KR910020502A - 광영상성 폴리이미드 코팅물 - Google Patents
광영상성 폴리이미드 코팅물 Download PDFInfo
- Publication number
- KR910020502A KR910020502A KR1019910007401A KR910007401A KR910020502A KR 910020502 A KR910020502 A KR 910020502A KR 1019910007401 A KR1019910007401 A KR 1019910007401A KR 910007401 A KR910007401 A KR 910007401A KR 910020502 A KR910020502 A KR 910020502A
- Authority
- KR
- South Korea
- Prior art keywords
- polyimide coating
- polyimide
- photoimaging
- photoimageable
- mole
- Prior art date
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/104—Coating to obtain optical fibres
- C03C25/106—Single coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
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- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (20)
- 하기 일반식의 반복 유니트를 포함하는 광영상성 플리이미드 코팅물(photoimageable polyimide coating).상기식에서,R1은약 1내지 약 100몰% 및 4가 감광성 잔기 약 99내지 약 0몰%를 함유하고;R2는약 1내지 약 100몰% 및 2가 감광성 잔기 약 99내지 약 0몰%를 함유한다.
- 제1항에 있어서, 추가로 공개시제를 포함하는 광영상성 폴리이미드 코팅몰.
- 제1항에 있어서, 수 평균 분자량이 10,000g/mol 이상인 광영상성 폴리이미드 코팅물.
- 제1항에 있어서, 4가 감광성 잔기가 벤조폐논 잔기인 광영상성 폴리이미드 코팅물.
- 제4항에 있어서, R1이 벤조폐논 잔기 약 30내지 약 99몰%를 포함하는 광영상성 폴리이미드 코팅물.
- 제4항에 있어서, R1이 벤조폐논 잔기 약 50내지 약 99몰%를 포함하는 광영상성 폴리이미드 코팅물.
- 제4항에 있어서, R1이 벤조폐논 잔기 약 50내지 약 602몰%를 포함하는 광영상성 폴리이미드 코팅물.
- 두께가 약 10마이크론 이상인, 제1항의 광영상성 폴리이미드 코팅물.
- 하기 일반식의 반복 유니트를 포함하는 광영상성 폴리이미드.상기식에서,R1은약 70내지 약 1몰% 및 4가 벤조폐논 잔기 약 30내지 약 99몰%를 함유하고;R2는또는약 100몰%를 함유한다.
- 제9항에 있어서, R1이 약 50내지 약 99몰%의 4가 벤조폐논 잔기인 광영상성 폴리이미드.
- 제9항에 있어서, R1이 약 50내지 약 60몰%의 4가 벤조폐논 잔기인 광영상성 폴리이미드.
- 제9항에 있어서, 수 평균 분자량이 10,000g/mol 이상인 광영상성 폴리이미드.
- 용액 용매 및 제9항의 광영상성 폴리이미드를 포함하는 영역.
- 2,3,5,6―테트라메틸―1,4―페닐렌 디아민으로 구성된 디아민 성분과 2,2,―비스(3,4―디카복시페닐)-헥사플루오로프로판 이무수물 및 3,3′,4,4′―벤조페논 테트라카복실산 이무수물로 구성된 이무수물 성분의 중합성 축합 생성물을 포함하고 3,3′,4,4′―벤조페논 테트라카복실산 이무수물 약 50내지 약 60몰%를 함유하며 수 평균 분자량이 10,000g/mol 이상인 폴리이미드.
- 용액 용매 및 제14항의 광영상성 폴리이미드를 포함하는 용액.
- 제1항의 광영상성 폴리이미드 코팅물층 하나 이상으로 코팅된 기판 하나 이상을 포함하는 다층 구조물.
- 제9항의 공영상성 폴리이미드 코팅물층 하나 이상으로 코팅된 기판 하나 이상을 포함하는 다층 구조물.
- 제14항의 광영상성 폴리이미드 코팅물층 하나 이상으로 코팅된 기판 하나 이상을 포함하는 다층 구조물.
- a)제1항의 광영상성 폴리이미드 코팅물층으로 기판을 코팅하고; b)광영상성 폴리이미드 코팅물의 선택면적을 차폐물로 차폐시켜 은폐된 광영상성 폴리이미드 코팅물 및 노출된 광영상성 폴리이미드 코팅물 형태를 제공하고; c)노출된 광영상성 폴리이미드 코팅물을 화학선을 사용하여 가교결합시키고; d)차폐물을 제거하고; e)비노출 광영상성 폴리이미드 코팅물을 에칭 조성물을 사용하여 제거함을 특징으로 하여, 광영상성 폴리이미드 코팅물을 에칭하는 방법.
- a)제9항의 광영상성 폴리이미드 코팅물층으로 기판을 코팅하고; b)광영상성 폴리이키드 코팅물의 선택면적을 차폐물로 차폐시켜 은폐된 광영상성 폴리이미드 코킹물 및 노출된 광영상성 폴리이미드 코팅물 형태를 제공하고; c)노출된 광영상성 폴리이미드 코팅물을 화학선을 사용하여 가교결합시키고; d)차폐물을 제거하고; e)비노출 광영상성 폴리이미드 코팅물을 에칭 조성물을 사용하여 제거함을 특징으로 하여, 광영상성 폴리이미드 코팅물을 에칭하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52236390A | 1990-05-08 | 1990-05-08 | |
US522,363 | 1990-05-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910020502A true KR910020502A (ko) | 1991-12-20 |
Family
ID=24080568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910007401A KR910020502A (ko) | 1990-05-08 | 1991-05-08 | 광영상성 폴리이미드 코팅물 |
Country Status (6)
Country | Link |
---|---|
US (3) | US5501941A (ko) |
EP (1) | EP0456463A3 (ko) |
JP (1) | JP3024008B2 (ko) |
KR (1) | KR910020502A (ko) |
CA (1) | CA2040994A1 (ko) |
IE (1) | IE911543A1 (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427862A (en) * | 1990-05-08 | 1995-06-27 | Amoco Corporation | Photocurable polyimide coated glass fiber |
US5317082A (en) * | 1992-12-22 | 1994-05-31 | Amoco Corporation | Photodefinable optical waveguides |
KR100372995B1 (ko) * | 1994-05-24 | 2003-03-31 | 히다치 가세고교 가부시끼가이샤 | 반도체기판위에목적하는패턴의수지막을형성하는방법,반도체칩,반도체패키지,및레지스트상박리액 |
TW293832B (en) * | 1995-10-13 | 1996-12-21 | Du Pont | Polyimide alignment film from 2,2-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride and ortho-substituted aromatic diamines for active matrix liquid crystal displays |
US5798563A (en) * | 1997-01-28 | 1998-08-25 | International Business Machines Corporation | Polytetrafluoroethylene thin film chip carrier |
JPH1152572A (ja) * | 1997-08-08 | 1999-02-26 | Fujitsu Ltd | 感光性樹脂組成物及びそれを用いたパターン形成方法 |
US6569604B1 (en) | 1999-06-30 | 2003-05-27 | International Business Machines Corporation | Blind via formation in a photoimageable dielectric material |
US6542379B1 (en) | 1999-07-15 | 2003-04-01 | International Business Machines Corporation | Circuitry with integrated passive components and method for producing |
US6342333B1 (en) * | 1999-09-23 | 2002-01-29 | Hitachi Chemical Dupont Microsystems, L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
US6379865B1 (en) | 2000-04-11 | 2002-04-30 | 3M Innovative Properties Company | Photoimageable, aqueous acid soluble polyimide polymers |
SG148026A1 (en) * | 2000-06-21 | 2008-12-31 | Dainippon Printing Co Ltd | Laminate and use thereof |
US6803092B2 (en) | 2001-06-26 | 2004-10-12 | 3M Innovative Properties Company | Selective deposition of circuit-protective polymers |
JP2005196101A (ja) * | 2003-12-31 | 2005-07-21 | Rohm & Haas Electronic Materials Llc | ポリマーおよびこれを含むフォトレジスト組成物 |
KR100729256B1 (ko) * | 2005-01-13 | 2007-06-15 | 삼성전자주식회사 | 포토레지스트 조성물, 이를 이용한 포토레지스트 패턴의형성 방법 및 반도체 소자의 보호막 형성방법 |
TWI638214B (zh) * | 2013-08-09 | 2018-10-11 | 日商住友化學股份有限公司 | 配向膜形成用組成物 |
CN111816608B (zh) * | 2020-07-09 | 2023-05-09 | 电子科技大学 | 玻璃盲孔加工方法 |
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US3356648A (en) * | 1966-10-13 | 1967-12-05 | Du Pont | Polyamide-acids and polyimides from hexafluoropropylidine bridged diamine |
US3959350A (en) * | 1971-05-17 | 1976-05-25 | E. I. Du Pont De Nemours And Company | Melt-fusible linear polyimide of 2,2-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride |
US3822202A (en) * | 1972-07-20 | 1974-07-02 | Du Pont | Heat treatment of membranes of selected polyimides,polyesters and polyamides |
US4416973A (en) * | 1982-01-04 | 1983-11-22 | E. I. Du Pont De Nemours & Co. | Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound |
US4430418A (en) * | 1982-09-30 | 1984-02-07 | E. I. Du Pont De Nemours And Company | Radiation-sensitive polyimide precursor composition derived from a diaryl fluoronated diamine compound |
US4454220A (en) * | 1982-01-04 | 1984-06-12 | E. I. Du Pont De Nemours And Company | Electrical device containing a radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound |
US4629777A (en) * | 1983-05-18 | 1986-12-16 | Ciba-Geigy Corporation | Polyimides, a process for their preparation and their use |
US4657832A (en) * | 1983-05-18 | 1987-04-14 | Ciba-Geigy Corporation | Photosensitive polymers as coating materials |
US4656116A (en) * | 1983-10-12 | 1987-04-07 | Ciba-Geigy Corporation | Radiation-sensitive coating composition |
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US4562100A (en) * | 1984-09-14 | 1985-12-31 | E. I. Du Pont De Nemours And Company | Polyimide coating compositions from diesterified anhydride and aromatic diamine |
US4914181A (en) * | 1984-11-16 | 1990-04-03 | Ciba-Geigy Corporation | Polyimides, a process for their preparation and their use, and tetracarboxylic acids and tetracarboxylic acid derivatives |
US4786569A (en) * | 1985-09-04 | 1988-11-22 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
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US4925912A (en) * | 1987-12-15 | 1990-05-15 | Ciba-Geigy Corporation | Auto-photocrosslinkable copolyimides and polyimide compositions |
EP0321398B1 (de) * | 1987-12-15 | 1994-08-17 | Ciba-Geigy Ag | Autophotovernetzbare Copolyimide und Polyimidzusammensetzungen |
US5206091A (en) * | 1988-06-28 | 1993-04-27 | Amoco Corporation | Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings |
US4895972A (en) * | 1988-09-01 | 1990-01-23 | The United States Of American As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for lowering the dielectric constant of polyimides using diamic acid additives |
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CA2009085A1 (en) * | 1989-02-27 | 1990-08-27 | Rohitkumar H. Vora | Coatings of intermediate molecular weight polyimides |
JPH06233746A (ja) * | 1993-02-09 | 1994-08-23 | Terumo Corp | 脈波検出機能付体温計プローブ |
-
1991
- 1991-04-23 CA CA002040994A patent/CA2040994A1/en not_active Abandoned
- 1991-05-07 EP EP19910304109 patent/EP0456463A3/en not_active Withdrawn
- 1991-05-07 JP JP3130230A patent/JP3024008B2/ja not_active Expired - Lifetime
- 1991-05-07 IE IE154391A patent/IE911543A1/en unknown
- 1991-05-08 KR KR1019910007401A patent/KR910020502A/ko not_active Application Discontinuation
-
1994
- 1994-07-01 US US08/269,698 patent/US5501941A/en not_active Expired - Lifetime
-
1995
- 1995-05-26 US US08/450,915 patent/US5532110A/en not_active Expired - Lifetime
-
1996
- 1996-04-04 US US08/627,470 patent/US5599655A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5532110A (en) | 1996-07-02 |
IE911543A1 (en) | 1991-11-20 |
EP0456463A2 (en) | 1991-11-13 |
US5599655A (en) | 1997-02-04 |
JP3024008B2 (ja) | 2000-03-21 |
EP0456463A3 (en) | 1992-01-22 |
US5501941A (en) | 1996-03-26 |
JPH04226460A (ja) | 1992-08-17 |
CA2040994A1 (en) | 1991-11-09 |
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |