KR910006389A - 전자파 실드용 도전성(導電性) 수지 조성물 - Google Patents

전자파 실드용 도전성(導電性) 수지 조성물 Download PDF

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Publication number
KR910006389A
KR910006389A KR1019900007174A KR900007174A KR910006389A KR 910006389 A KR910006389 A KR 910006389A KR 1019900007174 A KR1019900007174 A KR 1019900007174A KR 900007174 A KR900007174 A KR 900007174A KR 910006389 A KR910006389 A KR 910006389A
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KR
South Korea
Prior art keywords
less
resin composition
conductive resin
electromagnetic shielding
shielding according
Prior art date
Application number
KR1019900007174A
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English (en)
Other versions
KR950012656B1 (ko
Inventor
카즈히토 가타오카
Original Assignee
산몬지 마사히사
도오 까이 카아본 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 산몬지 마사히사, 도오 까이 카아본 가부시기가이샤 filed Critical 산몬지 마사히사
Publication of KR910006389A publication Critical patent/KR910006389A/ko
Application granted granted Critical
Publication of KR950012656B1 publication Critical patent/KR950012656B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/12—Polypropene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

내용 없음

Description

전자파 실드용 도전성(導電性) 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 열가소성 수지 100중량부에 대하여, 질소흡착비표면적 50㎡/g이하, DBP흡유량 90㎖/100g이하, 압축전기 비저항(50㎏/㎠시) 0.25Ω㎝이하의 성상특성을 갖는 카번블랙 및 흑연 미분말을 합계량으로서 100∼260중량부의 비율로 배합하여 이루어지는 전자파실드용 도전성 수지조성물.
  2. 제1항에 있어서, 전기한 카번블랙과 전기한 흑연 미분말의 배합비율이 중량비로 1:3:∼2:1의 범위인 전자 파실드용 도전성 수지조성물.
  3. 제1항에 있어서, 전기한 흑연미분말의 평균입자경이 100㎛이하인 전자파실드용 도전성 수지조성물.
  4. 제1항에 있어서, 전기한 카번블랙과 전기한 흑연미분말의 배합비율이 중량비로 1:2∼3의 범위인 전자파실드용 도전성 수지조성물.
  5. 제1항에 있어서, 전기한 카번블랙이 질소흡착비표면적 50㎡/g이하, DBP흡유량 90㎡/100g이하의 특성을 갖는 카번블랙을 불활성 가스중에서 100℃이하로 가열하여 얻어지는 전자파 실드용 도전성 수지조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900007174A 1989-09-07 1990-05-19 전자파 실드용 도전성(導電性) 수지 조성물 KR950012656B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP??1-232428 1989-09-07
JP1-232428 1989-09-07
JP1232428A JPH0395803A (ja) 1989-09-07 1989-09-07 電磁波シールド用導電性樹脂組成物

Publications (2)

Publication Number Publication Date
KR910006389A true KR910006389A (ko) 1991-04-29
KR950012656B1 KR950012656B1 (ko) 1995-10-19

Family

ID=16939115

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900007174A KR950012656B1 (ko) 1989-09-07 1990-05-19 전자파 실드용 도전성(導電性) 수지 조성물

Country Status (2)

Country Link
JP (1) JPH0395803A (ko)
KR (1) KR950012656B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526485B1 (ko) * 1997-12-31 2006-03-09 주식회사 케이씨씨 저온 경화형 수지를 함유하는 분체도료 조성물

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2574076B2 (ja) * 1991-05-21 1997-01-22 帝人化成株式会社 導電性熱可塑性樹脂組成物
JP3972523B2 (ja) * 1999-07-07 2007-09-05 松下電器産業株式会社 カーボンペースト
JP4759852B2 (ja) * 2001-06-01 2011-08-31 Ｎｏｋ株式会社 電磁波シールド用ゴム組成物
WO2006003924A1 (ja) * 2004-06-30 2006-01-12 Denki Kagaku Kogyo Kabushiki Kaisha 電磁波吸収体
JP2009054983A (ja) * 2007-01-17 2009-03-12 Mitsubishi Pencil Co Ltd 電波吸収材およびその製造方法
JP2020055889A (ja) * 2017-01-31 2020-04-09 Ｎｔｉ株式会社 樹脂コンパウンド及び樹脂コンパウンドを成型した成形物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526485B1 (ko) * 1997-12-31 2006-03-09 주식회사 케이씨씨 저온 경화형 수지를 함유하는 분체도료 조성물

Also Published As

Publication number Publication date
JPH0395803A (ja) 1991-04-22
KR950012656B1 (ko) 1995-10-19

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