cut. An object of the present invention is to provide a molded semiconductor device using a lead frame that can be easily cut by concentrating stress on the lead frame.

本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述及び添付図面によって明らかになるであろ
う。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

〔発明の概要〕[Summary of the invention]

本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、下記のとおりである。A brief overview of typical inventions disclosed in this application is as follows.

すなわち、タブ吊りリードの分離部を樹脂封止部側壁よ
り若干内側に設け、この分離部の破断面積をタブ吊りリ
ードの断面積よりも小さくすることにより製品不良の低
減と外観検査の工数の低減をはかったものである。In other words, the separation part of the tab suspension lead is provided slightly inside the side wall of the resin sealing part, and the fracture area of this separation part is made smaller than the cross-sectional area of the tab suspension lead, thereby reducing product defects and the number of steps for visual inspection. It is measured by

〔実施例〕〔Example〕

第１図は、本発明の封止型半導体装置の一実施例を示す
正面図であり、第２図は、第１図のＡ−Ａ線で切った概
略矢視断面図、第３図（Ａ）、第４図（Ａ）、第５図（
Ａ）は、リードフレームの実施例の主要部平面図、第３
図（Ｂ）、第４図（Ｂ）。FIG. 1 is a front view showing an embodiment of the sealed semiconductor device of the present invention, FIG. 2 is a schematic cross-sectional view taken along line A-A in FIG. 1, and FIG. A), Figure 4 (A), Figure 5 (
A) is a plan view of main parts of an example of a lead frame, the third
Figure (B), Figure 4 (B).

第５図（Ｂ）は、第３図（Ａ）、第４図（Ａ）、第５図
（Ａ）のそれぞれの側面図である。FIG. 5(B) is a side view of FIG. 3(A), FIG. 4(A), and FIG. 5(A), respectively.

第１図及び第２図において、ｌはタブ吊りリード、２は
タブ吊りリードの分離部、３はリード、４は樹脂等で形
成されるモールド部、５はタブ、６は半導体素子（以下
、ペレットという）である。In FIGS. 1 and 2, l is a tab suspension lead, 2 is a separation part of the tab suspension lead, 3 is a lead, 4 is a molded part formed of resin, etc., 5 is a tab, and 6 is a semiconductor element (hereinafter referred to as pellets).

前記タブ吊りリード１の分離部２は、第２図に示すよう
に、モールド部４の側壁よりも若干内側に設けられてい
る。また、前記タブ吊りリード１とリードフレーム７と
を分離する際、モールド部４にできる限りダメージを与
えないために、リードフレーム７に設けられている分離
部２の形状を、第３図（Ａ）、（Ｂ）に示すように、タ
ブ吊りリード１の幅よりも小さい幅の細いフレーム（例
えば、タブ吊りリードの幅を０．４ｍｍとすると、細イ
フレーム幅を０．１ｍｍとする）ＩＡ、ＩＢの２本を形
成するような四辺形の穴ＩＣをあける。その２本の細い
フレームＩＡ、ＩＢの所定位置にＶ字状の切り込みを設
けたものとすることにより、切断力を小さくし、かつ、
露出部の破断面積も小さくする。The separation part 2 of the tab suspension lead 1 is provided slightly inside the side wall of the mold part 4, as shown in FIG. Further, when separating the tab suspension lead 1 and the lead frame 7, in order to avoid damaging the mold part 4 as much as possible, the shape of the separation part 2 provided on the lead frame 7 is changed as shown in FIG. ), as shown in (B), a narrow frame whose width is smaller than the width of the tab suspension lead 1 (for example, if the width of the tab suspension lead is 0.4 mm, the narrow frame width is 0.1 mm) IA , IB, and make a quadrilateral hole IC. By providing V-shaped notches at predetermined positions on the two thin frames IA and IB, the cutting force can be reduced, and
The fracture area of the exposed portion is also reduced.

また、前記分離部２の形状を、第４図（Ａ）。Further, the shape of the separating section 2 is shown in FIG. 4(A).

（Ｂ）に示すように、タブ吊りリードｌの両縁に角がく
るような三角形の穴ｌＤをあけたものとすることにより
、前述のものと同様に切断力を小さくし、かつ露出部の
破断面積も小さくできる。第４図（Ａ）、（Ｂ）に示し
たリードフレームのくり返しの基本となる部分を第６図
に示す。８および９は外枠、ｌＯはタイバーである。As shown in (B), by drilling a triangular hole ID with corners on both edges of the tab suspension lead L, the cutting force can be reduced as in the case described above, and the exposed portion can be removed. The fracture area can also be reduced. FIG. 6 shows the basic portion of the lead frame repetition shown in FIGS. 4(A) and 4(B). 8 and 9 are outer frames, and lO is a tie bar.

また、前記分離部２の形状を、第５図（Ａ）。Further, the shape of the separating section 2 is shown in FIG. 5(A).

（Ｂ）に示すように、タブ吊りリードｌに段差をつけた
半切断状態にすることにより、前述のものと同様に切断
力を小さくし、かつ露出部の破断面積も小さくできる。As shown in (B), by cutting the tab suspension lead l into a half-cut state with a step, the cutting force can be reduced and the fracture area of the exposed portion can be reduced as in the case described above.

さらに、第４図（Ａ）、（Ｂ）に示すものと、第５図（
Ａ）、（Ｂ）に示すものとを組合わせて、より一層の効
果をあげることも可能である。Furthermore, what is shown in Figures 4 (A) and (B) and Figure 5 (
It is also possible to achieve even greater effects by combining the methods shown in A) and (B).

次に、前記樹脂封止型半導体装置を製造する方法を説明
する。Next, a method for manufacturing the resin-sealed semiconductor device will be described.

まず、タブ５上にペレット６を固定した後、ペレット６
の各電極とり一層３の内端とをボンディングワイヤで接
続する。その後樹脂等で樹脂封止し、モールド部４を形
成する。次に、モールド部４を加圧してリードフレーム
７に設けられた分離部２でリード７レーレ７の外枠とタ
ブ吊りリードｌを分離する。このとき、第３図（Ａ）、
（Ｂ）乃至第５図（Ａ）、（Ｂ）に示すように、分離部
２しこ応力が集中するようにしであるので、モールド部
４にダメージを与えない。そしてダムを切断除去すると
ともに、リードから外枠を切り離し、モールド部４から
両端に突出するリード３を同一方向に折り曲げ、半田に
浸漬して、リードの外部に露出している表面に半田層を
形成して封止型半導体装置が完成する。First, after fixing the pellet 6 on the tab 5,
Each electrode is connected to the inner end of the layer 3 using a bonding wire. Thereafter, the molded portion 4 is formed by sealing with a resin or the like. Next, the mold part 4 is pressurized to separate the outer frame of the lead 7 rail 7 and the tab suspension lead l at the separating part 2 provided on the lead frame 7. At this time, Fig. 3 (A),
As shown in FIGS. 5(B) to 5(A) and 5(B), since the stress is concentrated in the separation part 2, no damage is caused to the mold part 4. Then, the dam is cut and removed, the outer frame is separated from the leads, the leads 3 protruding from the mold part 4 at both ends are bent in the same direction, and the leads are dipped in solder to form a solder layer on the externally exposed surfaces of the leads. A sealed semiconductor device is completed.

前記半田層を形成する際に、装置を半田に浸漬するが、
前記第２図に示すように、本実施例のタブ吊りリードの
分離部２は、モールド部の側壁よりも若干内側に設けら
れているので、表面張力の大きい半田が浸入してこない
。When forming the solder layer, the device is immersed in solder,
As shown in FIG. 2, the separation section 2 of the tab suspension lead of this embodiment is provided slightly inside the side wall of the mold section, so that solder having a high surface tension does not infiltrate.

〔効果〕〔effect〕

（１）タブ吊りリードの分離部をモールド部側壁よりも
若干内側に設けることにより、表面張力の大きい半田が
浸入してこないようにしたので、分離部の破断面に半田
がほとんど付着しない。したがって、製品不良の低減及
び外観検査工数の低減がはかれる。(1) By providing the separation part of the tab suspension lead slightly inside the side wall of the mold part, solder with high surface tension is prevented from penetrating, so that almost no solder adheres to the fractured surface of the separation part. Therefore, it is possible to reduce the number of product defects and the number of man-hours required for visual inspection.

（２）タブ吊りリードの分離部の形状を四辺形。(2) The shape of the separation part of the tab suspension lead is quadrilateral.

三角形等の穴をあけるか、あるいは半切断状態に形成し
たので、タブ吊りリードの切断力のバラツキが小さく、
リードフレーム製作用金型の管理が容易である。Since the hole is drilled in a triangular shape or formed in a half-cut state, there is little variation in the cutting force of the tab suspension lead.
It is easy to manage the lead frame manufacturing mold.

（３）タブ吊りリードの分離部を細いフレームにしたの
で、分離時の切断力が小さく、かつ、その破断面積が小
さくなる。これにより、タブ吊りリード分離時のモール
ド部へのダメージが少なく、かつ、リード侵漬時に半田
が付着しにくい。したがって、製品不良の低減と外観検
査工数の低減がはかれる。(3) Since the separation part of the tab suspension lead is made into a thin frame, the cutting force at the time of separation is small, and the rupture area is small. As a result, there is less damage to the mold portion when the tab suspension leads are separated, and solder is less likely to adhere when the leads are immersed. Therefore, product defects and appearance inspection man-hours can be reduced.

以上、本発明によってなされた発明を実施例にもとづき
具体的に説明したが、本発明は前記実施例に限定される
ものでなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。Above, the invention made by the present invention has been specifically explained based on examples, but it goes without saying that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist thereof. Nor.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本発明の封止型半導体装置の一実施例を示す
正面図、 第２図は、第１図のＡ−Ａ線で切った概略矢視断面図、 第３図（Ａ）、第４図（Ａ）および第５図（Ａ）は、タ
ブ吊りリードフレームの実施例の主要部平面図、 第３図（Ｂ）、第４図（Ｂ）および第５図（Ｂ）は、第
３図（Ａ）、第４図（Ａ）および第５図（Ａ）のそれぞ
れの側面図、 第６図は、リードフレームを示す平面図である。 図中、ｌ・・・タブ吊りリード、２・・・分離部、３・
・・リード、４・・・モールド部、５・・・タブ、６・
・・ペレット（半導体素子）、７・・・リードフレーム
、８゜９・・・外枠、ｌＯ・・・タイバーである。FIG. 1 is a front view showing an embodiment of the sealed semiconductor device of the present invention, FIG. 2 is a schematic cross-sectional view taken along line A-A in FIG. 1, and FIG. 3(A) , FIG. 4(A) and FIG. 5(A) are plan views of the main parts of the embodiment of the tab hanging lead frame, FIG. 3(B), FIG. 4(B) and FIG. 5(B) are , FIG. 3(A), FIG. 4(A), and FIG. 5(A) are respective side views. FIG. 6 is a plan view showing the lead frame. In the figure, l...Tab suspension lead, 2... Separation part, 3...
...Lead, 4...Mold part, 5...Tab, 6...
... Pellet (semiconductor element), 7... Lead frame, 8°9... Outer frame, lO... Tie bar.

Claims (1)

【特許請求の範囲】 １、半導体素子を取り付けるタブを支持する吊りリード
と、前記タブに向かって延びる複数のリードを備えた半
導体装置において、前記タブ吊りリードの分離部を封止
部側壁よりも若干内側に設け、該分離部の破断面積をタ
ブ吊りリードの断面積よりも小さくしたことを特徴とす
る半導体装置。 ２、前記タブ吊りリードの分離部にあらかじめ穴をあけ
ておき、その部分に切断時の応力が集中するように構成
したことを特徴とする特許請求の範囲第１項記載の半導
体装置。 ３、前記タブ吊りリードの分離部をあらかじめ半切断状
態にしておき、その部分に切断時の応力が集中するよう
に構成したこ゛とを特徴とする特許請求の範囲第１項記
載の半導体装置。 ４、前記タブ吊りリードの分離部にあらかじめ段差をつ
けておき半切断状態にして、その部分に切断時の応力が
集中するように構成したことを特徴とする特許請求の範
囲第１項記載の半導体装置。[Scope of Claims] 1. In a semiconductor device including a suspension lead supporting a tab on which a semiconductor element is attached and a plurality of leads extending toward the tab, the separating portion of the tab suspension lead is located closer to the side wall of the sealing portion. 1. A semiconductor device characterized in that the separation portion is provided slightly inward, and the fracture area of the separation portion is smaller than the cross-sectional area of the tab suspension lead. 2. The semiconductor device according to claim 1, wherein a hole is pre-drilled in the separated portion of the tab suspension lead so that stress during cutting is concentrated in that portion. 3. The semiconductor device according to claim 1, wherein the separated portion of the tab suspension lead is previously cut in half so that stress during cutting is concentrated on that portion. 4. The separating portion of the tab suspension lead is provided with a step in advance so as to be cut in half so that the stress during cutting is concentrated on that portion. Semiconductor equipment.
JP1520884A 1984-02-01 1984-02-01 Semiconductor device Pending JPS60161645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1520884A JPS60161645A (en) 1984-02-01 1984-02-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1520884A JPS60161645A (en) 1984-02-01 1984-02-01 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS60161645A true JPS60161645A (en) 1985-08-23

Family

ID=11882450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1520884A Pending JPS60161645A (en) 1984-02-01 1984-02-01 Semiconductor device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04350960A (en) * 1991-05-28 1992-12-04 Fuji Xerox Co Ltd Semiconductor package
JP2005026623A (en) * 2003-07-03 2005-01-27 Shindengen Electric Mfg Co Ltd Micro joint terminal for connecting semiconductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04350960A (en) * 1991-05-28 1992-12-04 Fuji Xerox Co Ltd Semiconductor package
JP2005026623A (en) * 2003-07-03 2005-01-27 Shindengen Electric Mfg Co Ltd Micro joint terminal for connecting semiconductor

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