KR910006510A - Solder plating products for copper alloys and tin plating products for copper alloys - Google Patents

Solder plating products for copper alloys and tin plating products for copper alloys Download PDF

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Publication number
KR910006510A
KR910006510A KR1019900014305A KR900014305A KR910006510A KR 910006510 A KR910006510 A KR 910006510A KR 1019900014305 A KR1019900014305 A KR 1019900014305A KR 900014305 A KR900014305 A KR 900014305A KR 910006510 A KR910006510 A KR 910006510A
Authority
KR
South Korea
Prior art keywords
copper alloys
total amount
plating products
tin
elements
Prior art date
Application number
KR1019900014305A
Other languages
Korean (ko)
Other versions
KR930005262B1 (en
Inventor
겐지 구보소노
다카시 나카지마
도시히코 모리
게이조 기타가제
Original Assignee
시키모리야
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1235401A external-priority patent/JPH0397888A/en
Priority claimed from JP1235402A external-priority patent/JPH0397841A/en
Application filed by 시키모리야, 미쓰비시덴키 가부시키가이샤 filed Critical 시키모리야
Publication of KR910006510A publication Critical patent/KR910006510A/en
Application granted granted Critical
Publication of KR930005262B1 publication Critical patent/KR930005262B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon

Abstract

내용 없음No content

Description

동합금용 땜납도금품 및 동합금용 주석도금표Solder plating products for copper alloys and tin plating tables for copper alloys

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 그의 가열 후의 모형단면도,2 is a model cross section after its heating,

제4도는 그의 가열 후의 모형단면도.4 is a model cross-sectional view after its heating.

Claims (4)

도금조성으로서 중량기준으로 Zn0.03∼5%를 함유하고, 남은부분이 Sn, Pb및 불가피한 원소로 이루어지고, Zn와 Pb의 합계량이 98%이상인 것을 특징으로 하는 동합금용 땜납도금품.It is a plating composition containing Zn0.03-5% by weight, and the remainder consists of Sn, Pb, and an unavoidable element, and the total amount of Zn and Pb is 98% or more. 도금조성으로서 중량기준으로, Zn0.03∼5%를 함유하고, 남은부분이 Sn, Pb및 다른 원소로 이루어지고, Zn와 Pb의 합계량이 98%이상, 다른 원소의 합계량이 2%이하, 또 Fe, Ni, Co, Si및 P의 합계량이 0.4%이하인 것을 특징으로 하는 동합금용 땜납도금품.As a plating composition, Zn0.03-5% is contained by weight, and the remainder consists of Sn, Pb, and other elements, the total amount of Zn and Pb is 98% or more, the total amount of other elements is 2% or less, and A copper alloy solder plated product, characterized in that the total amount of Fe, Ni, Co, Si, and P is 0.4% or less. 도금조성으로서 중량기준으로 Zn0.03∼5%를 함유하고, 남은부분이 Sn및 불가피한 원소로 이루어지고, Zn와 Sn의 합계량이 98%이상인 것을 특징으로 하는 동합금용 주석도금품.A tin-plated product for copper alloys, comprising Zn0.03 to 5% by weight as a plating composition, the remainder being made of Sn and an unavoidable element, and the total amount of Zn and Sn is 98% or more. 도금조성으로서 중량기준으로, Zn0.03∼5%를 함유하고, 남은부분이 Sn 및 다른 원소로 이루어지고, Zn와 Sn의 합계량이 98%이상, 다른 원소의 합계량이 2%이하, 또 Fe, Ni, Co, Si및 P의 합계량이 0.4%이하인 것을 특징으로하는 동합금의 주석도금품.As a plating composition, Zn0.03-5% is contained by weight, and the remainder consists of Sn and other elements, the total amount of Zn and Sn is 98% or more, the total amount of other elements is 2% or less, and Fe, Tin-plated copper alloy, characterized in that the total amount of Ni, Co, Si and P is 0.4% or less. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900014305A 1989-09-11 1990-09-11 Soldered product and tinned product for copper alloy KR930005262B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1235401A JPH0397888A (en) 1989-09-11 1989-09-11 Tinned copper alloy product
JP1235402A JPH0397841A (en) 1989-09-11 1989-09-11 Soldered product for copper alloy
JP1-235401 1989-09-11
JP1-235402 1989-09-11

Publications (2)

Publication Number Publication Date
KR910006510A true KR910006510A (en) 1991-04-29
KR930005262B1 KR930005262B1 (en) 1993-06-17

Family

ID=26532105

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900014305A KR930005262B1 (en) 1989-09-11 1990-09-11 Soldered product and tinned product for copper alloy

Country Status (1)

Country Link
KR (1) KR930005262B1 (en)

Also Published As

Publication number Publication date
KR930005262B1 (en) 1993-06-17

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