KR910007105B1 - 웨이퍼보드 반송용치구(治具) - Google Patents
웨이퍼보드 반송용치구(治具) Download PDFInfo
- Publication number
- KR910007105B1 KR910007105B1 KR1019880008741A KR880008741A KR910007105B1 KR 910007105 B1 KR910007105 B1 KR 910007105B1 KR 1019880008741 A KR1019880008741 A KR 1019880008741A KR 880008741 A KR880008741 A KR 880008741A KR 910007105 B1 KR910007105 B1 KR 910007105B1
- Authority
- KR
- South Korea
- Prior art keywords
- jig
- wafer board
- board
- wafer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012546 transfer Methods 0.000 title description 6
- 235000012431 wafers Nutrition 0.000 description 44
- 238000010438 heat treatment Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002283 diesel fuel Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988068286U JPH01171027U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-24 | 1988-05-24 | |
| JP62-68286(U) | 1988-05-24 | ||
| JP63-68286 | 1988-05-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR890017792A KR890017792A (ko) | 1989-12-18 |
| KR910007105B1 true KR910007105B1 (ko) | 1991-09-18 |
Family
ID=31293612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019880008741A Expired KR910007105B1 (ko) | 1988-05-24 | 1988-07-14 | 웨이퍼보드 반송용치구(治具) |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH01171027U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| KR (1) | KR910007105B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0612760B2 (ja) * | 1984-07-09 | 1994-02-16 | 東芝セラミックス株式会社 | 石英ガラス製ウェハボ−ト搬送治具 |
-
1988
- 1988-05-24 JP JP1988068286U patent/JPH01171027U/ja active Pending
- 1988-07-14 KR KR1019880008741A patent/KR910007105B1/ko not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01171027U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-12-04 |
| KR890017792A (ko) | 1989-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19880714 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19881102 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19880714 Comment text: Patent Application |
|
| PG1501 | Laying open of application | ||
| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
Comment text: Decision on Publication of Application Patent event code: PG16051S01I Patent event date: 19910820 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19911217 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19920219 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 19920219 End annual number: 3 Start annual number: 1 |
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| PR1001 | Payment of annual fee |
Payment date: 19940912 Start annual number: 4 End annual number: 4 |
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| PR1001 | Payment of annual fee |
Payment date: 19950915 Start annual number: 5 End annual number: 5 |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| PR1001 | Payment of annual fee |
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| FPAY | Annual fee payment |
Payment date: 20070619 Year of fee payment: 17 |
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| PR1001 | Payment of annual fee |
Payment date: 20070619 Start annual number: 17 End annual number: 17 |
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| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |