KR890005512A - 공작물의 표면 균열을 검출 및 평가하기 위한 방법 및 장치 - Google Patents

공작물의 표면 균열을 검출 및 평가하기 위한 방법 및 장치 Download PDF

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KR890005512A
KR890005512A KR1019880012359A KR880012359A KR890005512A KR 890005512 A KR890005512 A KR 890005512A KR 1019880012359 A KR1019880012359 A KR 1019880012359A KR 880012359 A KR880012359 A KR 880012359A KR 890005512 A KR890005512 A KR 890005512A
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image
workpiece
detecting
cracks
evaluating
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KR1019880012359A
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KR930000543B1 (ko
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슐츠 뤼디거
쉬톨첸베르크 엑하르트
디셀호르스트 쿠르트
부르코프 헤르베르트
키르헤쉬 카를
더들리 리언 제임스
프레덱릭 토핑 라우런스
자우어바인 쿠르트
페터 부세 한스
링크 라인너
방크 헴무트
크리스챤타프
친들러 볼프강
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자우어바인 쿠르트
아. 쉬토리코
포르트-베르케 아게.
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/91—Investigating the presence of flaws or contamination using penetration of dyes, e.g. fluorescent ink
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • G01N27/83—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws by investigating stray magnetic fields
    • G01N27/84—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws by investigating stray magnetic fields by applying magnetic powder or magnetic ink
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8896—Circuits specially adapted for system specific signal conditioning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G01N2021/936—Adjusting threshold, e.g. by way of moving average
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/102—Video camera

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  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Image Analysis (AREA)

Abstract

내용 없음

Description

공작물의 표면 균열을 검출 및 평가하기 위한 방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 본 발명의 실시예에 대한 블록다이어그램.

Claims (11)

  1. 공작물표면의 화상은 비디오 카메라에 의해 얻어져 디지탈화되고 컴퓨터에 의해 처리되어 어떤 균열을 나타내기 위한 2진 화상으로 되고 미리 설정된 문턱값레벨을 초과할 경우 분류 명령이 야기되는 공작물의 표면 균열을 검출 및 평가하기 위한 방법에 이어서, 흐린 배경화상은 디지탈화된 회색음영레벨로부터 유도되고 원래의 화상으로부터 추출되며 차이화상은 균열표시를 제공하는 것으로 이루어지는 것을 특징으로하는 공작물의 표면균열을 검출 및 평가하기 위한 방법.
  2. 공작캇4표면의 화상은 비디오 카메라에 의해 얻어져 디지탈화되고 컴퓨터에 의해 처리되어 어떤균열을 나타내기 위한 2진화상으로 되고 미리설정된 문턱 값레벨을 초과할 경우 분류 명령이 야기되는 공작물의 표면으로부터 발생하는 균열을 검출 및 평가하기 위한 방법에 있어서, 원래의 화상은 고역필터링에 영향을받고 고역필터링된 화상은 균열표시를 제공하는 것으로 이루어지는 것을 특징으로하는 공작물의 표면으로부터 발생하는 균열을 검출 및 평가하기 위한 방법
  3. 제1항에 있어서, 다이내믹회색음영문턱값은 원래의 또는 차이화상의 회색음영분포와 적어도 하나의 미리 평가된 화상 또는 차이화상은 비교함으로서 세트되고, 2진화상은 원래의 또는 차이화상과 상기 회색음영문턱값으로부터 만들어지고, 그리고 상기 세트된 문턱값을 초과하는 회색음영을 갖는 화소는 결함으로서 표시되는 것을 특징으로하는 공작물의 표면균열을 검출 및 평가하기 위한 방법.
  4. 제3항에 있어서, 결합표시의 경우에 공작물 가공시스템은 관련된 공작물을 분리하도록 제어되는 것을 특징으로하는 공작물의 표면균열을 검출 및 평가하기 위한 방법.
  5. 제1항에 있어서, 회색음영레벨로 변환되는 다수의 화상이 부가되는 것을 특징으로하는 공작물의 표면균열을 검출 및 평가하기 위한 방법.
  6. 제1항에 있어서, 길이대폭비와 2진화상의 화소영역중 적어도 하나가 균열표시의 기준으로서 고려되는것을 특징으로하는 공작물의 표면 균열을 검출 및 평가하기 위한 방법.
  7. 제1항에 있어서, 화상은 칼라텔레비전에 의해 얻어지고, 배경화상은 균열표시제로부터 발생되는 빛에 적합한 필터에 의해 제거되는 것을 특징으로하는 공작물의 표면 균열을 검출 및 평가하기위한 방법.
  8. 제7항에 있어서, 아날로그신호처리는 평가될 화상이 배경 및/또는 가짜신호로부터 분리되고 그밖의 신호가 필터링 및/또는 보강되는 그러한 정도로 적, 녹 및 청색을 혼합함으로서 색혼합유니트에 의해 실행되는 것을 특징으로하는 공작물의 표면균열을 검출 및 평가하기 위한 방법.
  9. 제1항에 있어서, 공작물은 자기파우더 또는 색투과 방법 및/또는 대비보강제에 의해 미리처리되는것을 특징으로 하는 공작물의 표면균열을 검출 및 평가하기 위한 방법.
  10. 제2항에 있어서, 공작물은 자기파우더 또는 색투과 방법 및/또는 대비보강제에 의해 미리 처리되는 것을 특징으로하는 공작물의 표면으로부터 발생하는 균열을 검출 및 평가하기 위한 방법.
  11. 공작물 가공수단, 균열표시제로부터 발생되는 빛에 적합한 광필터를 갖는 칼라텔레비젼카메라, 그 다음에 연결되는 색혼합유니트, 아날로그/디지탈 신호변환기, 그리고 화상기억장치와 디지탈화상레벨을 준비하고 평가하기 위한 컴퓨터유니트를 갖고 공작물 가공장치에 연결된 제어출력부를 갖는 디지탈 화상처리 유니트로 이루어지는 제1항에 따른 방법을 실행하기 위한 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880012359A 1987-09-23 1988-09-23 공작물의 표면균열을 검출 및 평가하기 위한 방법 및 장치 KR930000543B1 (ko)

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DEP3731947.7 1987-09-23
DE19873731947 DE3731947A1 (de) 1987-09-23 1987-09-23 Verfahren und vorrichtung zum feststellen und auswerten von oberflaechenrissen bei werkstuecken

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KR890005512A true KR890005512A (ko) 1989-05-15
KR930000543B1 KR930000543B1 (ko) 1993-01-25

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US (1) US5047851A (ko)
EP (1) EP0309758B1 (ko)
JP (1) JPH01109249A (ko)
KR (1) KR930000543B1 (ko)
AU (1) AU609521B2 (ko)
CA (1) CA1322581C (ko)
DE (2) DE3731947A1 (ko)

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Publication number Publication date
EP0309758B1 (de) 1994-05-25
JPH01109249A (ja) 1989-04-26
EP0309758A3 (en) 1990-03-07
AU609521B2 (en) 1991-05-02
AU2248588A (en) 1989-03-23
DE3889704D1 (de) 1994-06-30
KR930000543B1 (ko) 1993-01-25
CA1322581C (en) 1993-09-28
DE3731947A1 (de) 1989-04-13
EP0309758A2 (de) 1989-04-05
US5047851A (en) 1991-09-10

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