KR890009914U - 양면 부착식 프린트 회로 기판 - Google Patents

양면 부착식 프린트 회로 기판

Info

Publication number
KR890009914U
KR890009914U KR2019870018595U KR870018595U KR890009914U KR 890009914 U KR890009914 U KR 890009914U KR 2019870018595 U KR2019870018595 U KR 2019870018595U KR 870018595 U KR870018595 U KR 870018595U KR 890009914 U KR890009914 U KR 890009914U
Authority
KR
South Korea
Prior art keywords
double
circuit board
printed circuit
attached printed
sided attached
Prior art date
Application number
KR2019870018595U
Other languages
English (en)
Other versions
KR900002182Y1 (ko
Inventor
강장규
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR2019870018595U priority Critical patent/KR900002182Y1/ko
Publication of KR890009914U publication Critical patent/KR890009914U/ko
Application granted granted Critical
Publication of KR900002182Y1 publication Critical patent/KR900002182Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0445—Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR2019870018595U 1987-10-31 1987-10-31 양면 부착식 프린트 회로 기판 KR900002182Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019870018595U KR900002182Y1 (ko) 1987-10-31 1987-10-31 양면 부착식 프린트 회로 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019870018595U KR900002182Y1 (ko) 1987-10-31 1987-10-31 양면 부착식 프린트 회로 기판

Publications (2)

Publication Number Publication Date
KR890009914U true KR890009914U (ko) 1989-05-31
KR900002182Y1 KR900002182Y1 (ko) 1990-03-15

Family

ID=19269026

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019870018595U KR900002182Y1 (ko) 1987-10-31 1987-10-31 양면 부착식 프린트 회로 기판

Country Status (1)

Country Link
KR (1) KR900002182Y1 (ko)

Also Published As

Publication number Publication date
KR900002182Y1 (ko) 1990-03-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee