KR900002673A - 연결와이어의 이송 조절방법 및 그 장치 - Google Patents
연결와이어의 이송 조절방법 및 그 장치 Download PDFInfo
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- KR900002673A KR900002673A KR1019890002112A KR890002112A KR900002673A KR 900002673 A KR900002673 A KR 900002673A KR 1019890002112 A KR1019890002112 A KR 1019890002112A KR 890002112 A KR890002112 A KR 890002112A KR 900002673 A KR900002673 A KR 900002673A
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- 238000000034 method Methods 0.000 title claims 11
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 3
- 230000001154 acute effect Effects 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000002441 reversible effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 장치의 일실시예를 개략적으로 나타낸 요부 발췌 도면도 ;
제2도는 제1도로 나타낸 실시예를 개량신킨 장치의 요부 발췌 측면도 ;
제3도는 본 발명의 작용 상태도로서 제2의 “접착”이 되기 직전에 루우프의 형성 및 모세관의 위치를 나타낸 상태도.
Claims (13)
- 상하좌우로 이동되는 연결헤드(21)의 왯지 또는 모세관(22)으로 연결와이어, 특히 금선으로 된 연결와이어(10)의 이송을 조절하는 장치에 있어서, 상기한 왯지 또는 모세관(22)의 상방으로 배설되고, 통로(18), 오리피스(19) 및 안내도관(20)을 구비한 안내구(12)와, 이에 압축가스 공급원, 특히 압축공기 공급원(13)과 진공 공급원(14)이 선택적으로 연결된 유동관(15)을 삽입시켜서 구성된 것을 특징으로 하는 연결와이어의 이송조절장치.
- 제1항에 있어서, 상기 압축가스 또는 압축공기 공급원(13)과 상기 진공 공급원(14)과 선택적으로 연통시키는 상기 절환밸브(16)는 상기 유동관(15)에 취부되어 상기 연결헤드(21)의 제어기와 연계토록 구성된 것을 특징으로 하는 연결와이어의 이송조절장치.
- 제1항 또는 제2항에 있어서, 상기 오리피스(19)와 내경을 가진 안내도관(20)을 구비한 상기 안내구(12)는 상기한 왯지 또는 모세관(22)에 근접되게 배설하고, 상기 압축공기 또는 압축공기 공급원(13)과 상기 진공 공급원(14)과 선택적으로 연통되는 상기 유동관(15)은 상기 연결와이어를 안내하는 오리피스(19)의 직하방에 배설하여 구성된 것을 특징으로 하는 연결와이어의 이송조절장치.
- 제3항에 있어서, 상기한 오리피스(19)는 상기한 연결와이어의 공급원인 코일과 대향이 되게 상기한 안내구(12)의 본체(17)에 형성된 통로(18)의 상부측 개구부로 삽착시키고, 상기한 안내도관(20)은 상기한 왯지 또는 모세관과 대향이 되게 상기한 통로(18)의 하부측 개구부로 삽착시키며, 상기한 압축가스 또는 압축공기 공급원(13)과 상기한 진공 공급원(14)과 선택적으로 연통이 되는 상기한 유동관(15)은 상기 오리피스(19)와 상기한 안내도관(24) 사이로 상기한 통로(18)와 연통이 되도록 구성된 것을 특징으로 하는 연결와이어의 이송조절장치.
- 제1항 내지 제4항중 어느 하나에 있어서, 상기한 압축가스 또는 압축공기 공급원(13)과 상기한 진공공급원(14)과 선택적으로 연통되는 상기 유동관(15)은 상기한 연경와이어를 안내하는 오리피스(19)에 대하여 예각을 형성하여 상기 안내구(12)에 삽착되어 구성되는 것을 특징으로 하는 연결와이어의 이송조절장치.
- 제3항 내지 제5항중 어느 하나에 있어서, 상기한 연결와이어를 안내하는 오리피스(19)의 배출공의 내경이 상기 연결와이어의 게이지가 200이하일 때에 100μ 내지 130μ 사이의 범위로 되고, 상기 오리피스(19)와 연관되는 상기 안내도관(20)의 내경은 대략 1.5mm에서 2.2mm인 것을 특징으로 하는 연결와이어의 이송조절장치.
- 제1항 내지 제6항중 어느 하나 또는 그 이상에 있어서, 상기한 안내구 (12,18,19,20)와 연관되게 슬립클램프(23)를 상기한 안내구의 상방에 또는 상기 모세관과 대향되게 상기 안내구의 하방에 배설하고, 상기클램프(23)는 항시 밀착상태로 유지하도록 구성하거나 또는 상기 연결헤드(21)가 소위 “착지”작동을 위하여 하강할 시에만 작동하도록 구성된 것을 특징으로 하는 연결와이어의 이송조절장치.
- 제7항에 있어서, 상기한 슬립클램프(23)의 압착면에 펠트 등과 같은 재료로 피복되어 구성된 것을 특징으로 하는 연결와이어의 이송조절장치.
- 제1항 내지 제8항중 어느 하나에 있어서, 상기한 안내구(12,18,19,20)의 하방에 하부클램프(24)를 배설하고, 상기 클램프(24)는 상기한 연결헤드(21)가 소정의 루우프의 높이로부터 사전에 설정된 중간 위치로 하강됨과 동시에 상기한 모세관의 선단부로부터 하향으로 늘어진 연결와이어(10)의 제2의 접착부(27)가 “착지”작동 직전에 견인과 이와 대응되게 이동될 시에 밀착상태로 작동되도록 구성된 것을 특징으로 하는 연결와이어의 이송조절장치.
- 상하좌우로 이동되는 연결헤드(21)의 왯지 또는 모세관측으로 연결와이어, 특히 금선으로 된 연결와이어(10)의 이송을 조절하는 방법에 있어서, 접착공정중에, 특히 루우프를 형성하는 동안에 동심원상의 압축가스, 특히 압축공기에 의하여 상기 연결와이어(10)를 대략 일정한 장력을 유지하면서 상기한 연결헤드(21)의 왯지 또는 모세관측으로 이송시키며, 또한 상기 연결와이어(10)를 상기한 연결헤드(21)의 왯지 또는 모세관으로부터 이간되는 방향으로 견인하도록 작용하는 것을 특징으로 하는 연결와이어의 이송조절방법.
- 제10항에 있어서, 상기한 동심원상의 압축가스, 특히 압축공기의 유동방향을 상기한 압축가스, 특히 압축공기의 밀도(압력 그리고/또는 용적 효율)를 가변시키는 것에 의하여 접착공정중에 가역시킬 수 있도록 구성된 것을 특징으로 하는 연결와이어의 이송조절방법.
- 제10항 또는 제11항에 있어서, 상기한 동심원상의 압축가스 또는 압축공기가 상기 연결와이어(10)를 중심부에 두고 그 주위를 선회하도록 구성된 것을 특징으로 하는 연결와이어의 이송조절방법.
- 상하좌우로 이동되는 연결헤드(21)의 왯지 또는 모세관(22)측으로 연결와이어, 특히 금선으로 된 연결와이어(10)의 이송을 조절하는 방법에 있어서, (a) 상기 연결헤드(21)에 배설되고, 또한 연동되는 클램핑수단(헤드클램프(28))에 의하여 상기 연결와이어(10)를 견인하면서, 또한 상기 연결와이어(10)에 소정의 장력을 유지시켜 주는 동심원상의 유체유동 그리고/또는 슬립클램프(23)의 작동에 대항하면서 상기 연결와이어(10)를 이송시킴과 동시에 또는 사전에 상기 연결와이어(10)의 자유단에 “방울”을 형성시키면서 상기 연결헤트(21)를 기준 또는 출발위치로부터 하강시키는 공정과, (b) “착지”와 제1의 접착부(25)가 형성되기 직전에 상기한 헤드클램프(28)를 개방시키면서 상기한 모세관(22)에 초음파를 작동시켜서 “착지”시키는 공정과, (c)상기한 슬립클램프(23)를 개방시키고, 또한 필요시에는 밀착시키며, 또는 상기한 동심원상의 유체유동을 절환시켜서 소정의 루우프 높이로 상기한 연결헤드(21)를 상승시키는 공정과, (d) 제2의 “착지”와 초음파의 작동하에 제 2의 접착패드(29)상에 접착이 형성되도록 재작동되는 동심원상의 유체유동과 재차 밀착상태로 되는 슬립클램프(23)의 작용에 대항하여 상기 연결와이어(10)를 이동시키면서 상기 연결헤드(21)를 하강시켜서 상기 모세관(22)이 제 2의 패드(29)상면과 대향이 되게 위치시키는 공정과, (e) 상기한 헤드클램프(28)와 상기한 슬립클램프(23)을 개방시키고, 상기한 연결와이어(10)가 절단되면서 상기한 연결헤드(21)가 기준위치로 도달될 때까지 상기한 연결헤드(21)의 상승이 계속되는 동안에 상기한 헤드클램프(28)는 다시 밀착상태로 됨에 따라서 상기한 동심원상의 유체유동을 계속 작동시키면서 상기한 연결헤드(21)를 소위 “테일길이”의 높이까지 상승시키는 공정으로 구성된 것을 특징으로 하는 연결와이어의 이송조절방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3805584A DE3805584A1 (de) | 1988-02-23 | 1988-02-23 | Vorrichtung und verfahren zur gesteuerten zufuehrung eines bonddrahtes zum "wedge" oder zur kapillare eines bondkopfes |
DEP3805584.8 | 1988-02-23 | ||
DE3825373A DE3825373A1 (de) | 1988-07-26 | 1988-07-26 | Vorrichtung und verfahren zur gesteuerten zufuehrung eines bonddrahtes zum "wedge" oder zur kapillare eines bondkopfes |
DEP3825373.9 | 1988-07-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR900002673A true KR900002673A (ko) | 1990-02-28 |
Family
ID=25865111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890002112A KR900002673A (ko) | 1988-02-23 | 1989-02-22 | 연결와이어의 이송 조절방법 및 그 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4928871A (ko) |
EP (1) | EP0330053B1 (ko) |
JP (1) | JPH01302736A (ko) |
KR (1) | KR900002673A (ko) |
AT (1) | ATE109387T1 (ko) |
DE (1) | DE58908123D1 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2559539B2 (ja) * | 1991-03-13 | 1996-12-04 | ローム株式会社 | ボンディング装置 |
US20070228110A1 (en) * | 1993-11-16 | 2007-10-04 | Formfactor, Inc. | Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out |
JP3075100B2 (ja) * | 1994-10-06 | 2000-08-07 | 松下電器産業株式会社 | ワイヤボンディング装置およびワイヤボンディング方法 |
JPH0945721A (ja) * | 1995-08-03 | 1997-02-14 | Kaijo Corp | ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置 |
DE19617470B4 (de) * | 1995-11-07 | 2006-02-02 | Hesse & Knipps Gmbh | Fadenzuführung |
AU1223499A (en) * | 1997-09-20 | 1999-04-12 | Hesse & Knipps Gmbh | Wire brake |
JP3741184B2 (ja) * | 1998-07-27 | 2006-02-01 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置 |
JP2000082717A (ja) * | 1998-09-07 | 2000-03-21 | Shinkawa Ltd | ワイヤボンディング方法 |
AU720299B3 (en) * | 2000-03-09 | 2000-05-25 | Edmunds Gumbelis | Feeding machanism for welding wire |
JP2002064117A (ja) * | 2000-08-22 | 2002-02-28 | Mitsubishi Electric Corp | ワイヤボンディング方法、ワイヤボンディング装置および半導体装置 |
JP2002083837A (ja) * | 2000-09-07 | 2002-03-22 | Shinkawa Ltd | ワイヤボンディング装置 |
JP2002151545A (ja) * | 2000-11-10 | 2002-05-24 | Nec Corp | ワイヤボンディング装置 |
US6641025B2 (en) * | 2001-08-30 | 2003-11-04 | Micron Technology, Inc. | Threading tool and method for bond wire capillary tubes |
US7311239B2 (en) * | 2004-05-04 | 2007-12-25 | Sv Probe Pte Ltd. | Probe attach tool |
US7954689B2 (en) * | 2007-05-04 | 2011-06-07 | Asm Technology Singapore Pte Ltd | Vacuum wire tensioner for wire bonder |
US8459530B2 (en) * | 2009-10-29 | 2013-06-11 | Asm Technology Singapore Pte Ltd | Automatic wire feeding method for wire bonders |
TWI566875B (zh) * | 2014-02-24 | 2017-01-21 | 新川股份有限公司 | 線張力器 |
CN106001577B (zh) * | 2016-06-27 | 2018-06-22 | 西安智熔金属打印系统有限公司 | 基于增材制造技术的送丝机构、送丝装置及增材制造设备 |
DE102020117641A1 (de) * | 2020-07-03 | 2022-01-05 | Hesse Gmbh | Drahtführungsmodul und Ultraschall-Drahtbonder hiermit |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3116889A (en) * | 1961-05-25 | 1964-01-07 | Electroglas Inc | Threading device with magazine and method |
US3357090A (en) * | 1963-05-23 | 1967-12-12 | Transitron Electronic Corp | Vibratory welding tip and method of welding |
CH592365A5 (ko) * | 1975-12-23 | 1977-10-31 | Esec Sales Sa | |
JPS58218131A (ja) * | 1982-06-14 | 1983-12-19 | Mitsubishi Electric Corp | ネイルヘツドワイヤボンダのワイヤ供給装置 |
JPS61159743A (ja) * | 1985-01-07 | 1986-07-19 | Toshiba Corp | ワイヤボンディング方法および装置 |
-
1989
- 1989-02-14 AT AT89102516T patent/ATE109387T1/de active
- 1989-02-14 EP EP19890102516 patent/EP0330053B1/de not_active Expired - Lifetime
- 1989-02-14 DE DE58908123T patent/DE58908123D1/de not_active Expired - Lifetime
- 1989-02-22 US US07/314,191 patent/US4928871A/en not_active Expired - Lifetime
- 1989-02-22 KR KR1019890002112A patent/KR900002673A/ko not_active Application Discontinuation
- 1989-02-23 JP JP1045046A patent/JPH01302736A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0330053B1 (de) | 1994-08-03 |
JPH01302736A (ja) | 1989-12-06 |
DE58908123D1 (de) | 1994-09-08 |
ATE109387T1 (de) | 1994-08-15 |
EP0330053A2 (de) | 1989-08-30 |
EP0330053A3 (en) | 1990-03-21 |
US4928871A (en) | 1990-05-29 |
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