JP2005026623A - Micro joint terminal for connecting semiconductor - Google Patents

Micro joint terminal for connecting semiconductor Download PDF

Info

Publication number
JP2005026623A
JP2005026623A JP2003270692A JP2003270692A JP2005026623A JP 2005026623 A JP2005026623 A JP 2005026623A JP 2003270692 A JP2003270692 A JP 2003270692A JP 2003270692 A JP2003270692 A JP 2003270692A JP 2005026623 A JP2005026623 A JP 2005026623A
Authority
JP
Japan
Prior art keywords
micro
terminal
micro joint
joint
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003270692A
Other languages
Japanese (ja)
Other versions
JP4822660B2 (en
Inventor
Kaoru Sasaki
薫 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AKITA SHINDENGEN KK
Shindengen Electric Manufacturing Co Ltd
Akita Shindengen Co Ltd
Original Assignee
AKITA SHINDENGEN KK
Shindengen Electric Manufacturing Co Ltd
Akita Shindengen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AKITA SHINDENGEN KK, Shindengen Electric Manufacturing Co Ltd, Akita Shindengen Co Ltd filed Critical AKITA SHINDENGEN KK
Priority to JP2003270692A priority Critical patent/JP4822660B2/en
Publication of JP2005026623A publication Critical patent/JP2005026623A/en
Application granted granted Critical
Publication of JP4822660B2 publication Critical patent/JP4822660B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

<P>PROBLEM TO BE SOLVED: To provide a special terminal for manufacturing a semiconductor device in which the number of parts concerning its manufacture is reduced and which can manufacture without using a special jig. <P>SOLUTION: A metal micro joint terminal electrically connects the electrode of a semiconductor chip to a lead terminal or the terminal of a semiconductor to a terminal. The micro joint terminal is coupled by an easily cuttable or excisable micro joint and is electrically divided by cutting or excising the micro joint part. The micro joint part has a thin or slender micro joint part of metal. The micro joint part can be simply cut or excised by folding or pulling to apply a stress to the micro joint part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、樹脂封止型半導体装置を簡単に製造するための半導体接続用マイクロジョイント端子に関するものである。   The present invention relates to a micro joint terminal for semiconductor connection for easily manufacturing a resin-encapsulated semiconductor device.

従来、ＭＯＳトラジスタやサイリスタ等の表面に端子を２つ以上持つ半導体製品を製造する場合は、ゲートやソースをワイヤーボンドを用いて接続する。接続が容易だからである。しかし、大電流に使用するものなどでは、ワイヤよりも金属の端子を用い接続したほうが多く電流も流せるし信頼性が高い。ところが、端子を用いて製造する場合は、特にトランジスタのように３端子以上半導体チップの場合、はんだ付けするゲートやソースは小さく、金属端子を用いて製造するのは位置あわせや、接続が困難であった。このため、組み立てる際に各部品個々にガイドが必要であった。   Conventionally, when manufacturing a semiconductor product having two or more terminals on the surface of a MOS transistor, a thyristor, or the like, a gate and a source are connected using a wire bond. This is because the connection is easy. However, in the case of a device used for a large current, it is more reliable to use a metal terminal than a wire to connect the current, and the reliability is high. However, when manufacturing using terminals, especially in the case of a semiconductor chip having three or more terminals such as a transistor, the gate and source to be soldered are small, and it is difficult to align and connect using a metal terminal. there were. For this reason, a guide is required for each component when assembling.

例えば、本願のマイクロジョイント端子を用いて樹脂封止型トランジスタを製造する例で説明すると、図２のように、まず銅の放熱フレームの上にセラミックを搭載した基材を準備する。セラミック上側には、銅板が張ってある。銅板は３つにわかれている。セラミック銅板の上にはトランジスタ半導体チップを搭載し、トランジスタのドレインとセラミック銅板をはんだで接続する。更に、アノードが接続された銅板に端子をはんだで接続する。同様にソースにも端子をはんだで接続して固着する。同様にゲートもはんだで接続して固着する。このようにして、端子と半導体チップの電極を電気的に接続し、後に樹脂封止して製品を完成させる。 For example, in the case of manufacturing a resin-encapsulated transistor using the micro joint terminal of the present application, as shown in FIG. 2, first, a substrate on which a ceramic is mounted on a copper heat dissipating frame is prepared. A copper plate is stretched on the upper side of the ceramic. There are three copper plates. A transistor semiconductor chip is mounted on the ceramic copper plate, and the drain of the transistor and the ceramic copper plate are connected by solder. Furthermore, a terminal is connected to the copper plate to which the anode is connected by solder. Similarly, the terminal is fixed to the source by soldering. Similarly, the gate is fixed by soldering. In this way, the terminal and the electrode of the semiconductor chip are electrically connected, and then the product is sealed by resin sealing.

ただし、このような工程で製造するには、端子が三本あり、ひとつずつ搭載及びはんだづけをおこなうのは、やっかいであるし部品点数も多い。また、端子それぞれの高さがばらばらになったりしやすいといった問題点があった。そのため、このような半導体装置を組み立てるには特殊な冶具を使用して組み立てていた。しかし、この製造はやっかいであった。
特許2837777号 However, in order to manufacture in such a process, there are three terminals, and mounting and soldering one by one is troublesome and has a large number of parts. In addition, there is a problem that the height of each terminal is likely to vary. Therefore, a special jig was used to assemble such a semiconductor device. However, this production was troublesome.
Patent No. 2837777

図１〜図３の端子は、冶具を使って搭載し、組み立てをおこなっていた。   The terminals of FIGS. 1 to 3 were mounted and assembled using jigs.

本願は、製造にかかる部品点数を減らし、かつ簡単に樹脂封止型半導体装置を製造し、かつ特殊な冶具を用いないでも製造できるような半導体装置の製造方法を供給するものである。   The present application provides a method of manufacturing a semiconductor device that can reduce the number of parts required for manufacturing, easily manufacture a resin-encapsulated semiconductor device, and can be manufactured without using a special jig.

半導体チップの電極とリード端子あるいは、半導体の端子と端子を電気的に接続するための金属のマイクロジョイント端子であって、前記マイクロジョイント端子は、容易に切断又は切除可能なマイクロジョイント部により連結されており、前記マイクロジョイント部を切断又は切除することにより、電気的に分割することを可能とした。
請求項２は前記マイクロジョイント部は金属の厚みが薄いか幅を細くしてマイクロジョイント部を切断又は切除するようにした。
請求項３は前記マイクロジョイント部は他の部分よりも引っ張り強度の弱い異種の金属で構成した。請求項５は前記マイクロジョイント部に穴を設け、位置だしや、マイクロジョイント部分を切断するときにつかみやすくした。 A metal micro-joint terminal for electrically connecting a semiconductor chip electrode and a lead terminal or a semiconductor terminal and the terminal, the micro-joint terminal being connected by a micro-joint portion that can be easily cut or excised. It is possible to electrically divide the micro joint by cutting or excising the micro joint.
According to a second aspect of the present invention, the micro joint part is cut or excised by making the metal thin or narrow.
According to a third aspect of the present invention, the micro joint portion is made of a different metal having a lower tensile strength than other portions. According to a fifth aspect of the present invention, a hole is provided in the micro joint part so that the position can be easily grasped when the micro joint part is cut.

このように本発明のマイクロジョイント端子を用いれば、部品点数を減らし、切断又は切除のため上下のスペースも少なく特殊な冶具を使用しないでも製造することを可能とし、端子それぞれの高さをそろえやすいといった効果があり、容易に部品を搭載できることから、放熱、ノイズ遮蔽、樹脂の応力緩和や固定のための銅材も一緒に搭載しても組み立ての容易さは変わらないため、産業上利用可能性大なるものである。 As described above, if the micro joint terminal of the present invention is used, the number of parts can be reduced, and it is possible to manufacture without using a special jig with less vertical space for cutting or excision, and it is easy to align the height of each terminal. Since the parts can be easily mounted, the ease of assembly does not change even if copper materials for heat dissipation, noise shielding, resin stress relaxation and fixation are mounted together. It ’s great.

以下、本発明の実施の形態について図６を参照して説明する。図において1は銅の放熱板であり放熱の為のヒートシンクである。2は銅配線が溶接されたセラミックである。セラミックは絶縁の為の板である。３は銅配線でありセラミックに形成された銅配線である。４はシリコンチップであり本発明ではトランジスタチップを用いた。５は端子であり、ゲート、ソースなどの電極とリード端子とを電気的に接続する。６はマイクロジョイント部であり、非常に切断しやすいようになっていてはんだ付け後に除去される。７は樹脂でシリコンチップの保護のための樹脂である。ゲートとカソードは連結された状態ではんだ付けされ、マイクロジョイント部切断後、モールドされる。 Hereinafter, an embodiment of the present invention will be described with reference to FIG. In the figure, reference numeral 1 denotes a copper heat sink, which is a heat sink for heat dissipation. 2 is a ceramic to which copper wiring is welded. Ceramic is a plate for insulation. Reference numeral 3 denotes a copper wiring, which is a copper wiring formed in ceramic. 4 is a silicon chip, and a transistor chip was used in the present invention. Reference numeral 5 denotes a terminal, which electrically connects electrodes such as a gate and a source to a lead terminal. Reference numeral 6 denotes a micro joint part which is very easy to cut and is removed after soldering. 7 is a resin for protecting the silicon chip. The gate and the cathode are soldered in a connected state, and are molded after cutting the microjoint portion.

図１は本願発明で使用するマイクロジョイント部を持つ端子の一実施例図である。パッケージからの放熱の助け及びにモールド樹脂の応力緩和のため、端子をカソードとゲートを大きくしモールド内により多くの銅板を配置している。マイクロジョイント部を持つ端子をモールド内に残すようにすることで単に電極だけでなく放熱のための部品や樹脂との密着性を向上させるための部品、応力緩和の部品、インダクタンスを整合させるためなどの部品として使用している。マイクロジョイント部を持つ端子ははんだ付け工程前まで一体化された状態で取り扱われ、少ない部品点数で組み立て可能になっている。 FIG. 1 is an embodiment of a terminal having a micro joint used in the present invention. In order to aid heat dissipation from the package and relieve the stress of the mold resin, the cathode and gate of the terminal are made larger and more copper plates are arranged in the mold. By leaving terminals with micro joints in the mold, not only electrodes but also parts for heat dissipation, parts for improving adhesion with resin, parts for stress relaxation, to match inductance, etc. It is used as a part. Terminals with micro joints are handled in an integrated state before the soldering process and can be assembled with a small number of parts.

図３はマイクロジョイント部の形状例について記載したものである。
端子の厚さを変える方法や、幅を変える方法、材質を変える方法などいろいろと考えられるが本願はこれに限定されることなく、数々の変形例・応用可能である。金型等を用いなくとも簡単に切断できるような構造になっていれば、いかようにも応用が可能である。 FIG. 3 describes an example of the shape of the micro joint portion.
Various methods such as a method of changing the thickness of the terminal, a method of changing the width, and a method of changing the material are conceivable, but the present application is not limited to this, and various modifications and applications are possible. If the structure is such that it can be easily cut without using a mold, it can be applied in any way.

図６はマイクロジョイント部の拡大図でマイクロジョイント部分に曲げ、ねじり、引っ張りなどの機械的応力をかけることにより容易に切断又は切除可能としたものである。 FIG. 6 is an enlarged view of the micro joint part, which can be easily cut or excised by applying mechanical stress such as bending, twisting or pulling to the micro joint part.

本発明は、半導体装置一般に使用することができる。 The present invention can be used in general for semiconductor devices.

本発明の端子一実施例図Example of a terminal according to the present invention 複数マイクロジョイント部を持つ端子の実施例Examples of terminals with multiple micro joints マイクロジョイント部形状Micro joint shape 複数マイクロジョイント部を持つものでの製造例Manufacturing example with multiple micro joints 従来端子でトランジスタを製造した例Example of manufacturing transistors with conventional terminals 本願端子でトランジスタを製造した例An example of manufacturing a transistor with the terminal of this application マイクロジョイント部拡大図Micro joint enlarged view

符号の説明Explanation of symbols

１…銅板
２…セラミック板
３…銅配線
４…トランジスタチップ
５…端子
６…マイクロジョイント部
７…樹脂
８…切断又は切除部 1 ... Copper plate
2 ... Ceramic plate
3 ... Copper wiring
4 ... Transistor chip
5 ... Terminal
6 ... Micro joint part
7 ... resin
8 ... Cutting or excision

Claims (5)

半導体チップの電極とリード端子あるいは、半導体の端子と端子を電気的に接続するための金属のマイクロジョイント端子であって、前記マイクロジョイント端子は、容易に切断又は切除可能なマイクロジョイント部により連結されており、前記マイクロジョイント部を切断又は切除することにより、電気的に分割することを可能としたことを特徴とする半導体接続用マイクロジョイント端子。 A metal micro-joint terminal for electrically connecting a semiconductor chip electrode and a lead terminal or a semiconductor terminal and the terminal, the micro-joint terminal being connected by a micro-joint portion that can be easily cut or excised. A micro-joint terminal for semiconductor connection, wherein the micro-joint terminal can be electrically divided by cutting or excising the micro-joint portion. 前記マイクロジョイント部は金属の厚みが薄いか幅が細いマイクロジョイント部分が設けられており、前記マイクロジョイント部に応力をかけることにより、前記マイクロジョイント部を切断又は切除した請求項１の半導体接続用マイクロジョイント端子。 2. The semiconductor connection device according to claim 1, wherein the micro joint portion is provided with a micro joint portion having a thin metal thickness or a narrow width, and the micro joint portion is cut or excised by applying stress to the micro joint portion. Micro joint terminal. 前記マイクロジョイント部は他の部分よりも引っ張り強度の弱い異種の材料で構成されており、前記引っ張り強度の弱い異種の金属部分に応力をかけることにより、前記マイクロジョイント部を切断又は切除した請求項１のマイクロジョイント端子。 The micro joint part is made of a different material having a lower tensile strength than other parts, and the micro joint part is cut or excised by applying stress to the different metal part having a lower tensile strength. 1 micro joint terminal. 前記マイクロジョイント部は折り曲げ又は引っ張ることにより、簡単に切断又は切除できるようにした請求項１〜請求項３記載のマイクロジョイント端子。 4. The micro joint terminal according to claim 1, wherein the micro joint portion can be easily cut or cut by bending or pulling. 前記マイクロジョイント部には穴が設けられていることを特徴とした請求項１〜請求項４記載の接続用マイクロジョイント端子。





The micro joint terminal for connection according to claim 1, wherein a hole is provided in the micro joint portion.





JP2003270692A 2003-07-03 2003-07-03 Micro joint terminal for semiconductor connection Expired - Fee Related JP4822660B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003270692A JP4822660B2 (en) 2003-07-03 2003-07-03 Micro joint terminal for semiconductor connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003270692A JP4822660B2 (en) 2003-07-03 2003-07-03 Micro joint terminal for semiconductor connection

Publications (2)

Publication Number Publication Date
JP2005026623A true JP2005026623A (en) 2005-01-27
JP4822660B2 JP4822660B2 (en) 2011-11-24

Family

ID=34190586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003270692A Expired - Fee Related JP4822660B2 (en) 2003-07-03 2003-07-03 Micro joint terminal for semiconductor connection

Country Status (1)

Country Link
JP (1) JP4822660B2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161645A (en) * 1984-02-01 1985-08-23 Hitachi Ltd Semiconductor device
JPS62102549A (en) * 1985-10-29 1987-05-13 Dainippon Printing Co Ltd Etched product attached at multiple sides
JPH0722555A (en) * 1993-07-02 1995-01-24 Sony Corp Lead frame structure for semiconductor device and method of cutting
JPH0733838A (en) * 1993-07-21 1995-02-03 Sumitomo Bakelite Co Ltd Paste for tie bar
JPH10173009A (en) * 1996-12-09 1998-06-26 Toshiba Corp Manufacturing method of tab type and semiconductor device having it
JP2002100716A (en) * 2000-09-21 2002-04-05 Toshiba Corp Manufacturing method of semiconductor device, and the semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161645A (en) * 1984-02-01 1985-08-23 Hitachi Ltd Semiconductor device
JPS62102549A (en) * 1985-10-29 1987-05-13 Dainippon Printing Co Ltd Etched product attached at multiple sides
JPH0722555A (en) * 1993-07-02 1995-01-24 Sony Corp Lead frame structure for semiconductor device and method of cutting
JPH0733838A (en) * 1993-07-21 1995-02-03 Sumitomo Bakelite Co Ltd Paste for tie bar
JPH10173009A (en) * 1996-12-09 1998-06-26 Toshiba Corp Manufacturing method of tab type and semiconductor device having it
JP2002100716A (en) * 2000-09-21 2002-04-05 Toshiba Corp Manufacturing method of semiconductor device, and the semiconductor device

Also Published As

Publication number Publication date
JP4822660B2 (en) 2011-11-24

Similar Documents

Publication Publication Date Title
US7838340B2 (en) Pre-molded clip structure
JP5870200B2 (en) Semiconductor device manufacturing method and semiconductor device
TWI495055B (en) Semiconductor die package and method for making the same
US8278149B2 (en) Package with multiple dies
US9117815B2 (en) Method of fabricating a packaged semiconductor
US7701054B2 (en) Power semiconductor module and method for its manufacture
US7955954B2 (en) Method of making semiconductor devices employing first and second carriers
JP2004266096A (en) Semiconductor device and method for manufacturing it, and electronic device
WO2009017999A2 (en) Dual side cooling integrated power device package and module and methods of manufacture
JP4804497B2 (en) Semiconductor device
JP5930980B2 (en) Semiconductor device and manufacturing method thereof
TWI452662B (en) Dual side cooling integrated power device package and module and methods of manufacture
JP2017123360A (en) Semiconductor module
JPH11251508A (en) Insulating substance sealed electronic device and manufacture thereof
JP4822660B2 (en) Micro joint terminal for semiconductor connection
JP2013143519A (en) Connector and resin sealed type semiconductor device
JP2005191367A (en) Semiconductor device and its manufacturing method
JP5119092B2 (en) Manufacturing method of semiconductor device
JP2005026624A (en) Method for manufacturing resin sealed semiconductor device
US11404336B2 (en) Power module with metal substrate
JP2008053515A (en) Semiconductor device and manufacturing method thereof
JP2000124251A (en) Semiconductor device, manufacture thereof, circuit board and electronic equipment
JP2005197593A (en) Lead frame and method of manufacturing the same

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060207

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060829

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090204

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090401

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100511

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100616

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110628

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110802

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110906

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110906

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140916

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees