KR900007619B1 - 납땜의 도포중 전기 전자 소자의 지지 장치 - Google Patents
납땜의 도포중 전기 전자 소자의 지지 장치 Download PDFInfo
- Publication number
- KR900007619B1 KR900007619B1 KR1019850005502A KR850005502A KR900007619B1 KR 900007619 B1 KR900007619 B1 KR 900007619B1 KR 1019850005502 A KR1019850005502 A KR 1019850005502A KR 850005502 A KR850005502 A KR 850005502A KR 900007619 B1 KR900007619 B1 KR 900007619B1
- Authority
- KR
- South Korea
- Prior art keywords
- door
- carrier
- platform
- slope
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8419420 | 1984-07-30 | ||
| GB84-19420 | 1984-07-30 | ||
| GB848419420A GB8419420D0 (en) | 1984-07-30 | 1984-07-30 | Holding electronic components during application of solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR860000916A KR860000916A (ko) | 1986-02-20 |
| KR900007619B1 true KR900007619B1 (ko) | 1990-10-17 |
Family
ID=10564674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019850005502A Expired KR900007619B1 (ko) | 1984-07-30 | 1985-07-29 | 납땜의 도포중 전기 전자 소자의 지지 장치 |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US4677937A (enExample) |
| EP (1) | EP0171257B1 (enExample) |
| KR (1) | KR900007619B1 (enExample) |
| AT (1) | ATE52152T1 (enExample) |
| BR (1) | BR8503603A (enExample) |
| CA (1) | CA1250671A (enExample) |
| DE (1) | DE3577257D1 (enExample) |
| DK (1) | DK340885A (enExample) |
| GB (1) | GB8419420D0 (enExample) |
| HK (1) | HK71395A (enExample) |
| IE (1) | IE57204B1 (enExample) |
| IN (1) | IN164962B (enExample) |
| MY (1) | MY102596A (enExample) |
| NO (1) | NO852993L (enExample) |
| PH (1) | PH26753A (enExample) |
| SG (1) | SG72790G (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4856455A (en) * | 1984-07-30 | 1989-08-15 | Sun Industrial Coatings Private Ltd. | Apparatus for holding electrical or electronic components during the application of solder |
| GB8520844D0 (en) * | 1985-08-20 | 1985-09-25 | Sun Ind Coatings | Holding electrical/electronic components |
| GB8616938D0 (en) * | 1986-07-11 | 1986-08-20 | Sun Ind Coatings Pte Ltd | Holding electrical/electronic components |
| US5611475A (en) * | 1986-07-11 | 1997-03-18 | Sun Industrial Coatings Private Ltd. | Soldering apparatus |
| US4869202A (en) * | 1988-11-18 | 1989-09-26 | Baker Jess J | Solder dip fixture |
| US4961955A (en) * | 1988-12-20 | 1990-10-09 | Itt Corporation | Solder paste applicator for circuit boards |
| US5116185A (en) * | 1990-05-01 | 1992-05-26 | Lsi Logic Corp. | Vibratory tube-to-tube transfer system |
| US6131793A (en) * | 1998-03-27 | 2000-10-17 | Mcms, Inc. | Reflow soldering apparatus |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5254583A (en) * | 1975-10-29 | 1977-05-04 | Hitachi Ltd | Method of encasing electronic parts in magazine |
| US4194865A (en) * | 1977-05-12 | 1980-03-25 | Dai-Ichi Seiko Co., Ltd. | Insert loading apparatus in transfer encapsulation |
| JPS5976662A (ja) * | 1982-10-22 | 1984-05-01 | Tamura Seisakusho Co Ltd | 被はんだ付け物整列支持用の治具 |
| JPS59118265A (ja) * | 1982-12-22 | 1984-07-07 | Tamura Seisakusho Co Ltd | はんだ付け用保持治具 |
| JPS59118266A (ja) * | 1982-12-22 | 1984-07-07 | Tamura Seisakusho Co Ltd | はんだ付け用保持治具 |
| US4570569A (en) * | 1983-11-14 | 1986-02-18 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
| JPS6136363U (ja) * | 1984-07-31 | 1986-03-06 | 株式会社 タムラ製作所 | 被はんだ付け物整列支持用の治具 |
-
1984
- 1984-07-30 GB GB848419420A patent/GB8419420D0/en active Pending
-
1985
- 1985-07-26 DK DK340885A patent/DK340885A/da not_active Application Discontinuation
- 1985-07-29 CA CA000487648A patent/CA1250671A/en not_active Expired
- 1985-07-29 KR KR1019850005502A patent/KR900007619B1/ko not_active Expired
- 1985-07-29 NO NO852993A patent/NO852993L/no unknown
- 1985-07-29 BR BR8503603A patent/BR8503603A/pt unknown
- 1985-07-30 AT AT85305437T patent/ATE52152T1/de not_active IP Right Cessation
- 1985-07-30 EP EP85305437A patent/EP0171257B1/en not_active Expired - Lifetime
- 1985-07-30 US US06/760,585 patent/US4677937A/en not_active Expired - Fee Related
- 1985-07-30 IE IE1899/85A patent/IE57204B1/xx unknown
- 1985-07-30 IN IN610/DEL/85A patent/IN164962B/en unknown
- 1985-07-30 PH PH32580A patent/PH26753A/en unknown
- 1985-07-30 DE DE8585305437T patent/DE3577257D1/de not_active Expired - Fee Related
-
1987
- 1987-09-16 MY MYPI87001685A patent/MY102596A/en unknown
-
1990
- 1990-09-03 SG SG727/90A patent/SG72790G/en unknown
-
1995
- 1995-05-11 HK HK71395A patent/HK71395A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| IE57204B1 (en) | 1992-06-03 |
| US4677937A (en) | 1987-07-07 |
| DE3577257D1 (de) | 1990-05-23 |
| CA1250671A (en) | 1989-02-28 |
| EP0171257A2 (en) | 1986-02-12 |
| IN164962B (enExample) | 1989-07-15 |
| BR8503603A (pt) | 1986-04-29 |
| ATE52152T1 (de) | 1990-05-15 |
| HK71395A (en) | 1995-05-19 |
| DK340885D0 (da) | 1985-07-26 |
| SG72790G (en) | 1990-10-26 |
| IE851899L (en) | 1986-01-30 |
| MY102596A (en) | 1992-08-17 |
| PH26753A (en) | 1992-09-28 |
| DK340885A (da) | 1986-01-31 |
| NO852993L (no) | 1986-01-31 |
| GB8419420D0 (en) | 1984-09-05 |
| KR860000916A (ko) | 1986-02-20 |
| EP0171257B1 (en) | 1990-04-18 |
| EP0171257A3 (en) | 1986-09-03 |
Similar Documents
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|---|---|---|
| KR900007619B1 (ko) | 납땜의 도포중 전기 전자 소자의 지지 장치 | |
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| US4856455A (en) | Apparatus for holding electrical or electronic components during the application of solder | |
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| JPH053745B2 (enExample) | ||
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| DE8414476U1 (de) | Vorrichtung zum brennen von halbleiterbauelementen | |
| KR940004114Y1 (ko) | Ic 반도체 땜납용 지그 | |
| DE2020803C3 (de) | Behandlungsmagazin für mehrere gleichdimensionierte Halbleiterscheiben |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
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| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
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| FPAY | Annual fee payment |
Payment date: 19970204 Year of fee payment: 7 |
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St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 19971018 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |