KR970006523Y1 - Semiconductor manufacture type lead frame structure - Google Patents

Semiconductor manufacture type lead frame structure Download PDF

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Publication number
KR970006523Y1
KR970006523Y1 KR2019940006421U KR19940006421U KR970006523Y1 KR 970006523 Y1 KR970006523 Y1 KR 970006523Y1 KR 2019940006421 U KR2019940006421 U KR 2019940006421U KR 19940006421 U KR19940006421 U KR 19940006421U KR 970006523 Y1 KR970006523 Y1 KR 970006523Y1
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KR
South Korea
Prior art keywords
semiconductor chip
corner
lead
lead frame
frame structure
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KR2019940006421U
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Korean (ko)
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KR950028721U (en
Inventor
서성민
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아남산업 주식회사
황인길
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Priority to KR2019940006421U priority Critical patent/KR970006523Y1/en
Publication of KR950028721U publication Critical patent/KR950028721U/en
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Publication of KR970006523Y1 publication Critical patent/KR970006523Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용없음.None.

Description

반도체 제조용 리드프레임 구조Leadframe Structure for Semiconductor Manufacturing

제 1 도는 본 고안의 리드프레임 구성도1 is a lead frame configuration of the present invention

제 2 도는 제1도의 "A"부분 확대도FIG. 2 is an enlarged view of portion “A” of FIG. 1

제 3 도는 기존의 듀얼타입 리드프레임 구성도3 is a diagram of a conventional dual-type leadframe configuration

*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

1 : 내부리드1' : 코너리드1: Internal lead 1 ': Corner lead

2 : 탑재판3 : 사이드레일2: mounting plate 3: side rail

4 : 타이바10 : 반도체칩4: tie bar 10: semiconductor chip

11 : 반도체칩 패드11' : 반도체칩 코너패드11: semiconductor chip pad 11 ': semiconductor chip corner pad

본 고안은 반도체 조립공정시 사용되는 리드프레임(LEAD FRAME : 반도체칩에 집적된 회로와 외부전자회로의 접속이 용이하도록 리드(LEAD)를 제공하고 반도체칩의 성형시 이를 지지시켜주기 위하여 사용하는 메탈 프레임)의 구조에 대한 것이다.The present invention is a metal used to provide a lead (LEAD) to facilitate the connection of the circuit integrated in the semiconductor chip and an external electronic circuit and to support it during molding of the semiconductor chip. Frame).

일반적으로 듀얼타입의 TSOP(THIN SMALL OUTLINE PACKAGE) 형태의 반도체 제조공정은 다른 형태의 반도체 제조공정과 같이 원자재인 웨이퍼를 절단 가공처리하여 다이본딩(DIE BONDING) 공정 → 와이어본딩(WIRE BONDING)공정 → 봉함(MOLDING)공정 → 도금(SOLDER PLATING) 공정 → 마킹(MARKING)공정 → 트리밍(TRIMMING) & 포밍(FORMING)공정 등을 거쳐 반도체 패키지제품이 완성된다.In general, the semiconductor manufacturing process of the dual type TSOP (THIN SMALL OUTLINE PACKAGE) type is similar to other types of semiconductor manufacturing processes by cutting and processing wafers as raw materials, followed by die bonding process → wire bonding process → Semiconductor package products are completed through MOLDING process, SOLDER PLATING process, Marking process, Trimming and Forming process.

그런데, 종래의 듀얼타입 TSOP 반도체 제조용 리드프레임은 제3도와 같이 습기침투방지를 위해 타이바의 형상을 H자형으로 형성하게 되는데 이러한 리프드레임구조에 있어서는 탑재판(20)에 부착된 반도체칩(10)의 반도체칩 패드(11)와 리드프레임의 코너리드를 연결하는 와이어본딩과정에서 선연결 작업하는데 문자를 안고 있었다.However, in the conventional dual-type TSOP semiconductor manufacturing lead frame, as shown in FIG. 3, the shape of the tie bar is H-shaped to prevent moisture permeation. In the leaf frame structure, the semiconductor chip attached to the mounting plate 20 In the wire bonding process of connecting the semiconductor chip pad 11 and the corner lead of the lead frame of FIG.

즉, 반도체칩(10)상에 형성되는 반도체칩 패드의 위치가 리드프레임의 사이드레일(3)쪽으로 치우쳐 설치된 경우에는 배열된 내부리드(1)중 코너리드(1')에 상기 사이드레일쪽으로 치우쳐 설치된 반도체칩 코너패드(11')의 선연결이 정상적으로 이루어져야 하는데 반도체칩 코너패드(11')의 코너리드(1')와의 이격거리가 너무 떨어져 있는 관계로 선연결 작업이 어렵고, 미세한 금선(20)의 길이가 길어지는 관계로 반도체의 몰딩공정을 진행하는 과정에서 반도체칩 코너패드(11')와 코너리드(1')를 연결하고 있는 금선(20)이 인접한 리드와 붙게되거나 타이바(4)에 접촉 또는 장애를 받아 반도체 제품의 불량율을 증가시키는 요인이 되어 왔었다. 그러므로 이를 해결하기 위해서는 타이바(4)가 형성된 부위까지 코너리드(1')를 연장해야 하는바, 제 3 도의 경우와 같은 H자형 타이바(4)의 구조에서는 반도체칩 코너패드(11')의 가까운 거리까지 코너리드(1')를 연장 설치할 수가 없었다.That is, when the positions of the semiconductor chip pads formed on the semiconductor chip 10 are biased toward the side rails 3 of the lead frame, they are shifted toward the side rails on the corner leads 1 'of the arranged inner leads 1. The line connection of the installed semiconductor chip corner pad 11 'should be made normally, but since the separation distance from the corner lead 1' of the semiconductor chip corner pad 11 'is too far apart, the wire connection work is difficult and the fine gold wire 20 In the process of molding the semiconductor, the gold wire 20 connecting the semiconductor chip corner pad 11 'and the corner lead 1' is attached to an adjacent lead or the tie bar 4 during the molding process of the semiconductor. ) Has been a factor in increasing the defective rate of semiconductor products. Therefore, in order to solve this problem, it is necessary to extend the corner lead 1 'to the portion where the tie bar 4 is formed. In the structure of the H-shaped tie bar 4 as shown in FIG. 3, the semiconductor chip corner pad 11' It was not possible to extend the corner lead 1 'to a close distance of.

이에 본 고안에서는 H자형 타이바의 일부를 절단하고 공간부를 확보함으로써 코너리드(1')의 길이를 연장하여 반도체칩 코너패드(11')와 가깝게 위치하도록 하게 타이바를 통한 습기 침투방지 효과를 거둠과 동시에 반도체칩 코너패드(11')와 코너패드(11')의 와이어본딩 작업의 용이한 실시가 이루어지도록 하고 나아가 제품의 고품질화를 이룰 수 있도록 한 것이다.Therefore, the present invention cuts a part of the H-shaped tie bar and secures a space to extend the length of the corner lead 1 'to prevent moisture penetration through the tie bar so as to be located close to the semiconductor chip corner pad 11'. At the same time, the wire bonding operation of the semiconductor chip corner pad 11 'and the corner pad 11' is easily performed, and further, the quality of the product can be achieved.

이하, 본 고안을 첨부예시도면에 의거 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

본 고안은 사이드레일(3)과 탑재판(2)을 연결시켜주는 타이바(4)를 H자형으로 굴곡지게 구성한 듀얼타입의 리드프레임을 개량하여 코너리드(1')의 길이를 길게 연장하여 반도체칩(10)상의 반도체칩 코너패드(11')와의 이격거리를 짧게 유지할 수 있도록 한 것이다. 즉, 제 1 도 및 제 2 도의 예시와 같이 종래 H자형으로 형성되던 타이바(4)의 일부분을 제거하여 공간부(B)를 넓힘과 동시에 반도체칩(10)상에 형성되는 반도체칩 코너패드(11')의 설치위치에 등공간부(B)쪽으로 코너리드(1')를 길게 연장시켜 줌으로써 반도체칩 코너패드(11')와 연장된 코너리드(1')와의 이격거리를 보다 가깝게 유지할 수 있도록 한 것이다.The present invention improves the length of the corner lead 1 'by improving the dual type lead frame in which the tie bar 4 connecting the side rails 3 and the mounting plate 2 is bent in an H shape. The separation distance with the semiconductor chip corner pad 11 'on the semiconductor chip 10 can be kept short. That is, a semiconductor chip corner pad formed on the semiconductor chip 10 at the same time as extending the space B by removing a part of the tie bar 4 formed in the H shape as shown in FIGS. 1 and 2. By keeping the corner lead 1 'extended to the equal space portion B at the installation position of 11', the separation distance between the semiconductor chip corner pad 11 'and the extended corner lead 1' is kept closer. I would have to.

따라서 본 고안의 리드프레임구조에 의하면 반도체칩 코너패드(11')와 코너리드(1')를 연결시켜주는 금선(20)의 길이를 정규규격(ℓ)화 할 수 있음은 물론 몰드시 회로의 단락 결함문제를 해결할 수 있는 것이며 또한 와이어본딩작업의 효율을 높일 수 있게 되는 것이다.Therefore, according to the lead frame structure of the present invention, the length of the gold wire 20 connecting the semiconductor chip corner pad 11 'and the corner lead 1' can be normalized (l) and of course, when the mold circuit is used. The short-circuit defect problem can be solved and the efficiency of wire bonding can be improved.

이와같이 본 고안은 굴곡형 타이바구조를 갖는 리드프레임의 내부리드(1)중 최외곽에 위치하는 코너리드(1')의 길이를 타이바(4)가 설치된 부위의 공간부(B ; H 형 타이바의 일부를 제거한 부분)까지 길게 연장 구성하여 반도체칩 코너패드(11')와 코너리드(1')의 이격거리를 짧게 유지시킴으로써 와이어 본딩 프로그램설계를 용이토록 하는 한편, 습기 침투방지를 위한 리드프레임구조를 그대로 유지시킴과 동시에 반도체칩 코너패드와 코너리드를 연결하는 금선(20)의 길이가 길어짐으로써 발생될 수 있는 몰드시의 선단락 문제를 해결할 수 있는 등의 반도체 패키지 제품의 품질고급화를 실현할 수 있는 것이다.In this way, the present invention is a space portion (B; H type) of the portion where the tie bar (4) is installed to the length of the corner lead (1 ') located at the outermost of the inner lead (1) of the lead frame having a curved tie bar structure By extending the length of the tie bar), the distance between the semiconductor chip corner pad 11 'and the corner lead 1' is kept short to facilitate the design of the wire bonding program and to prevent moisture penetration. Maintaining the lead frame structure as well as improving the quality of semiconductor package products, such as solving the short-circuit problem in mold, which may be caused by the length of the gold wire 20 connecting the semiconductor chip corner pad and the corner lead is increased. It can be realized.

Claims (1)

사이드레일(3)과 탑재판(2)을 연결시켜주는 타이바(4)를 H자형으로 굴곡지게 구성한 듀얼타입의 리드프레임 구조에 있어서,In the dual-type lead frame structure in which the tie bar 4 connecting the side rails 3 and the mounting plate 2 is bent in an H shape, 상기 H자형 타이바(4)의 일부를 제거하여 공간부(B)를 넓힘과 동시에 반도체칩(10)상에 형성되는 반도체칩 코너패드(11')의 설치위치에 따라 상기 공간부(B)쪽으로 코너리드(1')를 길게 연장시켜 반도체칩 코너패드(11')와 연장된 코너리드(1')와의 이격거리를 짧게 유지토록 함을 특징으로 하는 반도체 제조용 리드프레임 구조.A part of the H-shaped tie bar 4 is removed to widen the space B, and at the same time, the space B according to the installation position of the semiconductor chip corner pad 11 ′ formed on the semiconductor chip 10. A lead frame structure for semiconductor manufacturing, characterized in that the distance between the semiconductor chip corner pad 11 'and the extended corner lead 1' is kept short by extending the corner lead 1 'to the side.
KR2019940006421U 1994-03-29 1994-03-29 Semiconductor manufacture type lead frame structure KR970006523Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940006421U KR970006523Y1 (en) 1994-03-29 1994-03-29 Semiconductor manufacture type lead frame structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940006421U KR970006523Y1 (en) 1994-03-29 1994-03-29 Semiconductor manufacture type lead frame structure

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KR950028721U KR950028721U (en) 1995-10-20
KR970006523Y1 true KR970006523Y1 (en) 1997-06-25

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