KR900000835B1 - 서스펜션 캔릴레버(Suspension Cantilever) 로딩장치(Loading system)를 갖는 횡형로(橫型爐) - Google Patents

서스펜션 캔릴레버(Suspension Cantilever) 로딩장치(Loading system)를 갖는 횡형로(橫型爐) Download PDF

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Publication number
KR900000835B1
KR900000835B1 KR1019850002704A KR850002704A KR900000835B1 KR 900000835 B1 KR900000835 B1 KR 900000835B1 KR 1019850002704 A KR1019850002704 A KR 1019850002704A KR 850002704 A KR850002704 A KR 850002704A KR 900000835 B1 KR900000835 B1 KR 900000835B1
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KR
South Korea
Prior art keywords
furnace
cantilever
suspension
suspension cantilever
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019850002704A
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English (en)
Korean (ko)
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KR850008060A (ko
Inventor
준찌 사꾸라이
Original Assignee
후지쑤 가부시끼가이샤
야마모도 다꾸마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 후지쑤 가부시끼가이샤, 야마모도 다꾸마 filed Critical 후지쑤 가부시끼가이샤
Publication of KR850008060A publication Critical patent/KR850008060A/ko
Application granted granted Critical
Publication of KR900000835B1 publication Critical patent/KR900000835B1/ko
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
KR1019850002704A 1984-05-15 1985-04-22 서스펜션 캔릴레버(Suspension Cantilever) 로딩장치(Loading system)를 갖는 횡형로(橫型爐) Expired KR900000835B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59-096983 1984-05-15
JP096983 1984-05-15
JP59096983A JPS60240121A (ja) 1984-05-15 1984-05-15 横型炉

Publications (2)

Publication Number Publication Date
KR850008060A KR850008060A (ko) 1985-12-11
KR900000835B1 true KR900000835B1 (ko) 1990-02-17

Family

ID=14179445

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850002704A Expired KR900000835B1 (ko) 1984-05-15 1985-04-22 서스펜션 캔릴레버(Suspension Cantilever) 로딩장치(Loading system)를 갖는 횡형로(橫型爐)

Country Status (5)

Country Link
US (1) US4613305A (https=)
EP (1) EP0164892B1 (https=)
JP (1) JPS60240121A (https=)
KR (1) KR900000835B1 (https=)
DE (1) DE3567769D1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101424543B1 (ko) * 2010-06-04 2014-07-31 신에쓰 가가꾸 고교 가부시끼가이샤 열처리로

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692115A (en) * 1985-04-03 1987-09-08 Thermco Systems, Inc. Semiconductor wafer furnace door
FR2594102B1 (fr) * 1986-02-12 1991-04-19 Stein Heurtey Installation flexible automatisee de traitement thermochimique rapide
US4767251A (en) * 1986-05-06 1988-08-30 Amtech Systems, Inc. Cantilever apparatus and method for loading wafer boats into cantilever diffusion tubes
US4761134B1 (en) * 1987-03-30 1993-11-16 Silicon carbide diffusion furnace components with an impervious coating thereon
US4876225A (en) * 1987-05-18 1989-10-24 Berkeley Quartz Lab, Inc. Cantilevered diffusion chamber atmospheric loading system and method
US4943235A (en) * 1987-11-27 1990-07-24 Tel Sagami Limited Heat-treating apparatus
KR0139026B1 (ko) * 1988-02-05 1998-06-01 후세 노보루 보우트 반송방법 및 열처리 장치
US4976612A (en) * 1989-06-20 1990-12-11 Automated Wafer Systems Purge tube with floating end cap for loading silicon wafers into a furnace
GB9010833D0 (en) * 1990-05-15 1990-07-04 Electrotech Research Limited Workpiece support
US5174745A (en) * 1990-12-03 1992-12-29 Samsung Electronics Co., Ltd. Impurity diffusing furnace
US9018065B2 (en) * 2012-05-08 2015-04-28 Globalfoundries Inc. Horizontal epitaxy furnace for channel SiGe formation
US20250157847A1 (en) * 2023-11-09 2025-05-15 Globalwafers Co., Ltd. Systems and methods for bond treating and cleaving of silicon wafers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2754104A (en) * 1951-10-05 1956-07-10 Selas Corp Of America Method and apparatus for heating ingots
US2656170A (en) * 1951-11-16 1953-10-20 Selas Corp Of America Method and apparatus for heating objects
GB1160162A (en) * 1967-01-02 1969-07-30 Monsanto Co Apparatus and method for production of Epitaxial Films
US3669431A (en) * 1971-01-25 1972-06-13 Signetics Corp Boat pulling apparatus for diffusion furnace and method
US3723053A (en) * 1971-10-26 1973-03-27 Myers Platter S Heat treating process for semiconductor fabrication
DE2524616A1 (de) * 1975-06-03 1976-12-23 Siemens Ag Vorrichtung zum thermischen behandeln von halbleiterscheiben
US4217095A (en) * 1977-05-23 1980-08-12 Tetsuya Tokitsu Reheating furnace for use in a hot rolling line
US4303467A (en) * 1977-11-11 1981-12-01 Branson International Plasma Corporation Process and gas for treatment of semiconductor devices
JPS5843509A (ja) * 1981-09-09 1983-03-14 Fuji Electric Corp Res & Dev Ltd 量産型薄膜生成装置
JPS58218115A (ja) * 1982-06-14 1983-12-19 Sony Corp 熱処理装置
US4461617A (en) * 1982-10-25 1984-07-24 Asq Boats, Inc. Carrier for semiconductors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101424543B1 (ko) * 2010-06-04 2014-07-31 신에쓰 가가꾸 고교 가부시끼가이샤 열처리로

Also Published As

Publication number Publication date
EP0164892A1 (en) 1985-12-18
EP0164892B1 (en) 1989-01-18
DE3567769D1 (en) 1989-02-23
JPH0520895B2 (https=) 1993-03-22
US4613305A (en) 1986-09-23
KR850008060A (ko) 1985-12-11
JPS60240121A (ja) 1985-11-29

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