KR920000214B1 - Magnetic head - Google Patents

Abstract

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Description

[Name of invention]

Magnetic head

[Brief Description of Drawings]

Figure 1a is a perspective view showing one embodiment of a magnetic head according to the present invention.

1B is a plan view of the head.

2 to 8 are processing flow diagrams each showing an example of each step of the magnetic head manufacturing method.

9 through 12 are exemplary views showing another embodiment of the present invention, and Fig. 9 is a plan view of a magnetic head.

Figure 10a is a side view of the track groove portion.

Figure 10b is an enlarged view thereof.

11A is a side view of a track groove portion according to another embodiment.

11B is an enlarged view thereof.

12 is a plan view of a magnetic core block.

13 is a plan view of a head showing another embodiment of the present invention.

14 is a plan view of a head cut along the slice line shown in FIG. 12 as another embodiment of the present invention.

15A and 15B are enlarged cross-sectional views of a ferromagnetic thin film portion showing another embodiment.

16A and 16B are enlarged cross-sectional views illustrating grain arrangement of a ferromagnetic thin film.

17A-I are flows of another processing method of the magnetic head.

FIG. 18 is a graph showing the relationship between the electrical resistivity and the permeability when the growth of 422 planes of the standard sandust alloy.

FIG. 19 is a graph showing the relationship between grain size and electrical resistivity of standard sendust alloys having the same 422 sheet length.

20 is a graph showing the relationship between the electrical resistivity of the standard sendust alloy and the frequency at 6dB and 3dB attenuation, which are the same 422 plane growth.

21 to 26 are plan views illustrating a conventional magnetic head.

Detailed description of the invention

[Technical Field]

The present invention relates to a magnetic head. More specifically, the present invention relates to a composite magnetic head combining a substrate and a ferromagnetic thin film.

[Technical terms]

The following terms are used in the following meanings in the present specification. The gap facing surface refers to the joint surface which is butt-butted parallel to the gap. Tape contact surface refers to the surface in contact with the magnetic tape when it is completed with the magnetic head. A repeating layer means a group of one-plane binders that form one ferromagnetic metal layer by substantially forming and hitting one layer by itself.

The ferromagnetic thin film forms magnetic circuits such as amorphous alloys proposed in Japanese Patent Application Nos. 51-65395, 51-73920, 51-73923, as well as thin films of ferromagnetic metals such as general sender alloys and permalloy. It means a thin film panel formed of other suitable materials.

[Background]

In recent years, magnetic tapes having a higher residual magnetic flux density (Br) have been used in accordance with the higher density of magnetic recording, and a magnetic head having a narrow track width with a high magnetic flux density is required to cope with this.

As such a magnetic head, for example, a ferromagnetic thin film made of a ferromagnetic metal of a sensorst alloy is formed on a substrate made of a ferromagnetic oxide as shown in FIGS. 21 to 26 by a vacuum thin film forming technique, and a thin film of ferromagnetic metal is formed. Hybrid magnetic heads are known which form a gap between them.

The magnetic head of FIG. 21 forms a ferromagnetic thin film 213 on the thin film forming surface 212 of the oxidized magnetic material 211 which is inclined about 45 degrees with respect to the gap g, thereby forming a non-magnetic material on both sides of the gap g. 214).

The magnetic head of FIG. 22 forms a ferromagnetic thin film 223 in a concave shape on both thin film forming surfaces 222 of the oxidant material 221 inclined in an acid shape with respect to the gap g, and joins them to form a nonmagnetic material ( 224).

The magnetic head of FIG. 23 forms a multilayer ferromagnetic thin film 233 on the thin film forming surface 232 of the substrate 235 of the oxidized magnetic material 231 and the nonmagnetic material 234 as shown in FIG. On the other hand, the other substrate 236 is incorporated again to obtain a head half body 237 having a sandwich structure, and then bonded to another head half body 238 obtained in the same manner.

There is also a head in which the ferromagnetic thin films 243, 253 as shown in FIG. 25 or 26 are curved or refracted. Reference numerals 241 and 251 denote magnetic oxide materials, 242 and 252 denote thin film forming surfaces, and 244 and 254 denote nonmagnetic materials.

In the case of the heads of FIGS. 21 and 22, however, the ferromagnetic thin films 213 and 223 cannot be made large, so that the magnetic resistance is large and the magnetic flux is difficult to pass in the high frequency band. In addition, the position of the gap g varies greatly in FIG. 21 due to the polishing amount of the gap facing surface, and in FIG. 22, the problem of changing the width of the gap g occurs.

In addition, the head of FIG. 23 can make the ferromagnetic thin film sufficiently large, but it is necessary to divide the ferromagnetic thin film one by one and deposit and reassemble the ferromagnetic thin film. In the heads of FIGS. 25 and 26, the surfaces 242 and 252 forming the ferromagnetic thin films 243 and 253 have a complicated shape, and internal stresses are generated during the process of forming foils on the surfaces. There is a problem in the uniformity of quality such as the inability to obtain a predetermined magnetic property.

In addition, since each magnetic head uses a ferromagnetic oxide such as a ferrite as a substrate, the range of expansion coefficient or abrasion is limited to some extent, making it difficult to produce a ferromagnetic thin film. In addition, when the gaps are formed when the substrates are joined to each other, a gap occurs between the ferromagnetic thin film and the substrate, and a problem arises in that the performance as a head changes.

In these magnetic heads, the ferromagnetic thin film has a multilayer structure in which ferromagnetic metals and nonmagnetic materials are alternately laminated, and the ferromagnetic metal film has a high frequency region by suppressing the film thickness per layer of the ferromagnetic metal within a micrometer unit, for example, about 5 μm in a sendust alloy. There is a tendency to suppress the eddy current loss in the case (Special Publication 54-3238).

There is a correlation between the thickness of the magnetic film and the eddy current loss in the related art, and it does not occur when the film thickness is thinned in a micrometer unit. For example, because the eddy current loss in the high frequency band of 5 MHz is superficially calculated, it has been believed that in the case of the sender alloy, the film thickness of about 5 μm does not occur and the deterioration of the frequency characteristic does not occur.

By the way, when the inventors of the present invention formed a sender's multilayer thin film having a film thickness of about 5 μm, the inventors recognized a significant deterioration of frequency characteristics in the high frequency band. As a result of reviewing various experiments by the present inventors, it is found that the size of the grain size of the ferromagnetic metal constituting the ferromagnetic thin film has a close relationship between the resistivity (P) and the permeability (μ). Got to know In other words, it was found that the larger the grain size, the higher the permeability (μ) and the lower the resistivity (P) were, the higher the resistivity, and the higher the resistivity (P), the higher the frequency band of the 6dB degradation was toward the high frequency band.

[Initiation of invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a composite magnetic head having high stability and relatively low magnetic resistance for use in high bands and bands.

In order to achieve the above object, the present invention provides a magnetic head for arranging a substrate on which ferromagnetic thin films are formed so as to form a gap between ferromagnetic thin films. The magnetic head has a substantially single plane substantially perpendicular to both the gap facing surface and the tape contact surface. The substrates on which the ferromagnetic thin films are formed on the thin film forming surface are disposed to face each other at an angle to each other, and they are bonded to each other by a nonmagnetic material filled between the metal thin film of one substrate and the other substrate.

Therefore, a ferromagnetic thin film is formed on the one side wall surface of the substrate in a direction substantially perpendicular to the gap. The ferromagnetic thin film can be enlarged to relatively reduce the magnetic resistance, thereby improving the magnetic properties.

In addition, since the ferromagnetic thin film is formed in a direction perpendicular to the gap, when the gap facing surface is polished, the position of the gap does not change significantly or the width of the gap changes depending on the amount of polishing.

In addition, the ferromagnetic thin film formed in a part having a complicated shape such as a corner, such as a corner, has a lot of deformation due to internal stress, which adversely affects the head performance. Since the part (deformation part other than a single plane) which has deformation | transformation by internal stress in is removed, the said bad influence can be completely prevented. In addition, when the deformed part is in a position separated from the gap, there is little adverse effect and it is not necessary that all of the ends are in a single plane. In other words, even if the thin end is slightly curved, there is no problem, and most of the thin end is a single plane, that is, a substantially single plane.

In addition, in the present invention, when the nonmagnetic material is used for the substrate, the range of expansion coefficient or wearability is different from that of the magnetic material, so that it is relatively limited and the ferromagnetic thin film is easily made. In addition, even when a slight misalignment occurs when the gaps are formed by abutting the substrates, no gap is formed between the ferromagnetic thin film and the substrate, so that the performance of the head is stable. In addition, sliding noise was generated in the case of a perlite substrate, but not in the case of a substrate made of a nonmagnetic material.

In the present invention, when the grain size of the ferromagnetic metal constituting the ferromagnetic thin film is set to 300 to 700 mW during 422 plane growth, the eddy current loss in the high frequency band can be reduced. For example, in the case of using a standard sendust alloy, the embodiment has a range of 520-570 Hz, preferably 570 Hz, and the high magnetic permeability (μ) is suppressed to a practical range of about 850-1150 at 0.1 MHz, but at a high frequency of about 5 MHz. Significant reduction in the band can be prevented. For example, when the grain size is in the range of 520--570Å using a standard sendust alloy, the electrical resistivity is in the range of 90-100μΩ㎝ as shown in FIG. 19, and the permeability (μ) at this time As shown in FIG. 18, the degradation at 5 MHz is in the range of 6-3 dB, as shown in 850-1150 and as shown in FIG. In general, the magnetic head has a lower limit of μ · f characteristic (frequency characteristic) at 100 KHz in the range of 800, and when the lower limit at 5 MHz is 370, it can be used as a practical magnetic head. Therefore, the frequency characteristic is significantly lower than that of the conventional ferrite magnetic head. To be good. In addition, in the present invention, when the grain size is 200-300 mW when the 220-plane growth is performed, the grain size can be easily adjusted without large difference in the investment rule (μ) as compared with the example of the 422-plane growth. In particular, when the crystal grain size is 270-330 Å, the eddy current loss can be reduced while preventing the permeability (μ) from decreasing at 5 MHz. In the case of a 10 MHz head, the diameter of the head is set close to 200 micrometers, whereby the deterioration of characteristics in high frequencies and bands can be prevented even when the permeability (μ) is reduced.

In addition, in the case of the invention in which each layer of the ferromagnetic thin film having a multi-layer structure is composed of repeating layers hitting crystal grains, even if a layer having the same thickness is formed, the grain size is not large but becomes uniform, so that the output decrease in the high frequency band is reduced and the eddy current loss Decreases. When the grain size of the repeating layer is set to 200 to 330 GPa when the growth is 220 planes, the eddy current loss can be reduced while preventing the permeability from decreasing.

Best Mode for Carrying Out the Invention

Hereinafter, the configuration of the present invention will be described in detail by the embodiment shown in the accompanying drawings.

1A and 1B show an embodiment of a magnetic head according to the present invention in a perspective view and a plan view. In the drawing, reference numeral 1 denotes a pair of substrates, and a ferromagnetic thin film 4 made of a magnetic metal material is formed on the substrate 1 by using a thin film formation technique by physical vapor deposition such as spatter, vacuum deposition, or ion fretting. do. And the gap g inclines a pair of board | substrate 1 which formed the ferromagnetic thin film 4 in the thin film formation surface 6 which becomes a single plane which runs substantially parallel to both the gap facing surface 3 and the tape contact surface 5. It is formed between the ferromagnetic thin films 4 which oppose by arrange | positioning in opposition. In this magnetic head, among the blocks divided into four by the ferromagnetic thin film 4 and the gap g, two blocks on the diagonal line are the substrate 1 and the other two are nonmagnetic materials, for example. It is a block 7 of fusion glass. In the figure, 12 is a winding fault.

As the substrate 1, a ferromagnetic oxidant such as perlite is usually used on the premise of using a high frequency band of about 5 MHz, but a nonmagnetic ceramic is used at a high frequency, for example, around 10 MHz. In general, as a suitable substrate 1, a nonmagnetic material referred to as a preferred non-mag material in terms of wear resistance is employed.

In addition, the ferromagnetic thin film 4 has a film thickness of at least one layer within 5-6 µm on the sidewall surface and the thin film forming surface 6 which is substantially orthogonal to the gap facing edge 3 and the tape contact surface 5 of the substrate 1 and as a whole. It is formed in a multilayered film structure having a desired track width, for example, 20 µm + alpha. In this ferromagnetic thin film, the inventors have a close relationship between the electrical resistance and the permeability. The larger the grain diameter, the lower the resistance value and the larger the eddy current loss. If it is small, the resistance value rises and the permeability (μ) worsens, as mentioned above. Here, the grain size of the crystal grains 20 of the ferromagnetic thin film 4 also varies depending on the composition metal. However, in the case of 422 plane growth, the grain size of the ferromagnetic thin film 4 is preferably adjusted in the range of 300 to 700 GPa. For example, in the case of a 5 MHz counterpart magnetic head, it is adjusted in the range of 520-570 mW, most preferably about 570 mW in the case of the standard sender alloy.

On the other hand, the grain size of the crystal grains of the ferromagnetic thin film 4 is preferably 200-330 GPa when it is 220 plane growth. In the case of the 5MHz-compatible magnetic head, the grain diameter is suitable for the range of 270-330Å, and in the 10MHz response, the permeability is lowered as a whole, but it is desirable to set the range close to 200Å with low degradation in the high frequency band.

Comparing the 220 crystal growth plane and the 422 crystal growth plane, the grain growth of the 220 plane can reduce the grain size at a normal temperature (particularly, a temperature without extra heat) during spattering, and the permeability (μ) is high. Since it is considered that there is no balance in either of the growth methods, the adoption of the 220-plane growth method with less fear of crystallization by recrystallization is preferable.

The grain size of the crystal grains 20 can be adjusted in various ways as described below. However, in general, when a predetermined track width is formed by a film of one layer, the substrate temperature rises during the spattering process for granulation. It tends to be difficult to control. In addition, a problem of eddy current loss due to an increase in film thickness also occurs. It is suitable here to make the film thickness per layer of the ferromagnetic metal layer 41 into a multilayer film structure of about 5-6 mu m. A nonmagnetic layer 42 is usually formed between the ferromagnetic metal layers 41 to prevent eddy current loss. Each ferromagnetic metal layer 41 of the multi-layered ferromagnetic thin film 4 is composed of a repeating layer 22 in which crystal grains 20 adjusted to the above-described grain diameter ranges are hit as shown in FIGS. 16A and 16B. May be When this repeating layer 22 is formed in a large number, there is a problem in that it is not suitable for the amount of acid, etc., so that it is appropriate to set the thickness within about 1-3 μm per layer. In addition, the thickness per layer of the ferromagnetic metal layer 41 formed of the repeating layer 22 is preferably 5-6 μm in consideration of eddy current loss and the like as described above. Here, for example, the ferromagnetic thin film 4 forms a repeating layer 22 composed of crystal grains 20 adjusted to the above-described grain diameter range as shown in FIG. 16a, or ferromagnetic as shown in FIG. 16b. The ferromagnetic metal layer 41 having a thickness of about 5-6 µm is formed by alternately depositing a metal repeating layer 22 and a magnetic material layer 21 having a different crystal structure such as a nonmagnetic material or an amorphous metal. 41) a nonmagnetic material layer 42 for preventing eddy current loss is formed, and a plurality of times of these are formed to form a desired track width. In addition, the layer 21 made of a nonmagnetic material or an amorphous metal is used to prevent coarsening of the grain size 20 of the ferromagnetic metal, and a film thickness of several + Å is sufficient. However, when the track width is narrow or the occurrence of eddy current loss is small due to the material, a thin film may be formed by one ferromagnetic metal layer 41.

In addition, when the grain diameter of the ferromagnetic thin film 4 is 422 plane growth, the ferromagnetic thin film 4 is formed in the range of 300-570 mm, the ferromagnetic thin film 4 is composed of a repeating layer in which crystal grains are hit, and the layer 41 of the multilayer film structure is described previously. The construction of the repeating layer 22 hitting the crystals adjusted to the range is not only applied to various magnetic heads described in FIG. 1 or other accompanying drawings, but also to the entire composite magnetic head which combines a substrate and a thin film of ferromagnetic metal. It can be magnificent.

In addition, although the above-described embodiment is a suitable embodiment of the present invention, various modifications can be made without departing from the scope of the present invention.

For example, FIG. 9 shows another embodiment. Since the magnetic head is in direct contact with the ferromagnetic thin film 4 and the hard substrate 1 when the substrates 1 and 1 are bonded to each other, the magnetic heads face each other near the gap g in order to prevent a situation in which the gap accuracy cannot be obtained. The surface 3 is inclined at an angle of 10 degrees or more with respect to the gap g. Specifically, as shown in FIG. 10, the recessed part 8 is formed in the gap facing surface 3 of the board | substrate 1 adjacent to the side wall surface 6 of a track groove, and the recessed part 8 is a nonmagnetic material. As a low melting point, the fused glass 16 is melt-filled. Incidentally, the inclination angle θ ₁ with respect to the gap g of the side wall surface of the recess 8 is about 45 degrees, but can be appropriately selected within the range of about 10 to 80 degrees. When the angle is less than 10 degrees, the recessed portion 8 is not provided to fill the fusion glass, so it is preferable to have the angle of 30 degrees or more, particularly 40-60 degrees. This recess 8 can be formed before machining the track groove 13. In this case, the recess groove 8 is filled with a nonmagnetic material 16 such as glass to process the track groove 13 in a polished state. At this time, the ratio of the nonmagnetic material portion A to the thin film forming surface 6 serving as a single plane is about 1/5 to 4 times the track width as shown in FIG. 10B.

In addition, as shown in FIG. 15A, when the recessed part 8 is provided, it is also possible to cut the part of the ferromagnetic thin film 4 end portion 14 to make the track width to a predetermined width with high accuracy. Cutting is an inclination of about 60 degrees with respect to the cap facing surface 3, such as cutting a part of the substrate 1 and the ferromagnetic thin film 4 end portion 14 appearing on the gap facing surface 3, and a known cutting means example. For example, by grinding wheels. In the recessed portion 8, the low melting glass 16 is melt-filled at the time of gap bonding, and a portion of the cut ferromagnetic thin film is covered with a nonmagnetic material. As shown in FIG. 15B, the end portion 14 of the ferromagnetic thin film may be cut from both sides to form a track width in a predetermined width, and then filled with low melting point glass. In this case, a part of the high melting point glass 15 in the track groove 13 covering the ferromagnetic thin film 4 is cut, but the low melting point glass 16 is filled in the gap bonding to form the ferromagnetic thin film 4. The end face 4 of is not exposed to the gap facing surface 3. In this way, when the end cutting of the ferromagnetic thin film 4 and the forming of the recesses 8 are simultaneously performed, the ferromagnetic thin film can be uniformly formed on the film forming surface 6 made of a single material formed by the track groove processing. To grow and improve magnetic properties. In addition, since the end portion 14 of the ferromagnetic thin film 4 near the gap is slightly cut to form a gap width, and is covered with a nonmagnetic material 16, the gap width can be made highly accurate, and the generation of residual stress due to cutting It is very small, so the influence of the film properties is small. Therefore, the increase in the resistance value of the ferromagnetic thin film can be suppressed to prevent the lowering of Q, and the high-precision magnetic head can be produced without generating a pseudo gap. Here, the ferromagnetic thin film 4 has an angle θ _{2 of} 90 to 80 degrees with respect to the gap facing surface 3, but the technique of this cutting is not limited to the angle, and the conventional examples of FIGS. 21 to 26 degrees. It can be applied to the head.

11A and 11B, the ferromagnetic thin film 4 is formed, and then the ferromagnetic thin film (with the nonmagnetic material 15 such as glass filled in the track groove 13) is formed on both sides of the ferromagnetic thin film ( The groove-shaped recesses 8 and 11 may be machined to secure the track width so as not to damage 4). In this case, although the track width is regulated by the grinding of the grooves 8 and 11, since the track width can be regulated only by the groove 8, the groove 11 is not necessarily required. In addition, the grooves 8 and 11 are filled with a nonmagnetic material 16 such as glass in the gap bonding process of FIG.

14 shows an example of the magnetic head when the azimuth angle is set. This magnetic head is, for example, as shown in FIG. 12 by slicing the position SS where the bottom 10 of the track groove 13 is not left on the core 9 side when slicing. Restrain the part.

Next, the manufacturing method of the magnetic head will be described with reference to FIG. 17 with the manufacturing method of the magnetic head shown in FIG.

First, a quadrangular to trapezoidal track groove 13 having a symmetrical sidewall surface 6 extending in a depth direction perpendicular to the tape contact surface 5 on the gap facing surface 3 of the substrate 1 is prescribed. It forms by plural grinding by pitch (17a). In this case, if the cross-sectional shape of the track groove 13 is quadrangular or trapezoidal, and the gap g is formed by using the ferromagnetic thin film 4 formed in the first half and the second half of the same track groove 13, a uniform gap is obtained. Magnetic heads of length can be manufactured. Of course, the track groove 13 has a range in which at least one side wall surface 6 is approximately perpendicular to the gap facing surface 3, as shown in FIG. 12, that is, the range of the effects of the present invention as compared to the conventional example. More preferably, the groove shape may be 80 to 90 degrees.

Next, the substrate 1 is cleaned and the ferromagnetic thin film 4 of the ferromagnetic metal is adhered to the sidewall surface of the track groove 13, that is, the thin film forming surface 6, using a spatter technique, which is one of thin film forming techniques. 17b degrees). This film adhesion is carried out so that the target surface of the target is 40-45 degrees, preferably 45 degrees, with the target facing the gap 3 facing the target. According to this film bonding method, the ferromagnetic thin film 4 formed of a uniform thin film along the ridge line 17 composed of the gap facing surface 3 and the side wall surface 6 gradually becomes thinner in the tape sliding direction. Although it is formed so that a predetermined film thickness can be easily formed in a gap width direction, a film thickness of a constant thickness is formed in a gap depth direction, and a uniform gap length is obtained. Since the necessary part of the ferromagnetic thin film 4 is near the gap facing surface 3 forming the gap g, that is, the surface portion of the track groove 13, even if the distance away from the gap g becomes narrow, there is no particular problem with the output characteristics. It does not occur Of course, as shown in FIG. 3, even when the spatter direction of the ferromagnetic thin film 4 is adjacent to the dashed arrow direction, the average free distance of the attached particles is shortened by increasing the gas pressure of the spatter so that the spatter direction is parallel to the spatter direction. The surface can be formed efficiently enough.

On the other hand, the ferromagnetic thin film 4 preferably has a substantially multilayered film structure having a thickness of 5-6 µm per layer in order to reduce the eddy current loss. A ferromagnetic metal and a nonmagnetic material, such as SiO ₂ , which are usually made of sender alloy By alternately spattering or by alternately spattering the crystalline ferromagnetic metal and the amorphous metal, a plurality of layers and a predetermined width are formed.

The grain size of the crystal grains 20 is 300-700 kPa when it is 422 plane growth, preferably 520--570 kPa in the case of standard sendust alloy (9.6% Si, 5.4% Al, residual Fe), and most preferably It is preferable to adjust the dust alloy to about 570 kW, and to adjust it to 200-330 kW with the standard sandust alloy for 220-plane growth, and to 200 kW for 10 MHz. Each layer 41 of the ferromagnetic thin film 4 forms a single ferromagnetic metal layer 41 by laminating a group of crystal grains 20 (repeat layer 22) having a grain diameter in the above-described range, and again, It is preferable to form by laminating in several layers.

In this case, spattering is performed with a root of about 400 mW / min at a substrate temperature exceeding 300 ° C. in an argon gas atmosphere, for example, in the case of 422 plane growth using a standard sandust alloy. In the case of 220-plane growth, the substrate temperature is lower than 300 ° C.

By stopping the spatter and repeating the cooling, the spatter is made to have a total film thickness of 5-6 μm per layer, and the grain growth of the crystal grains 20 is 300-700Å, 220 when the surface growth of 422 is described. When growing cotton, it is in the range of 200-330Å. The interruption of the spatter cools the film surface, forming a substantial boundary between the crystals and stopping crystal growth. In addition, the ferromagnetic metal layer 41 and layers of magnetic materials having different crystal structures, such as nonmagnetic materials or amorphous metals having a film thickness of several + 수, are alternately formed, and crystal growth is stopped in the layer 21. It is also possible to have a constant ground.

Therefore, the ferromagnetic thin film 4 is protected by filling the tracking groove 13 with the high melting point glass 15 (glass bonding: FIG. 17C). Then, the gap facing surface 3 and the tape contact surface 5 are ground to remove the ferromagnetic thin film 4 and the glass 15 on the gap facing surface 3 to determine a predetermined rough surface. Grinding is usually lap finish by lapping. The excess ferromagnetic thin film 4 on the gap facing surface 3 may be removed immediately after the spatter, as shown in FIG.

Then, beside the track groove 13 described above, the recess 8 for grinding the pseudo gap is ground along the groove 13 (Fig. 17D). At the time of grinding the recessed part 8, the gap 14 is cut to a predetermined width by cutting the end portion 14 of the ferromagnetic thin film 4 which is adjusted to the gap facing surface 3 as shown in Figs. 15A or 15B. Adjust if possible. The cutting is performed by cutting means, for example, grinding grindstones, inclined at about 60 degrees with respect to the gap facing surface 3, such as cutting a part of the substrate 1 and the ferromagnetic thin film 4. The recessed portion 8 is melt-filled with low melting glass 16 during gap bonding. In the case of the recessed machining shown in FIG. 15B, a part of the high melting point glass 15 of the track groove 13 covering the ferromagnetic thin film 4 is cut, but the low melting point glass 16 is formed at the time of gap bonding. Filled and filled.

Then, the winding groove 12 is formed in the gap facing surface 3 of one substrate 1 (Fig. 17e). This winding groove 12 regulates the deep dimension. The winding groove 12 may be formed after the track groove 13 is formed, and then the public hearing of FIGS. 17B to 17D described above may be performed. Although spacers 2, which are made of nonmagnetic materials such as Si0 ₂ , are not shown on the gap facing surfaces 3 of the two substrates 1 and 1 by a spatter, for example, FIG. As shown in FIG. 8, it is formed so that the cross section of the gap opposing surface 3 and the ferromagnetic thin film 4 of one board | substrate 1 may be covered.

The pair of substrates 1 and 1 thus obtained are enclosed by the ferromagnetic thin films 4 so as to fill the recess 8 with the low melting glass 16 (gap boarding: 17f). In addition, as shown in FIG. 7, when the track groove 13 is not filled with the glass 16 in advance, the track groove 13 is filled with a nonmagnetic material 16 such as glass and bonded. At this time, since the gap g is formed between the side cross-sections of the ferromagnetic thin film 4 exposed on the side of the gap facing surface 3, accurate positioning of the ferromagnetic thin film 4 is required.

After the gap bonding described above, the tape contact surface 5 is cylindrically ground to finish the tape contact surface 5 with a curved surface (Fig. 17G).

Next, the slice g is cut so as to be slightly inclined with respect to the gap facing surface 3 such that the gap g is at a predetermined azimuth angle with respect to the tape sliding direction (Fig. 17H). For example, the thin film portion of the bottom portion 10 is removed by slabbing the position SS so that the bottom portion 10 of the track groove 13 is not left on the core 9 side when slicing as shown in FIG. To be manufactured. In addition, when not making the azimuth angle, as shown in FIG. 8, the ferromagnetic thin film 4 is cut against the gap g by cutting so as not to leave the ferromagnetic thin film 4 of the bottom portion 10 of the track groove 13. The head of FIG. 13 is obtained leaving only the portion that is vertical.

It is then inspected and attached to the support aid base, and wound with a sliding surface finish for good contact in the tracking direction (Fig. 7i).

[Application Field]

The magnetic head of the present invention is suitable for melting to high density magnetic recording.

Claims (7)

A magnetic head in which a substrate on which a ferromagnetic thin film is formed is disposed so as to form a gap between the ferromagnetic thin films, wherein the layer of the ferromagnetic thin film is formed of a repeating layer in which crystal grains are hit. Claims The magnetic head according to claim 1, wherein the grain size of the ferromagnetic thin film according to claim 1 is in the range of 300-700 kPa when the growth is 422 planes. Claims [1] In the case of the ferromagnetic thin film sender alloy according to claim 1, the magnetic head has a grain size in the range of 520--570 mm when the grain size is 422 plane growth. Claims The magnetic head characterized in that the grain size of the ferromagnetic thin film according to claim 1 is in the range of 200-330 kPa when the growth of 220 planes. Claims In the case of the sender alloy of the ferromagnetic thin film according to claim 1, the magnetic head is characterized in that the grain size is in the range of 270-330 mm 3 when the grain size is 220 planes. Claims 1. The magnetic head of the ferromagnetic thin film of claim 1, which has a grain size of about 200 GPa when the grain size is 220 planes, is characterized by a magnetic head. Claims of Claim 1 The repeating layer of Claim 1 is formed by interrupting spatter, The magnetic head characterized by the above-mentioned.

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