KR890008601A - 상사성 uv 경화가능 피복 조성물 - Google Patents

상사성 uv 경화가능 피복 조성물 Download PDF

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Publication number
KR890008601A
KR890008601A KR1019880014487A KR880014487A KR890008601A KR 890008601 A KR890008601 A KR 890008601A KR 1019880014487 A KR1019880014487 A KR 1019880014487A KR 880014487 A KR880014487 A KR 880014487A KR 890008601 A KR890008601 A KR 890008601A
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weight
composition
substrate
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units
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KR1019880014487A
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아이렌 구텍크 베쓰
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노만 에드워드 루이스
다우 코닝 코포레이션
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Publication of KR890008601A publication Critical patent/KR890008601A/ko

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/025Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • C09D183/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872Insulating conformal coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S528/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S528/901Room temperature curable silicon-containing polymer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Wood Science & Technology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

내용 없음

Description

상사성 UV경화가능 피복 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. (A) 조성물의 총 중량을 기준으로 하여, Si-C결합을 통해 실리콘 원자에 결합된 아크릴아미드 말단그룹을 갖고 1분자당 평균 적어도 20 내지 300미만의 디메틸실옥산 단위를 갖는 아크릴아미드 폴리디메틸실옥산 적어도 20중량%, (B) 조성물의 총 중량을 기준으로 하여, 알콕시그룹과 메타크릴레이트그룹(여기서, 말단그룹 1개당 2개의 알콕시그룹은 Si-O결합을 통해 실리콘에 결합하고, 1개의 메타크릴레이트 그룹은 Si-C결합을 통해 실리콘에 결합한다)을 둘다 함유하는 말단그룹을 갖고, 1분자당 평균 350미만의 디오가노실옥산단위(여기서, 디오가노실옥산 단위는 디메틸실옥산 단위, 디페닐실옥산 단위 및 메틸페닐실옥산 단위로부터 선택되며, 디오가노실옥산의 유기그룹의 적어도 50%는 메틸이다)를 갖는 폴리디오가노실옥산 적어도 20중량%, (C) 조성물의 총 중량을 기준으로 하여, 이소보닐 아크릴레이트, 사이클로 헥실 아크릴레이트 및 2-에틸헥실 아크릴레이트로 이루어진 그룹으로부터 선택된 반응성 희석제 적어도 20중량%, (D) 조성물의 총 중량을 기준으로 하여, C6H5-C(O)C(CH3)2-OH 적어도 0.25중량% 및 CH3S-C6H4-C(O)-C(CH3)2-적어도 0.25중량%가 존재하는 광개시제 배합물 0.5 내지 10중량%, (E) 조성물의 총 중량을 기준으로 하여, 디메틸에탄올아민과 디이소프로필에틸아민으로 이루어진 그룹으로부터 선택된 아민 0.1 내지 2중량% 및 (F) 조성물의 총 중량을 기준으로 하여, 유기 티타네이트 0.05 내지 1중량%를 포함함을 특징으로 하며, 25℃에서의 점도 범위가 0.07 내지 0.2Pa.s인 조성물.
  2. 제1항에 있어서, 감광제를 추가로 함유하는 조성물.
  3. 제1항에 있어서, 점착 첨가제를 추가로 함유하는 조성물.
  4. 제1항에 있어서, 산화방지제를 추가로 함유하는 조성물.
  5. 빛이 기질상에 조사될때 그늘진 부분이 있는 기하학적 구조를 갖는 장치에 설치된 기질을 피복하고, 피복된 기질을 자외선 조사선에 노출시킨 다음, 노출된 기질을 실온에서 수분과 반응시켜 추가로 경화시키는 단계를 포함하는 방법에 있어서, 제1항에 따르는 피복물을 사용하는 단계를 포함함을 특징으로 하는 개선된 방법.
  6. 제5항에 따르는 방법으로부터 수득되는 피복기질.
  7. 제5항에 다른 방법으로부터 수득되는, 기질이 인쇄회로판인 피복기질.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880014487A 1987-11-06 1988-11-04 상사성 uv 경화가능 피복 조성물 KR890008601A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US118086 1987-11-06
US07/118,086 US4824875A (en) 1987-11-06 1987-11-06 UV curable conformal coating with moisture shadow cure

Publications (1)

Publication Number Publication Date
KR890008601A true KR890008601A (ko) 1989-07-12

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Country Link
US (1) US4824875A (ko)
EP (1) EP0315342A3 (ko)
JP (1) JPH01161011A (ko)
KR (1) KR890008601A (ko)
AU (1) AU604167B2 (ko)
BR (1) BR8805751A (ko)

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CA1337224C (en) * 1987-11-06 1995-10-03 Beth I. Gutek Compositions having uv cure with moisture shadow cure
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Also Published As

Publication number Publication date
EP0315342A2 (en) 1989-05-10
EP0315342A3 (en) 1990-06-13
AU604167B2 (en) 1990-12-06
AU2469288A (en) 1989-06-01
US4824875A (en) 1989-04-25
JPH01161011A (ja) 1989-06-23
BR8805751A (pt) 1989-07-18

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