KR920008120A - 매우 얇은 열 안정성 비스말레이미드 필름 및 이것의 제조방법 - Google Patents

매우 얇은 열 안정성 비스말레이미드 필름 및 이것의 제조방법 Download PDF

Info

Publication number
KR920008120A
KR920008120A KR1019910016605A KR910016605A KR920008120A KR 920008120 A KR920008120 A KR 920008120A KR 1019910016605 A KR1019910016605 A KR 1019910016605A KR 910016605 A KR910016605 A KR 910016605A KR 920008120 A KR920008120 A KR 920008120A
Authority
KR
South Korea
Prior art keywords
thermally stable
bismaleimide
reaction
film
preparing same
Prior art date
Application number
KR1019910016605A
Other languages
English (en)
Inventor
푹스 하랄트
리히트 울리케
쉬렙프 볼프강
Original Assignee
라이싱어, 바르츠
바스프 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 라이싱어, 바르츠, 바스프 악티엔게젤샤프트 filed Critical 라이싱어, 바르츠
Publication of KR920008120A publication Critical patent/KR920008120A/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02285Langmuir-Blodgett techniques
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/18Processes for applying liquids or other fluent materials performed by dipping
    • B05D1/20Processes for applying liquids or other fluent materials performed by dipping substances to be applied floating on a fluid
    • B05D1/202Langmuir Blodgett films (LB films)
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312Organic layers, e.g. photoresist
    • H01L21/3128Organic layers, e.g. photoresist by Langmuir-Blodgett techniques
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31721Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Formation Of Insulating Films (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

내용 없음

Description

매우 얇은 열 안정성 비스말레이미드 필름 및 이것의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 얇은 필름의 배열(A),(B),(C) 및 (D)를 나타낸 도면.

Claims (3)

  1. 디아민과 말레산 무수물의 반응 생성물과 긴사슬 아민의 반응에 의해 생성된 이온성 전구물질을 이미드로 전환시킴으로써 얻어지는, 1㎛이하의 두께를 갖는 열 안정성 균일 비스말레이미드 필름.
  2. 디아민과 말레산 무수물의 반응 생성물과 긴사슬 아민의 반응에 의해 생성된 이온성 전구물질의 다층을 랑그뮈어-블로드게트 기술에 의해 기재에 도포하고 다층을 150-300℃로 가열함으로써 이 전구물질을 아미드로 전환시키는 것으로 이루어지는, 열 안정성 균일 비스말레이미드 필름의 제조방법.
  3. 디아민과 말레산 무수물의 반응 생성물과 긴사슬 아민의 반응에 의해 생성된 이온성 전구물질의 다층을 랑그뮈어-블로드게트 기술에 의해 기재에 도포시키고 탈수제에 의해 상기 전구물질을 이미드로 전환시키는 것으로 이루어지는, 열 안정성 균일 비스말레이미드 필름의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910016605A 1990-10-09 1991-09-24 매우 얇은 열 안정성 비스말레이미드 필름 및 이것의 제조방법 KR920008120A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19904032004 DE4032004A1 (de) 1990-10-09 1990-10-09 Ultraduenne thermoplastische bismaleinimidschichten sowie ein verfahren zu ihrer herstellung
DEP4032004.9 1990-10-09

Publications (1)

Publication Number Publication Date
KR920008120A true KR920008120A (ko) 1992-05-27

Family

ID=6415934

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910016605A KR920008120A (ko) 1990-10-09 1991-09-24 매우 얇은 열 안정성 비스말레이미드 필름 및 이것의 제조방법

Country Status (8)

Country Link
US (1) US5246784A (ko)
EP (1) EP0480288B1 (ko)
JP (1) JPH04290542A (ko)
KR (1) KR920008120A (ko)
AT (1) ATE109170T1 (ko)
CA (1) CA2052067A1 (ko)
DE (2) DE4032004A1 (ko)
ES (1) ES2057704T3 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034194A (en) * 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US6960636B2 (en) 1994-09-02 2005-11-01 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US20030055121A1 (en) * 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
US11555576B2 (en) 2014-12-24 2023-01-17 Veltek Associates, Inc. Stationary transfer platform and cleaning device for supply transport device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA796150B (en) * 1978-12-07 1980-10-29 Ici Ltd Chlorination process
JP2625689B2 (ja) * 1985-11-18 1997-07-02 淑夫 今井 単分子又は単分子累積膜の製造方法
CA1256592A (en) * 1986-04-01 1989-06-27 Masakazu Uekita Electric-electronic device including polyimide thin film
CA1294731C (en) * 1986-04-25 1992-01-21 Masakazu Uekita Copolymeric and amphiphilic polyimide precursor, process for preparing the same and thin film
CA1302675C (en) * 1986-05-20 1992-06-09 Masakazu Uekita Thin film and device having the same
JPS633024A (ja) * 1986-06-20 1988-01-08 Kanegafuchi Chem Ind Co Ltd イオン結合を含む高分子化合物

Also Published As

Publication number Publication date
EP0480288A3 (en) 1992-05-20
CA2052067A1 (en) 1992-04-10
ATE109170T1 (de) 1994-08-15
EP0480288B1 (de) 1994-07-27
EP0480288A2 (de) 1992-04-15
ES2057704T3 (es) 1994-10-16
JPH04290542A (ja) 1992-10-15
DE4032004A1 (de) 1992-04-16
US5246784A (en) 1993-09-21
DE59102337D1 (de) 1994-09-01

Similar Documents

Publication Publication Date Title
KR970706357A (ko) 세라믹스질 물질 형성용 조성물 및 세라믹스질 물질의 제조 방법(composition for forming ceramic substances and process for producing ceramic substances)
CA2035816A1 (en) Polyimides end-capped with diaryl substituted acetylene
ES2054270T3 (es) Revestimientos ceramicos, procedimientos de revestir sustratos y los sustratos asi obtenidos.
KR920008120A (ko) 매우 얇은 열 안정성 비스말레이미드 필름 및 이것의 제조방법
AR006983A1 (es) Metodo y aparato para evaporar un solvente de un recubrimiento usado para fabricar articulos de formacion de imagenes
DE68907173D1 (de) Oberflaechenueberzug, herstellungs- und anwendungsverfahren und damit beschichtete oberflaechen.
KR870007998A (ko) 폴리이미드 내열성 접착제
FI920097A0 (fi) Bitumipäällystemateriaali ja menetelmä alustalla olevan bitumipäällysteen valmistamiseksi
KR940005377A (ko) 중합체/금속 또는 중합체/반도체 복합재의 제조방법
KR880010083A (ko) 전분 접착제를 이용한 방수 처리 방법
ATE141306T1 (de) Beschichtungsverfahren
KR950011502A (ko) 폴리이미드-형성 물질의 용액 및 이것의 사용방법
DE59208446D1 (de) Verfahren zur Herstellung eines selbsttragenden Testfeldmaterials und solches Testfeldmaterial
WO1997006203A3 (de) Verfahren zur herstellung von kunststoffolien, die zur herstellung von folienkondensatoren dienen, und verfahren zur herstellung von folienkondensatoren unter verwendung derartiger kunststoffolien
KR880009065A (ko) 폴리이미드 및 그것의 고온접착제
KR950012505A (ko) 기구부품 및 이 부품에 막을 형성하는 방법
IT1296823B1 (it) Processo di stampa transfer
RU95104665A (ru) Способ получения мультислойных материалов
KR920022576A (ko) 고온 초전도 박막의 제조방법
KR20030008265A (ko) 양면 접착 화장 합판의 제조방법
IT9019198A1 (it) Procedimento per la formazione di un elemento di rivestimento particolarmente per interni di veicoli ed elemento di rivestimento realizzato con il detto procedimento
JPS6451955A (en) Thermal head
RO100363B1 (ro) Procedeu de obtinere a unei folii sintetice termorezistente
KR930001136A (ko) 자기 기록 매체의 제조방법
TW207584B (en) Method of preparing spin-on-glass oxiding film

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid