KR900007996A - 신호전송 장치용 봉입 조성물 - Google Patents
신호전송 장치용 봉입 조성물 Download PDFInfo
- Publication number
- KR900007996A KR900007996A KR1019890017080A KR890017080A KR900007996A KR 900007996 A KR900007996 A KR 900007996A KR 1019890017080 A KR1019890017080 A KR 1019890017080A KR 890017080 A KR890017080 A KR 890017080A KR 900007996 A KR900007996 A KR 900007996A
- Authority
- KR
- South Korea
- Prior art keywords
- oxirane
- encapsulation composition
- composition
- reaction product
- anhydride
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
- G02B6/4401—Optical cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/26—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances asphalts; bitumens; pitches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
- H01B7/282—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable
- H01B7/285—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable by completely or partially filling interstices in the cable
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Lubricants (AREA)
- Epoxy Resins (AREA)
- Cable Accessories (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sampling And Sample Adjustment (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Paints Or Removers (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (19)
- 신호 전도 장치의 접속물을 봉합하기 위하여 사용할 수 있으며, 그리이스와 양립성이 있고, 가수분해에 안정한 유전 봉입 조성물에있어서, (a)반응 무수물 부를 가진 유효양의 무수 작용 화합물 ; (b)상기 화합물의 무수물부와 반응하여 경화된 가교 결합물질을 형성할 수 있는 유효앙의 가교결합제 ; 및 (c)가수분해 안정성을 제공하는 유효양의옥시란 함유물질의 혼합물이 연장반응 생성물로 구성되어 있으며; 상기 반응 생성물이 봉입물 중에 5와 95 중량% 사이의 범위에존재하는 적어도 하나늬 가소재로 연장되어 있고, 상기 적어도 하나의 가소제가 상기 반응 생성물과 거의 비활성이며, 또한 비침출성이고 ; 상기 봉입물이 최소한 4개의 C - H결합값을 가진 봉입 조성물.
- 제1항에 있어서, 상기 옥시란 함유물질이 적어도 하나의 옥시란기를 가진 봉입 조성물.
- 제2항에 있어서, 상기 혼합물이 약 0.25 : 1.5 사이의 무수물 작용 화합물당량 : 에폭시당량의 비를 가진 봉입 조성물.
- 제3항에 있어서, 상기 비가 약 0.25 : 0.55 사이인 봉입 조성물.
- 제2항에 있어서, 상기 옥시란 함유 물질이 지방족알킬, 알케닐, 알카니엔 및 시클로알킬 에폭시로 구성된군으로 부터 선택되는 봉입 조성물.
- 제5항에 있어서, 상기 옥시란 함유 물질이 지방족 글리시딜 에테르, 지방족 글리시딜 에스테르, 에폭시화디엔, 에폭시화 폴리에스테르, 에폭시화 알파올레핀, 에폭시와 폴리올레핀, 에폭시화 천연고무, 에폭시화 오일로 구성된 군으로부터 선택되는 봉입조성물.
- 제6항에 있어서, 상기 옥시란 함유 물질이 에폭시화 오일인 봉입 조성물.
- 제7항에 있어서, 상기 에폭시화 오일이 에폭시화 폴리불포화 식물성 기름인 봉입 조성물.
- 제2항에 있어서, 상기 옥시란 함유 물질이 모노에폭시, 디에폭시 및 폴리에폭시화합물, 그리고 그것의 결합물로 구성된 군으로 선택되는 봉입 조성물.
- 제1항에있어서, 상기 옥시란 함유 물질이 상기 반응 생성물의 전체 고체중에 약 1.5-50 중량% 사이의 범위로 존재하는 봉입 조성물.
- 제10항에 있어서, 상기 무수를 작용화합물이 상기 반응생성물의 전체고체중에 약 1-90중량%사이의 범위로 존재하며, 가교 결합체가 반응 생성물의 전체고체중에 약 0.5-80중량% 사이의 범위로 존재하는 봉입 조성물.
- 제1항에 있어서, 상기 무수물 작용화합물이 봉입물의 전체 중량중에 약 3-60중량% 범위의 양으로 존재하며, 상기 가교 결합제는 약 1-30중량% 범위의 양으로 존재하고, 상기 옥시란 함유 물질인 약 1.5-20중량% 범위의 양으로 존재하는 봉입 조성물.
- 제11항에 있어서, 상기 반응 생성물의 전체 고체중에 약 0.1 과 5중량% 사이의 양으로 존재하는 촉매로 구성되는 봉입 조성물.
- 제1항에 있어서, 상기 봉입물이 약 21,1N /㎠ 이하의 인장강도와 약 50-250% 사이의 신장율을 가진 봉입 조성물.
- 제1항에 있어서, 약 7.9 - 9.5 사이의 전체용해도 변수를 가지는 봉입 조성물.
- 제1항에 있어서, 최소한 80의 폴리카르보네이트 양립치를 가진 봉입조성물.
- a)신호 전송장치와 b) 제1항에 따른 봉입물로 구성되는 신호 전송부품.
- 신호 전송장치를 봉입하는 데 사용될 수 있는 가수분해 안정성 유전 봉입 조성물에 있어서, 1) a)반응 무수부룰 가진 유효양의 무수물 작용 화합물 ; b)상기 화합물의 무수물부와 반응하여 경화된 가교 결합 물질을 형성할 수 있는 유효양의 폴리올 가교 결합제 ; c )가부분해 안정성을 제공하는데 충분한 유효양의 옥시란 물질; d)25℃에서 약 24시간 이하로 반응을 접촉시킬 수 있는 상기 무수물 작용 화합물, 상기 폴리올 가교결합체와 상기 옥시란 물질 사이의 반응을 일으키는 유효양의 촉매의 혼합물의 연장된 반응 생성물; 그리고 2)상기 봉입물 중에 5와 95% 사이의 범위로 존재하고 상기 반응 생성물과 거의 비활성이면서 비침출성인 적어도 하나의 가소제로 구성되며, 상기 봉입물이 최소한 4의 C - H 결합값을 가지는 봉입 조성물.
- 1) 무수물 반응부를 가진 무수물 작용 화합물; 2) 상기 무수물 작용 화합물의 반응부와 반응할 수 있는 가교 결합제;3) 가수분해 안정성을 제공할 수 있는 옥시란 물질 ; 및4) 상기 무수물 작용 화합물, 상기 가교결합제 및 상기 옥시란 물질의 반응 생성물과 거의 비활성이면서 비침출성인 적어도 하나의 유기 가소제 물질로 구성되며, 상기 봉입물이 최소한 4의 C - H 경합값을 가진 액체 봉입 조성물을 실온에서 인클로우져에 붓는 것으로 구성되는 인클로우저의 충전방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/274,337 US4985475A (en) | 1987-03-09 | 1988-11-25 | Encapsulant compositions for use in signal transmission devices |
US274,337 | 1988-11-25 | ||
US274.337 | 1988-11-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900007996A true KR900007996A (ko) | 1990-06-02 |
KR0135973B1 KR0135973B1 (ko) | 1998-04-24 |
Family
ID=23047769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890017080A KR0135973B1 (ko) | 1988-11-25 | 1989-11-24 | 신호전송 장치용 피막형성제 조성물 |
Country Status (10)
Country | Link |
---|---|
US (1) | US4985475A (ko) |
EP (1) | EP0372747B1 (ko) |
JP (1) | JP2772075B2 (ko) |
KR (1) | KR0135973B1 (ko) |
AT (1) | ATE126923T1 (ko) |
AU (1) | AU620662B2 (ko) |
BR (1) | BR8905961A (ko) |
CA (1) | CA2003781C (ko) |
DE (1) | DE68923935T2 (ko) |
ES (1) | ES2076218T3 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5169716A (en) * | 1987-03-09 | 1992-12-08 | Minnesota Mining And Manufacturing Company | Encapsulant compositions for use in signal transmission devices |
JPH02296821A (ja) * | 1989-05-12 | 1990-12-07 | Nippon Oil Co Ltd | 常温硬化性樹脂組成物 |
JPH0819315B2 (ja) * | 1990-04-05 | 1996-02-28 | 日本ペイント株式会社 | 熱硬化性樹脂組成物 |
US5231248A (en) * | 1991-07-17 | 1993-07-27 | W. L. Gore & Associates, Inc. | Sterilizable cable assemblies |
US5698631A (en) * | 1996-05-30 | 1997-12-16 | Uniroyal Chemical Company, Inc. | Epoxy resin compositions for encapsulating signal transmission devices |
US6664318B1 (en) | 1999-12-20 | 2003-12-16 | 3M Innovative Properties Company | Encapsulant compositions with thermal shock resistance |
US20040101689A1 (en) * | 2002-11-26 | 2004-05-27 | Ludovic Valette | Hardener composition for epoxy resins |
WO2007067393A2 (en) * | 2005-12-05 | 2007-06-14 | Corning Cable Systems Llc | Polyester gel adapted for use with polycarbonate components |
US20080207049A1 (en) * | 2007-02-28 | 2008-08-28 | Ziwei Liu | Nanocone silicone gel for telecommunication interconnect devices |
US8008422B2 (en) * | 2008-07-11 | 2011-08-30 | 3M Innovative Properties Company | Curable resin composition |
CN102884127A (zh) * | 2010-05-10 | 2013-01-16 | 3M创新有限公司 | 阻燃密封剂组合物 |
US11926767B2 (en) * | 2020-02-12 | 2024-03-12 | Dic Corporation | Adhesive composition, laminate, and package |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US532299A (en) * | 1895-01-08 | Ink-well | ||
US703101A (en) * | 1901-06-08 | 1902-06-24 | Walter F Ware | Medicine-dropper. |
US3518213A (en) * | 1967-08-05 | 1970-06-30 | Nippon Oil Co Ltd | Aqueous resinous coating compositions for electrophoretic deposition |
US3553153A (en) * | 1968-01-02 | 1971-01-05 | Gulf Research Development Co | Curable resin composition containing a saturated monooxirane compound, a solid polyanhydride, water and a soluble tertiary amine; and method of production and article |
US3527720A (en) * | 1969-04-07 | 1970-09-08 | Minnesota Mining & Mfg | Epoxy resin compositions including castor oil for flexibility |
US3897514A (en) * | 1973-07-09 | 1975-07-29 | Hercules Inc | Curing hydroxy-terminated prepolymer using anhydride/epoxide curing system |
US4259540A (en) * | 1978-05-30 | 1981-03-31 | Bell Telephone Laboratories, Incorporated | Filled cables |
EP0023084B1 (en) * | 1979-06-26 | 1985-08-07 | The British Petroleum Company p.l.c. | Cross-linked polymer compositions and production thereof |
EP0049098B1 (en) * | 1980-09-26 | 1984-05-09 | The British Petroleum Company p.l.c. | Cross-linked polymer compositions and production thereof |
US4532299A (en) * | 1982-01-12 | 1985-07-30 | Ameron, Inc. | Flexibilized chemically resistant epoxy resin |
CA1224595A (en) * | 1982-12-06 | 1987-07-21 | Lyle M. Kruschke | Two-part, low-viscosity epoxy resin composition |
GB8322399D0 (en) * | 1983-08-19 | 1983-09-21 | Ici Plc | Coating compositions |
FR2554112B1 (fr) * | 1983-10-28 | 1986-05-16 | Charbonnages Ste Chimique | Procede de reticulation de polymeres d'ethylene contenant des fonctions anhydride, compositions polymeres reticulables et application de ces compositions a l'enduction de substrats |
US4703101A (en) * | 1985-08-19 | 1987-10-27 | Ppg Industries, Inc. | Liquid crosslinkable compositions using polyepoxides and polyacids |
JPS62260816A (ja) * | 1986-05-08 | 1987-11-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
-
1988
- 1988-11-25 US US07/274,337 patent/US4985475A/en not_active Expired - Lifetime
-
1989
- 1989-11-20 AU AU45338/89A patent/AU620662B2/en not_active Ceased
- 1989-11-21 EP EP89312078A patent/EP0372747B1/en not_active Expired - Lifetime
- 1989-11-21 ES ES89312078T patent/ES2076218T3/es not_active Expired - Lifetime
- 1989-11-21 AT AT89312078T patent/ATE126923T1/de not_active IP Right Cessation
- 1989-11-21 DE DE68923935T patent/DE68923935T2/de not_active Expired - Lifetime
- 1989-11-24 KR KR1019890017080A patent/KR0135973B1/ko not_active IP Right Cessation
- 1989-11-24 CA CA002003781A patent/CA2003781C/en not_active Expired - Lifetime
- 1989-11-24 JP JP1306376A patent/JP2772075B2/ja not_active Expired - Fee Related
- 1989-11-27 BR BR898905961A patent/BR8905961A/pt not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2772075B2 (ja) | 1998-07-02 |
CA2003781A1 (en) | 1990-05-25 |
DE68923935D1 (de) | 1995-09-28 |
EP0372747A2 (en) | 1990-06-13 |
EP0372747B1 (en) | 1995-08-23 |
US4985475A (en) | 1991-01-15 |
AU4533889A (en) | 1990-05-31 |
ES2076218T3 (es) | 1995-11-01 |
BR8905961A (pt) | 1990-06-19 |
ATE126923T1 (de) | 1995-09-15 |
CA2003781C (en) | 1999-02-16 |
AU620662B2 (en) | 1992-02-20 |
DE68923935T2 (de) | 1996-01-11 |
EP0372747A3 (en) | 1990-10-10 |
KR0135973B1 (ko) | 1998-04-24 |
JPH02212580A (ja) | 1990-08-23 |
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