JPS59175146A - Lead frame element material - Google Patents

Lead frame element material

Info

Publication number
JPS59175146A
JPS59175146A JP4917283A JP4917283A JPS59175146A JP S59175146 A JPS59175146 A JP S59175146A JP 4917283 A JP4917283 A JP 4917283A JP 4917283 A JP4917283 A JP 4917283A JP S59175146 A JPS59175146 A JP S59175146A
Authority
JP
Japan
Prior art keywords
cutting
frame
lead frame
element material
guide holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4917283A
Other languages
Japanese (ja)
Inventor
Kimio Yoshioka
吉岡 公男
Osamu Hirohashi
広橋 修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP4917283A priority Critical patent/JPS59175146A/en
Publication of JPS59175146A publication Critical patent/JPS59175146A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To enable to discriminate the back and front and the right and left of the cut lead frame element material by forming so that only one of four guide holes at cutting positions is of a shape different from that of other holes, and that cutouts generate at corners of the element material after cutting. CONSTITUTION:Guide holes 6 for counting at cutting positions of one frame of the lead frame element material are formed, at every other line, as guide holes 63 of the form of note that are not symmetric right and left, whose left half is semi-circular and right one leads to the outer edge of the frame 1. After cutting, the hole is divided into a semi-circular recess 64 and a cutout 65. Semi-circular recesses 61, 62, and 64 are formed at three points of guide hole cutting parts at four corners, and the cutout parts 65 is formed only at a point. Therefore, the discrimination of the front and back and the right and left of this cutting element material is easy, and accordingly it comes proved whether the frames are stacked in a wrong direction or not based on the succession of the cutouts in one of the four corners even in the stacked state.

Description

【発明の詳細な説明】 〔発明の属する技術分野〕 本発明は長尺の条として製造され、その長尺の条から所
定の数単位リードフレームを連続させて切断分割し、そ
の後のめつき、素子の装着あるいはボンディングなどの
作業が行われるリードフレーム素材に関する。
Detailed description of the invention [Technical field to which the invention pertains] The present invention is manufactured as a long strip, and a predetermined number of unit lead frames are successively cut and divided from the long strip, followed by plating, It relates to lead frame materials on which operations such as mounting and bonding of elements are performed.

〔従来技術とその問題点〕[Prior art and its problems]

第1図は通常のIC用リードフレーム素材を示し、両側
に枠1を有し、ICペレットが装着されるアイランド部
分2と複数のリード部3からなるフレーム内部10が連
結体4および5を介してその枠1に支持されている。双
方の枠1には、計数用ガイド穴6と送り用ガイド穴7が
交互に両枠において互に対向する位置に明けられている
。このようなリードフレーム素材は金属帯を送りながら
プレスにより打抜き成形を繰返し、リールに巻き取った
長尺物として製造されるが、半導体工場におけるめっき
、素子の装着、ワイヤボンディングあるいは封止などの
作業は長尺のままでは作業性がよくないので、例えば1
0単位ずつのリードフレームをまとめて処理できるよう
に計数用ガイド穴6の中心線上において切断される。第
2図は3単位分のリードフレームに対する切断後の枠1
0部分のみを示し、フレーム内部1oの図示は省かれて
いる。すなわち、第3図に拡大して示されたフレーム1
は第4図に示すようにガイド穴6の中心線上において切
断されるので、切断部には半円状の凹部61.62が形
成される。四部61.62は全く同じ形状なので、たと
えフレーム内部10はSILパッケージ用リードフレー
ムのように左右対称でない形状であったとしても枠1に
ついては表、裏、左、右を逆にした場合にも容易に判別
することができず、積重ねられて外部からは枠1の側面
のみより見えない時には逆向きのものが入っていても外
観から見付けだすことができない。
FIG. 1 shows a typical IC lead frame material, which has a frame 1 on both sides, and an inner frame 10 consisting of an island portion 2 on which an IC pellet is mounted and a plurality of lead portions 3 is connected via connectors 4 and 5. and is supported by its frame 1. In both frames 1, counting guide holes 6 and feeding guide holes 7 are alternately formed at opposing positions in both frames. These lead frame materials are manufactured as long products by repeatedly punching and forming a metal strip using a press and winding it onto a reel. However, it is used in processes such as plating, element mounting, wire bonding, and sealing in semiconductor factories. It is not easy to work if the length is long, so for example 1
The lead frame is cut on the center line of the counting guide hole 6 so that lead frames of 0 units each can be processed at once. Figure 2 shows frame 1 after cutting for 3 units of lead frame.
Only the 0 part is shown, and the illustration of the frame interior 1o is omitted. That is, frame 1 shown enlarged in FIG.
is cut on the center line of the guide hole 6 as shown in FIG. 4, so semicircular recesses 61 and 62 are formed in the cut portion. The four parts 61 and 62 have exactly the same shape, so even if the inside of the frame 10 has an asymmetrical shape like a lead frame for an SIL package, the frame 1 can be used even if the front, back, left, and right sides are reversed. They cannot be easily distinguished, and when they are stacked and cannot be seen from the outside only from the side of the frame 1, they cannot be found from the outside even if there is something in the opposite direction.

そのため積重ねたリードフレームについて作業を行う場
合には素子の取付けを誤った面に行うことがしばしばあ
った。これを避けるため第5図および第6図に示すよう
に一方の枠1に判別マーク8あるいは9を付けることが
行われる。しかしこのようなマーク8.9は通常リード
フレーム打抜きの際同時に形成されるので、一定間隔毎
に素材に形成される。従って表、裏の判別には用いるこ
とができるが左、右の判別は不可能である。表裏の判別
は積重ねられたリードフレーム素材切断材を積重ね方向
から見てマーク8の場合は連続した溝として見通せるか
、マーク9の場合は積重ね体を貫通する穴として見通せ
るかによって行う。そのように見えない場合は表、裏を
逆にして積重ねられたものがあることが判別できるもの
の、積重ねられたものから誤った向きのものを取り出す
ことには困難があった。
Therefore, when working on stacked lead frames, devices were often mounted on the wrong side. In order to avoid this, a discrimination mark 8 or 9 is attached to one of the frames 1, as shown in FIGS. 5 and 6. However, such marks 8.9 are usually formed at the same time when the lead frame is punched out, so they are formed on the material at regular intervals. Therefore, it can be used to distinguish between front and back, but it is impossible to distinguish between left and right. Discrimination between front and back is performed by looking at the stacked cut lead frame materials from the stacking direction and checking whether the mark 8 can be seen as a continuous groove or the mark 9 can be seen as a hole penetrating the stack. If it does not look like this, it can be determined that there are items that have been stacked with the front and back reversed, but it is difficult to take out items that are oriented in the wrong direction from the stack.

〔発明の目的〕[Purpose of the invention]

本発明は、上述の欠点を除去して連続した複数のリード
フレーム単位として切断されたリードフレーム素材の表
、裏、左、右の判別を可能にし、積重ねた状態でも誤っ
た向きに積重ねたものを見つけて容易に取り出すことが
できるリードフレーム素材を安価で簡単なやり方で提供
することを目的きする。
The present invention eliminates the above-mentioned drawbacks and makes it possible to distinguish the front, back, left, and right sides of lead frame materials cut into a plurality of continuous lead frame units, and even when stacked in the wrong direction. The purpose of the present invention is to provide lead frame materials that can be easily found and taken out at low cost and in a simple manner.

〔発明の要点〕[Key points of the invention]

本発明は、切断された素材の四隅にあるガイド穴切断部
のうちの一つのみが枠の外縁まで通ずる形状を有するよ
うに、一方の枠の切断位置にあるガイド穴は一つおきに
左右非対称で素材の幅方向に通る中心線の一方の側のみ
が枠の外縁に開くように形成されることによって上記の
目的を達成するO 〔発明の実施例〕 第7図は本発明の一実施例を示し、リードフレーム素材
の枠の一方の切断位置にある計数用ガイド穴6は一つお
きに左右対称でなく、左半分は半円であるが、右半分は
枠1の外縁11まで通ずるような音符形の形状のガイド
穴63として形成される。従って切断した後は第8図に
示すように半円状凹部64と切欠き部65とに分かれる
。第9図は切断後のリードフレーム素材の両枠1のみを
示し、四隅にあるガイド穴切断部のうち3個所には半円
状の凹部61.62.64が形成され、1個所のみ切欠
き部65が形成され、ている。従ってこの切断素材の表
、裏、左、右の判別が容易であり、積重ねた状態でも四
つの角の一つに切欠きが連続しているかどうかによって
誤った向きに積重ねられたものの有無が判かり、切欠き
部から突出しているものを取り出せば誤った向きのもの
を取り出すことになるから処置も容易になる。
In the present invention, the guide holes at the cutting position of one frame are arranged at every other corner on the left and right so that only one of the cut parts of the guide holes at the four corners of the cut material has a shape that extends to the outer edge of the frame. The above object is achieved by being asymmetric and formed so that only one side of the center line passing in the width direction of the material opens to the outer edge of the frame. As an example, every other counting guide hole 6 at one cutting position of the frame of the lead frame material is not symmetrical, the left half is a semicircle, but the right half extends to the outer edge 11 of the frame 1. The guide hole 63 is formed in the shape of a musical note. Therefore, after cutting, it is divided into a semicircular recess 64 and a notch 65 as shown in FIG. FIG. 9 shows only the frames 1 of the lead frame material after cutting, and semicircular recesses 61, 62, and 64 are formed in three of the cut portions of the guide holes at the four corners, and only one is cut out. A portion 65 is formed. Therefore, it is easy to distinguish between the front, back, left, and right sides of the cut materials, and even when the materials are stacked, it is possible to determine whether or not there is a notch in one of the four corners that is stacked in the wrong direction. In addition, if you remove the item protruding from the notch, you will be removing the item in the wrong direction, making the process easier.

〔発明の効果〕〔Effect of the invention〕

以上述べたように本発明は切断位置にある四つのガイド
穴のうちの一つのみが他の穴き異なった形状で、切断後
素材の角に切欠きが生ずるように 5− 形成することにより切断リードフレーム素材の表。
As described above, in the present invention, only one of the four guide holes at the cutting position has a different shape from the other holes, so that a notch is formed at the corner of the material after cutting. Table of cutting lead frame material.

裏、左、右の判別、ならびに誤って積重ねた素材の取り
出しが容易にするものである。そのようなガイド穴は打
抜き金型の形状により容易に製作できるので特別な工程
を必要とせず安価に入手でき、得られる本発明の効果は
極めて大きい。
This makes it easier to distinguish between the back, left, and right, as well as to take out incorrectly stacked materials. Since such a guide hole can be easily manufactured by changing the shape of a punching die, no special process is required and it can be obtained at low cost, and the effects of the present invention obtained are extremely large.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のIC用リードフレーム素材の一例の平面
図、第2図はその切断後の状態を両枠についてのみ示し
た平面図、第3図はその枠の一部分の切断前の拡大平面
図、第4図は切断後の拡大平面図、第5図、第6図はそ
れぞれ別の従来例の枠の一部分の拡大平面図、第7図は
本発明の一実施例の枠の一部分の切断前の拡大平面図、
第8図はその切断後の拡大平面図、第9図はその切断後
のリードフレーム素材の状態を両枠についてのみ示した
平面図である。 1・・・リードフレーム枠、6・・計数用ガイド穴、6
1.62・・・切断後にできる半円状凹部、63・・・
左右非対称ガイド穴、64・・・切断後できる半円状 
6− 凹部、65 切断後できる切欠部。 −7− 才3閃 −ra区 才Sロ ヤbス 才10
Fig. 1 is a plan view of an example of a conventional IC lead frame material, Fig. 2 is a plan view showing only both frames after cutting, and Fig. 3 is an enlarged plan view of a portion of the frame before cutting. 4 is an enlarged plan view after cutting, FIGS. 5 and 6 are enlarged plan views of a portion of a frame of another conventional example, and FIG. 7 is an enlarged plan view of a portion of a frame of an embodiment of the present invention. Enlarged plan view before cutting,
FIG. 8 is an enlarged plan view after cutting, and FIG. 9 is a plan view showing the state of the lead frame material after cutting only for both frames. 1...Lead frame frame, 6...Guide hole for counting, 6
1.62...Semicircular recess formed after cutting, 63...
Left and right asymmetrical guide hole, 64...Semicircular shape created after cutting
6- recess, 65 notch formed after cutting. -7- Sai 3 Sen-ra Ward Sai S Roya b Su Sai 10

Claims (1)

【特許請求の範囲】[Claims] 1)両側の枠に存在するガイド穴の中心線上において切
断し等しい長さに分割されてその後の作業が行われるも
のにおいて、一方の枠の切断位置に存在するガイド穴が
一つおきに左右非対称で素材の幅方向に通る中心線の一
方の側のみが枠の外縁に開いたことを特徴とするリード
フレーム素材。
1) When cutting on the center line of the guide holes in both frames and dividing into equal lengths for subsequent work, every other guide hole in the cutting position of one frame is asymmetrical. A lead frame material characterized in that only one side of the center line running in the width direction of the material is open to the outer edge of the frame.
JP4917283A 1983-03-24 1983-03-24 Lead frame element material Pending JPS59175146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4917283A JPS59175146A (en) 1983-03-24 1983-03-24 Lead frame element material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4917283A JPS59175146A (en) 1983-03-24 1983-03-24 Lead frame element material

Publications (1)

Publication Number Publication Date
JPS59175146A true JPS59175146A (en) 1984-10-03

Family

ID=12823644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4917283A Pending JPS59175146A (en) 1983-03-24 1983-03-24 Lead frame element material

Country Status (1)

Country Link
JP (1) JPS59175146A (en)

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