JPS62102549A - Etched product attached at multiple sides - Google Patents
Etched product attached at multiple sidesInfo
- Publication number
- JPS62102549A JPS62102549A JP24222185A JP24222185A JPS62102549A JP S62102549 A JPS62102549 A JP S62102549A JP 24222185 A JP24222185 A JP 24222185A JP 24222185 A JP24222185 A JP 24222185A JP S62102549 A JPS62102549 A JP S62102549A
- Authority
- JP
- Japan
- Prior art keywords
- etched
- connecting bar
- lead frame
- etching
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置用リードフレーム等の多面付けエツ
チング製品に係り、更Ｉユ詳しくは単一エツチング製品
或は複数個連続したエツチング製品連続体が連結バーを
介して連結され、更に一邪のエツチング製品が外枠に連
結バーを介して連結され、外枠（二より複数のエツチン
グ製品が支持されている個々のエツチング製品に分離す
る以前の多面付けした半導体装置用リードフレーム専の
エツチング製品に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a multi-faceted etched product such as a lead frame for a semiconductor device, and more specifically to a single etched product or a series of multiple etched products. are connected via a connecting bar, and one etching product is connected to the outer frame via a connecting bar, and the outer frame (two or more etching products are supported before being separated into individual etching products). Concerning etching products specifically for multi-faceted lead frames for semiconductor devices.
現在、半導体装置用リードフレームはプレス（；よって
打ち抜いて任意の形状に形成してなるものとエツテング
によって任意の形状に形成してなるものとがあるが、後
者の従来例をあげて説明すると、リードフレームは第５
区に示すようにリードフレーム外枠（１１１ｍ連結バー
（２）で接続固定された形状にフォトエツチング法によ
り製造され、エツチング工程完了後、第６図示のように
連結バー（２）を切断して外枠（１）から切り離され、
複数個（例えば５１固）のリードフレームが横方向に連
続したたんざく状のリードフレーム連続体が得られる。Currently, there are two types of lead frames for semiconductor devices: those formed by punching into any shape by pressing, and those formed into any shape by etching.To explain the latter conventional example, The lead frame is the fifth
The outer frame of the lead frame (111 m) was manufactured by photo-etching into a shape connected and fixed with connecting bars (2) as shown in Figure 6. After the etching process was completed, the connecting bars (2) were cut as shown in Figure 6. separated from the outer frame (1),
A strip-shaped lead frame continuum in which a plurality of lead frames (for example, 51 pieces) are continuous in the transverse direction is obtained.
次いでこのたんざく状のリードフレーム連続体は例えば
２本のレールよりなる搬送路を経て１ＡｖＡ次検量工程
へ送られるのであるが、外枠（１）から切り離されある
いは、リードフレーム相互が切り離されたリードフレー
ム連続体のリードフレーム枠部分に切断跡の突起（５）
が出っ張って存在するため、搬送路上を複数のリードフ
レーム連続体を整列させて検査工程へ順次送る過程で、
リードフレーム連続体の有する突起（５）がｇＥ ９−
ドフレーム連続体１；説いて送られる次のリードフレー
ム連続体を傷つけることがある。Next, this tanzaku-shaped continuous lead frame is sent to the 1AvA next calibration process via a conveyance path consisting of, for example, two rails, but it is separated from the outer frame (1) or the lead frames are separated from each other. Protrusions with cutting marks on the lead frame frame part of the lead frame continuum (5)
Because of the presence of protrusions, in the process of lining up multiple lead frame continuums on the conveyance path and sending them sequentially to the inspection process,
The protrusion (5) of the lead frame continuum is gE 9-
Lead frame continuum 1: It may damage the next lead frame continuum to be sent.
父、突起（５）が存在することにより、各リードフレー
ム連続体を正しく送り方向に向けて送ることがむづかし
く、送り方向に対して斜めに同いたまま、送られてしま
うことが少なくなく、そのため、リードフレーム連続体
同志がぶつかりあい、傷或は変形を生せしめることがあ
る。また、搬送路（二つかえて搬送が止まることもある
。However, due to the presence of the protrusion (5), it is difficult to feed each lead frame continuum in the correct feeding direction, and it is often the case that the lead frames are fed diagonally in the same direction with respect to the feeding direction. Therefore, the continuous lead frames may collide with each other, causing damage or deformation. In addition, the conveyance may stop after changing the conveyance path (two conveyance paths).
更に前記したような事故けエッチング加工したリードフ
レーム連続体を部分メッキの工程に送る搬送過程でも同
様におこり得る。Furthermore, the same problem may occur during the transportation process in which the lead frame series subjected to accidental etching is sent to the partial plating process as described above.
更（；エツチング加工されたリードフレームは半導体装
置組型工程（二速られる過程（二おいても支障が発生す
る。即ち、リードフレーム送り作業には主（ユ多くのリ
ードフレームを連ねた状態で自動送りする自動送り装置
が用いられているが、突起（５）の存在により隣接する
リードフレーム間にすき間が生じ、次に来るリードフレ
ームの送り穴の位置が狂い、スムーズに自動送りが行わ
れない状態が生じる。Further, the etched lead frame is used in the semiconductor device assembly process (secondary speed process). An automatic feeding device is used, but the presence of the protrusion (5) creates a gap between adjacent lead frames, which disturbs the position of the feed hole in the next lead frame, preventing smooth automatic feeding. A situation arises where there is no such thing.
上記の問題点を解消するために半導体装置用リードフレ
ームを形成する途中工程でリードフレームを支える外枠
（二連結バーを介して連続されているリードフレームに
おいて、連結バーの付け根Ｃ：当るリードフレーム枠に
切り欠き部を設け、連結バーの切断部がリードフレーム
枠から外１１ＵＩ ｔ＝突き出ないように構成した第７
図示のようなリードフレームが発明された（特公昭６０
−２９２２６号公報参照）。In order to solve the above problems, the outer frame that supports the lead frame during the process of forming a lead frame for a semiconductor device (in a lead frame that is connected via two connecting bars, the base C of the connecting bar: the contacting lead frame) A seventh device in which a notch is provided in the frame so that the cut portion of the connecting bar does not protrude outside the lead frame frame.
The lead frame shown in the figure was invented
(Refer to Publication No.-29226).
しかしながら、そのように構成したものは外枠から切り
離されたのちは第８図示の如（切り欠は部（６）が残り
、この状態のまま、搬送路を経て検査工程、或は部分メ
ッキ工程へ送るとり−Φ
ドフレーム連続体の有する切り欠は部（滲）が該リード
フレーム連続体に続いて送られる次のリードフレーム連
続体のリードフレーム枠部分にひっかかったり、或は搬
送路のレールにひっかかってしまうことがあり、送り作
業がスムースにいかない。However, after such a structure is separated from the outer frame, the cutout (6) remains as shown in Figure 8, and in this state it is passed through the conveyance path to the inspection process or partial plating process. The notch (bleed) of the continuous lead frame may get caught on the lead frame frame of the next continuous lead frame that is sent following the continuous lead frame, or the rail of the conveyance path may The paper may get caught in the paper, and the feeding process may not go smoothly.
そこで本発明が解決しようとする問題点は検査工程、部
分メッキ工程、或は組立工程に送る搬送過程（−おいて
前述したような問題を生ぜしめない多重性Ｔｊ した半
導体装置用リードフレーム等のエツチング製品を提供す
ること（＝ある。Therefore, the problem to be solved by the present invention is to develop lead frames for semiconductor devices that do not cause the above-mentioned problems during the inspection process, partial plating process, or transportation process for sending to the assembly process (-). Providing etching products (= exists).
本発明者は上記の問題点を解決すべく研究の結果、エツ
チング製品と外枠間及びエツチング製品相互間を連■す
る連結バーの付け根に続くエツチング製品周辺領域の片
面側（二段エツチング製品周辺領域の辺に宿った第１の
半切れ溝加工部を刻設し、且つ遅稍バーの付け根領域（
二第１の半切れ溝加工部を刻設した面と反対面側にＭｉ
Ｊ記エツチング製品周辺ｍ域の辺（−宿って第２の半切
れ溝加工部を刻設することにより、連結バーを切り離し
たのちの切断跡をエツチング製品周辺領域の辺上にさち
んと形成することがでさることを見いたし、かかる知見
にもとづいて本発明な構成したものである。As a result of research to solve the above-mentioned problems, the present inventor found that one side of the area around the etched product (around the two-stage etched product) following the base of the connecting bar that connects the etched product and the outer frame and between the etched products. The first half-cut groove processing part located on the side of the area is carved, and the root area of the slow-burning bar (
2. Mi on the side opposite to the surface on which the first half-cut groove was carved
By carving a second half-cut groove on the side of area m around the etched product (J), the cutting marks after separating the connecting bar are neatly formed on the side of the area around the etched product. We have found that this is possible, and the present invention has been constructed based on this knowledge.
本発明の多重性けエッチング製品は小−エツチング製品
、或は複数個連続したエツチング製品連続体が連結バー
を介して１ａ！詰され、更に一邪のエツチング製品が外
枠（＝連結バーを介して連結され、外枠により複数のエ
ツチング製品が支持されている個々のエツチング製品に
分離丁る以前の多重性けエッチング製品にＨいて、連結
バーの付け根に続くエツチング製品周辺領域の片面側に
譲エツチング製品周辺匍域の辺に宿った弔１の半切れ溝
加工部を刻設し、且つ連結バーの付け根領域に第１の半
切れ溝加工部を刻設した簡と反対面側に前記エツチング
製品周辺頭載の辺１ユ揖って第２の半切れ溝加工部を刻
設したものである。The multiple etching product of the present invention is a small etching product or a series of multiple etching products connected via a connecting bar to 1a! The etching products are connected via an outer frame (= connecting bar, and multiple etching products are supported by the outer frame.) Then, on one side of the area surrounding the etched product following the base of the connecting bar, a half-cut groove of the groove 1 located on the side of the area around the etched product is carved, and a first groove is carved in the base area of the connecting bar. A second half-cut grooved portion is carved on the opposite side of the strip on which the half-cutted grooved portion is carved, one side of which the etching product is mounted on the periphery.
間して本発明（二ｇいて、第１、及び第２の半切れ溝加
工部けエッチング製品をエツチング加工するとき、ハー
フエツチング加工により形成することかでさる。However, according to the present invention, when etching the first and second half-groove etched products, it is possible to form them by half-etching.
本発明において、エツチング製品周辺部の辺にｔａい、
且つ相互に相反する面側に位置して設けられた第１、及
び第２の半切溝加工部は連結バーのエツチング製品から
の切り離しを容易ならしめ、切断線をエツチング製品周
辺部の辺上に形成することを可能ならしめる。In the present invention, a tassel is attached to the peripheral area of the etching product.
In addition, the first and second half-cut grooves provided on opposing surfaces facilitate the separation of the connecting bar from the etched product, and align the cutting line on the edge of the etched product's periphery. make it possible to form.
実施例１
厚み０．２５０ ｍｔａのＦ’ｅ−Ｎｉ−Ｃｏ＠金のコ
バー板を用怠し、該コバー板上（二感光！（Ｇ−９０（
東京応化製））を室布し乾燥した。Example 1 A F'e-Ni-Co@gold cover plate with a thickness of 0.250 mta was used, and on the cover plate (two-sensitivity! (G-90)
(manufactured by Tokyo Ohka)) was placed in a room cloth and dried.
次にリードフレームの原版を密右させ露光し現像して前
記コバー板にレジストパターンを形成したのち、エツチ
ング液（６０“（／ ＋ ４６ Ｂθ′の塩化第二鉄溶
液）を吹き付けて、第１図及び第２図示のように連結バ
ー（２）の付け根（＝続くリードフレーム枠（３）領域
の片面側にリードフレーム枠（３）の辺（８）に宿った
深さ０．１６０涌鳳、幅０．１６０〜０．２００の第１
の半切れ溝加工部（７’）、がハーフエツチングにより
刻設され、且つ連結バー（２）の付け根領域に第１の半
切れ溝加工部（７Ｔ）をシリ没した面と反対面側にリー
ドフレーム枠（３）の辺（８）に宿って第２の半切れ溝
加工部（７）がハーフエツチングにより（７・）を刻設
したとさと同様な条件で刻設され、且つ連結バー＋２１
の付け根が先細り形状の、小３図示のような全体形状の
多面付半導体装置用リードフレームエツチング製品を得
た。Next, the original plate of the lead frame was exposed to light and developed to form a resist pattern on the cover plate, and then an etching solution (ferric chloride solution of 60" (/ + 46 Bθ') was sprayed to form the first pattern. As shown in the figure and the second figure, the base of the connecting bar (2) (= a depth of 0.160 Wakuho located on the side (8) of the lead frame frame (3) on one side of the continuing lead frame frame (3) area) , the first width 0.160-0.200
A half-cut grooved part (7') is carved by half-etching, and a first half-grooved part (7T) is formed in the base area of the connecting bar (2) on the side opposite to the face where it is recessed. A second half-cut groove (7) is formed on the side (8) of the lead frame frame (3) under the same conditions as when (7) was formed by half-etching, and the connecting bar is +21
A multifaceted lead frame etching product for a semiconductor device was obtained which had a tapered base and an overall shape as shown in the small 3 figure.
連結バー（２）をリードフレーム枠（３）から折り曲げ
切断したところ、第４因示の如（切断線がリードフレー
ム枠の辺上に位置した状態で両者を分離することかでさ
た。When the connecting bar (2) was bent and cut from the lead frame frame (3), it was found that the two were separated with the cutting line positioned on the side of the lead frame frame as shown in the fourth example.
実施例２
１００μｍ厚さの５ＵＳ−３０４上にカゼイン系フォト
レジストａ−９０（東京応化裂）をを布し、９０”Ｃ，
２０分の加熱乾燥をした。Example 2 A casein-based photoresist A-90 (Tokyo Ohka Raku) was coated on 5US-304 with a thickness of 100 μm, and 90”C,
It was heated and dried for 20 minutes.
次にディスプレイ用メツシュ電極の原版を密書させ、露
光し、現像してレジストパターンを形成したのち、エツ
チング液（６Ｄ ’（Ｊ Ｉ ４６ ’Ｂｅ’の塩化第
二鉄溶液）を吹き付けて、ディスプレイ用メツシュ電極
部分と外枠間をつなぐ連結バーの付け根（−続くディス
プレイ用メツシュ屯極周辺部領域の片面側にディスプレ
イ用メツシュ′電極周辺部領域の辺（−沿った深さ０．
０６０〜０．０７０＋ｉｉ 、幅０．１６０〜０．２０
０１の第１の半切れ溝加工部が刻設され、且つ連結バー
の付け領域（二弔１の半切れ溝加工部を刻設した面と反
対面側にディスプレイ用メツシュ屯極周辺ＷＬ６Ｂ域の
辺に浴って第２の半切れ溝加工部が刻設された多面付デ
ィスプレイ用メツシュ、＝ｉｔ［エツチング製品を得た
。Next, the original plate of the mesh electrode for display was secretly written, exposed and developed to form a resist pattern, and etching solution (6D' (ferric chloride solution of J I 46 'Be') was sprayed to form the original plate for display. The base of the connection bar that connects the mesh electrode part and the outer frame (-) is placed on one side of the display mesh electrode peripheral area (-) at a depth of 0.
060~0.070+ii, width 0.160~0.20
The first half-cut grooved portion of No. 01 is carved, and the area where the connection bar is attached (the surface opposite to the surface on which the half-cut grooved portion of No. 1 is carved) is the WL6B area around the display mesh turret. A multi-sided display mesh having a second half-grooved part etched along the sides, =it [An etched product was obtained.
連結バーをディスプレイ用メツシュ電極周辺部から折り
曲げ切断したところ、切断線がディスプレイ用メツシュ
が極用辺部の辺上にはマ位置した状態で両者を分離する
ことかでさた。When the connecting bar was bent and cut from the periphery of the display mesh electrode, the cutting line separated the two with the display mesh being located on the edge of the electrode.
以上、詳記したゴ１す、本発明の多重性けエッチング製
品は切＋Ｔｈ線がエツチング製品の周辺部（二溢うよう
に連結バーをエツチング製品から切断して外枠から分離
できるので検査工程や部分メッキ工程へ送る搬送工程で
問題を生せしめることがない利点を有するものである。As detailed above, the multiple etching product of the present invention can be separated from the outer frame by cutting the connection bar from the etching product so that the cutting + Th rays are not exposed to the periphery of the etching product and separating it from the outer frame during the inspection process. This has the advantage that it does not cause any problems during the transport process to the partial plating process or to the partial plating process.
第１内及び第２図は本発明の多重性（ナエッチング製品
の例の主要部を示し、第１図は部分平面図、第２１図は
部分断面図、第５図は本発明の多面性けエッチング製品
の例の全体を示す平面図、第４図は連結バーをエツチン
グ製品から切り離した状態の平面図、第５図は従来の多
面性けエッチング製品の平面図、夷６因は第５図示のも
ののエツチング製品を外枠から切離した状態を示す平面
図、第７図は従来の別の多面性けエッチング製品の平面
図、第８因は第７図示のもののエツチング製品を外枠か
ら切離した状態な示す平面図である。
（１）・・・・・・・・・・・・・・・リードフレーム
等エツチング製品多面付レイアウトの外枠
（３）・・・・・・・・・・・・・・・リードフレーム
枠（エツチング製品周辺領域）
（２）・・・・・・・・・・・・・・・連結バー（７゛
Σ・・・・・・・・・・・・・・！！′Ｓ１の半切れ溝
加工部（７）・・・・・・・・・・・・・・・第２の半
切れ溝加工、砦、（８）・・・・・・・・・・・・・・
・リードフレーム枠等エツチング製品周辺碩域の最外周
辺
第１図
第２図
第３図
′＄４図
第５図
第６図Figures 1 and 2 show the main parts of an example of the multifaceted etched product of the present invention; Figure 1 is a partial plan view, Figure 21 is a partial sectional view, and Figure 5 is a multidimensional view of the present invention FIG. 4 is a plan view showing the connection bar separated from the etching product; FIG. 5 is a plan view of a conventional multifaceted etching product; FIG. 7 is a plan view of another conventional multifaceted etching product. The eighth factor is when the etched product shown in FIG. 7 is separated from the outer frame. (1) Outer frame of multi-sided layout of etched products such as lead frames (3)・・・・・・Lead frame frame (peripheral area of etched product) (2)・・・・・・・・・・・・Connection bar (7゛Σ・・・・・・・・・・・・...!!'S1 half-groove machining part (7)...... Second half-groove machining, fort, (8)...・・・・・・・・・
・Outermost periphery of etching product surrounding area such as lead frame frame, etc. Figure 1 Figure 2 Figure 3 '$4 Figure 5 Figure 6
Claims (2)
ング製品連続体が連結バーを介して連結され、更に一部
のエッチング製品が外枠に連結バーを介して連結され、
外枠により複数のエッチング製品が支持されている個々
のエッチング製品に分離する以前の多面付けエッチング
製品において、連結バーの付け根に統くエッチング製品
周辺領域の片面側に該エッチング製品周辺領域の辺に沿
つた第１の半切れ溝加工部を刻設し、且つ連結バーの付
け根領域に第１の半切れ溝加工部を刻設した面と反対面
側に前記エッチング製品周辺領域の辺に沿つて第２の半
切れ溝加工部を刻設したことを特徴とする多面付けエッ
チング製品。(1) A single etched product or a series of multiple etched products are connected via a connecting bar, and some of the etched products are further connected to the outer frame via the connecting bar,
In a multi-sided etched product before separation into individual etched products in which multiple etched products are supported by an outer frame, on one side of the etched product peripheral area connected to the base of the connecting bar, there is a A first half-cut grooved portion is carved along the side of the peripheral region of the etched product on the side opposite to the surface on which the first half-grooved portion is carved in the base region of the connecting bar. A multi-sided etching product characterized by having a second half-cut grooved part engraved.
とを特徴とる特許請求の範囲第１項記 載の多面付けエッチング製品。(2) The multi-sided etched product according to claim 1, wherein the base of the connecting bar is formed into a tapered shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24222185A JPH0770663B2 (en) | 1985-10-29 | 1985-10-29 | Multi-faced etching products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24222185A JPH0770663B2 (en) | 1985-10-29 | 1985-10-29 | Multi-faced etching products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62102549A true JPS62102549A (en) | 1987-05-13 |
| JPH0770663B2 JPH0770663B2 (en) | 1995-07-31 |
Family
ID=17086036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24222185A Expired - Fee Related JPH0770663B2 (en) | 1985-10-29 | 1985-10-29 | Multi-faced etching products |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770663B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391439A (en) * | 1990-09-27 | 1995-02-21 | Dai Nippon Printing Co., Ltd. | Leadframe adapted to support semiconductor elements |
| US5437915A (en) * | 1992-01-17 | 1995-08-01 | Hitachi, Ltd. | Semiconductor leadframe and its production method and plastic encapsulated semiconductor device |
| JP2005026623A (en) * | 2003-07-03 | 2005-01-27 | Shindengen Electric Mfg Co Ltd | Micro joint terminal for connecting semiconductor |
| JP2006216881A (en) * | 2005-02-07 | 2006-08-17 | Toppan Printing Co Ltd | Embedded lead frame, manufacturing method thereof and semiconductor device |
| JP2009158828A (en) * | 2007-12-27 | 2009-07-16 | Shinko Electric Ind Co Ltd | Cutting method of bridge of lead frame sheet |
| US20160195419A1 (en) * | 2012-12-21 | 2016-07-07 | Innovative Sensor Technology Ist Ag | Sensor for Determining a Process Variable of a Medium |
-
1985
- 1985-10-29 JP JP24222185A patent/JPH0770663B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391439A (en) * | 1990-09-27 | 1995-02-21 | Dai Nippon Printing Co., Ltd. | Leadframe adapted to support semiconductor elements |
| US5437915A (en) * | 1992-01-17 | 1995-08-01 | Hitachi, Ltd. | Semiconductor leadframe and its production method and plastic encapsulated semiconductor device |
| JP2005026623A (en) * | 2003-07-03 | 2005-01-27 | Shindengen Electric Mfg Co Ltd | Micro joint terminal for connecting semiconductor |
| JP2006216881A (en) * | 2005-02-07 | 2006-08-17 | Toppan Printing Co Ltd | Embedded lead frame, manufacturing method thereof and semiconductor device |
| JP4506491B2 (en) * | 2005-02-07 | 2010-07-21 | 凸版印刷株式会社 | Imposition lead frame, manufacturing method thereof, and semiconductor device |
| JP2009158828A (en) * | 2007-12-27 | 2009-07-16 | Shinko Electric Ind Co Ltd | Cutting method of bridge of lead frame sheet |
| US20160195419A1 (en) * | 2012-12-21 | 2016-07-07 | Innovative Sensor Technology Ist Ag | Sensor for Determining a Process Variable of a Medium |
| US10345129B2 (en) * | 2012-12-21 | 2019-07-09 | Innovative Sensor Technology Ist Ag | Sensor with metal substrate and dielectric membrane for determining a process variable of a medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0770663B2 (en) | 1995-07-31 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |