KR910013501A - 반도체 조립장치용 공급장치 - Google Patents

반도체 조립장치용 공급장치 Download PDF

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Publication number
KR910013501A
KR910013501A KR1019900019924A KR900019924A KR910013501A KR 910013501 A KR910013501 A KR 910013501A KR 1019900019924 A KR1019900019924 A KR 1019900019924A KR 900019924 A KR900019924 A KR 900019924A KR 910013501 A KR910013501 A KR 910013501A
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KR
South Korea
Prior art keywords
magazine
pusher
semiconductor assembly
driving
driving source
Prior art date
Application number
KR1019900019924A
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English (en)
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KR940005717B1 (ko
Inventor
히로시 우시끼
다까시 엔도오
히로유기 마쓰노
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR910013501A publication Critical patent/KR910013501A/ko
Application granted granted Critical
Publication of KR940005717B1 publication Critical patent/KR940005717B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • De-Stacking Of Articles (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

내용 없음.

Description

반도체 조립장치용 공급장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 제2도는 본 발명에 의해 된 반도체조립장치용 공급장치의 한 실시예를 도시하고,
제1도는 정면도,
제2도는 평면도,
제3도 내지 제6도는 푸셔장치의 한 실시예를 도시하고,
제3도는 정면도.

Claims (4)

  1. 다수의 피가공판을 적층해서 수납하는 매거진을 얹어서 승강하는 승강대를 가지고 있는 엘리베이터부와 상기 매거진을 안내하는 매거진 스토커와, 상기 매거진에 수납된 피가공판을 한장씩 외부로 밀어내는 푸셔아암 및 이 푸셔아암을 구동하는 구동원을 가지고 있는 푸셔장치를 구비한 반도체 조립장치용 공급장치에 있어서, 상기 매거진 스토커는 고정안내부재와, 피가공판의 밀어내는 방향으로 조정이 가능하게 부착된 가동안내부재로 만들어져 있고 상기 가동부재에 상기 푸셔장치를 부착한 것을 특징으로 하는 반도체 조립장치용 공급장치.
  2. 다수의 피가공판을 적층해서 수납하는 매거진을 얹어서 승강하는 승강대를 가지고 있는 엘리베이터부와 상기 매거진에 수납되어 있는 피가공판을 한장씩 외부로 밀어내는 푸셔아암 및 이 푸셔아암을 구동하는 구동원을 가지고 있는 푸셔장치를 구비한 반도체조립장치용의 공급장치에 있어서, 상기 푸셔장치의 구동원을 상기 매거진의 피가공판 적층방향을 따라서 배치한 것을 특징으로 하는 반도체 조립장치용 공급장치.
  3. 다수의 피가공판을 적층해서 수납하는 매거진을 얹어 승강하는 승강대를 가지고 있는 엘리베이터부와 상기 매거진에 수납된 피가공판을 한장씩 외부로 밀어내는 푸셔아암 및 이 푸셔아암을 구동하는 구동원을 가지고 있는 푸셔장치롤 구비한 반도체 조립장치용 공급장치에 있어서, 상기 구동원의 동작을 상기 푸셔아암에 전달하는 동작 연결수단에 탄성부재와 연결부재를 설치하고, 상기 탄성부재의 변형에 의해 생기는 상기 연결부재의 변위를 검출하는 검출수단을 구비한 것을 특징으로 하는 반도체 조립장치용 공급장치.
  4. 제2항 또는 제3항에 있어서, 구동원은 에어실린더로 된 것을 특징으로 하는 반도체 조립장치용 공급장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900019924A 1989-12-11 1990-12-05 반도체 조립장치용 공급장치 KR940005717B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-318804 1989-12-11
JP1318804A JP2681703B2 (ja) 1989-12-11 1989-12-11 半導体組立装置用供給装置

Publications (2)

Publication Number Publication Date
KR910013501A true KR910013501A (ko) 1991-08-08
KR940005717B1 KR940005717B1 (ko) 1994-06-23

Family

ID=18103128

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900019924A KR940005717B1 (ko) 1989-12-11 1990-12-05 반도체 조립장치용 공급장치

Country Status (3)

Country Link
US (1) US5097983A (ko)
JP (1) JP2681703B2 (ko)
KR (1) KR940005717B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100910967B1 (ko) * 2008-05-09 2009-08-05 하남전기주식회사 자동 임펠러 조립기의 블레이드 부품 벤딩장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897290A (en) * 1997-07-30 1999-04-27 Industrial Technology Research Institute Lead frame magazine handling device
US6755323B2 (en) * 2000-11-22 2004-06-29 Accu-Sort Systems, Inc. Apparatus for dispensing articles
KR100432672B1 (ko) * 2001-02-05 2004-05-31 동명테크 주식회사 반도체 패키지 테이핑 머신의 레일 간격 조절장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3100583A (en) * 1962-08-02 1963-08-13 Big Drum Inc Lid-dispenser
US4693659A (en) * 1983-08-26 1987-09-15 Mountain Computer, Inc. Diskette transport
US4717304A (en) * 1986-11-04 1988-01-05 Amp Incorporated Electrical connector feeding apparatus
IT1201603B (it) * 1986-12-16 1989-02-02 Wrapmatic Spa Apparecchiatura per la selezione automatica di grandi risme sfuso a partire da un pacco di fogli impilati e per la loro alimentazione a macchine confezionatrici e metodo relativo
IT1201604B (it) * 1986-12-16 1989-02-02 Wramatic Spa Apparecchiatura e metodo per la selezione automatica di grandi risme sfuse a partire da un pacco di fogli impilati provvisto di segnalini definenti le risme

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100910967B1 (ko) * 2008-05-09 2009-08-05 하남전기주식회사 자동 임펠러 조립기의 블레이드 부품 벤딩장치

Also Published As

Publication number Publication date
KR940005717B1 (ko) 1994-06-23
US5097983A (en) 1992-03-24
JP2681703B2 (ja) 1997-11-26
JPH03181140A (ja) 1991-08-07

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