KR920002230A - 평판상의 물체를 위한 정전도장장치 - Google Patents
평판상의 물체를 위한 정전도장장치 Download PDFInfo
- Publication number
- KR920002230A KR920002230A KR1019910012415A KR910012415A KR920002230A KR 920002230 A KR920002230 A KR 920002230A KR 1019910012415 A KR1019910012415 A KR 1019910012415A KR 910012415 A KR910012415 A KR 910012415A KR 920002230 A KR920002230 A KR 920002230A
- Authority
- KR
- South Korea
- Prior art keywords
- conveyor
- linear part
- electrostatic coating
- hook
- flat objects
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/08—Plant for applying liquids or other fluent materials to objects
- B05B5/082—Plant for applying liquids or other fluent materials to objects characterised by means for supporting, holding or conveying the objects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1563—Reversing the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spray Control Apparatus (AREA)
- Electrostatic Spraying Apparatus (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 평판상의 물체를 도장(coating)하기 위한 정전도장장치의 평면도,
제2도는 제1도의 장치의 부분 단면도.
Claims (2)
- 평판상의 피도장 물체를 이동시키며, 상기 물체를 서로 반대방향으로 이동시키기 위하여 두 부분의 평행한 선형부를 가지며 그 각각은 길이 L,간격 2R이며 L2R를 만족하는 컨베이어; 한 선형부로 부터 도장된 물체를 전달받아서 다른 선형부로 보내기 전에, 상기 물체를 역전시키는 역전설비; 그 회전축이 컨베이어의 상기 선형부 사이의 중앙에 위치하며 수직방향으로 확장되는 회전식 분무헤드; 및 상기 회전축을 따라 상기 회전식 분무헤드를 왕복운동시키는 지지설비를 포함하는 평판상의 피도장 물체를 도장하기 위한 정전도장장치.
- 제1항에 있어서, 상기 컨베이어에는 피도장 물체를 지지하기 위한 갈고리가 구비되어 있으며 상기 피도장 물체는 주어진 간격 “d”에서 상기 갈고리에 매달려 있는 상태로 존재하며, 상기 “d”는 d50㎜를 만족하는 것을 특징으로 하는 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2189413A JP2636955B2 (ja) | 1990-07-19 | 1990-07-19 | 平板状被塗物のための静電塗装装置 |
JP189.413/90 | 1990-07-19 | ||
JP90-189413 | 1990-07-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920002230A true KR920002230A (ko) | 1992-02-28 |
KR0156579B1 KR0156579B1 (ko) | 1998-12-15 |
Family
ID=16240854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910012415A KR0156579B1 (ko) | 1990-07-19 | 1991-07-19 | 평판형 물체를 위한 정전도장장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5194092A (ko) |
JP (1) | JP2636955B2 (ko) |
KR (1) | KR0156579B1 (ko) |
TW (1) | TW226341B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996009124A1 (en) * | 1994-09-22 | 1996-03-28 | Minnesota Mining And Manufacturing Company | Electrostatic system for controlling the flow of a fluid after being coated onto a substrate |
DE19819963A1 (de) * | 1998-05-05 | 1999-11-11 | Itw Gema Ag | Pulver-Sprühbeschichtungsvorrichtung |
CN1861268A (zh) * | 2006-05-29 | 2006-11-15 | 张爱华 | 一种界面助力型无喷丝头电流体力学方法及其应用 |
JP2008103506A (ja) * | 2006-10-18 | 2008-05-01 | Fuji Machinery Kk | ソルダーレジスト膜の形成方法及び静電塗装装置 |
CN112105151A (zh) * | 2019-06-18 | 2020-12-18 | 群翊工业股份有限公司 | 基板处理设备 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4567818A (en) * | 1983-04-20 | 1986-02-04 | Protectaire Systems Co. | Circular spray booth |
JPS61482A (ja) * | 1984-06-14 | 1986-01-06 | Aisin Seiki Co Ltd | コ−テイング液の塗布方法 |
-
1990
- 1990-07-19 JP JP2189413A patent/JP2636955B2/ja not_active Expired - Fee Related
-
1991
- 1991-07-16 TW TW080105517A patent/TW226341B/zh active
- 1991-07-18 US US07/732,124 patent/US5194092A/en not_active Expired - Fee Related
- 1991-07-19 KR KR1019910012415A patent/KR0156579B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0478459A (ja) | 1992-03-12 |
JP2636955B2 (ja) | 1997-08-06 |
TW226341B (ko) | 1994-07-11 |
US5194092A (en) | 1993-03-16 |
KR0156579B1 (ko) | 1998-12-15 |
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Payment date: 20080701 Year of fee payment: 11 |
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