KR880009074A - 폴리아세탈 수지 성형품의 표면처리법 - Google Patents

폴리아세탈 수지 성형품의 표면처리법 Download PDF

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Publication number
KR880009074A
KR880009074A KR1019880000221A KR880000221A KR880009074A KR 880009074 A KR880009074 A KR 880009074A KR 1019880000221 A KR1019880000221 A KR 1019880000221A KR 880000221 A KR880000221 A KR 880000221A KR 880009074 A KR880009074 A KR 880009074A
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KR
South Korea
Prior art keywords
polyacetal resin
surface treatment
resin molded
acid
molded article
Prior art date
Application number
KR1019880000221A
Other languages
English (en)
Other versions
KR910005862B1 (ko
Inventor
요시하루 스즈끼
도모유끼 아께다
Original Assignee
고니시 히꼬이찌
폴리플라스틱스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고니시 히꼬이찌, 폴리플라스틱스 가부시끼가이샤 filed Critical 고니시 히꼬이찌
Publication of KR880009074A publication Critical patent/KR880009074A/ko
Application granted granted Critical
Publication of KR910005862B1 publication Critical patent/KR910005862B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2359/00—Characterised by the use of polyacetals containing polyoxymethylene sequences only
    • C08J2359/02—Copolyoxymethylenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)

Abstract

내용 없음.

Description

폴리아세탈 수지 성형품의 표면처리법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 폴리아세탈수지 80 내지 99.5중량부와 평균입경이 0.1 내지 20미크론인 금속산화물 미립자 20 내지 0.5중량부로 되어 있는 폴리아세탈 조성물로부터 성형된 성형품을 황산, 염산, 인산으로 구성된 군으로부터 선택된 무기산을 함유하는 산성액으로 에칭 처리하는 단계로 구성되는 것을 특징으로 하는 폴리아세탈수지 성형품의 표면 처리법.
  2. 제1항에 있어서, 금속 산화물이 주기율표 제II족 금속의 산화물인 것을 특징으로 하는 폴리아세탈수지 성형품의 표면 처리법.
  3. 제1항에 있어서, 상기 산성액이 황산과 염산을 함유하거나 또는 황산과 인산을 함유하는 것을 특징으로 하는 폴리아세탈 수지성형품의 표면처리법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880000221A 1987-01-16 1988-01-14 폴리아세탈 수지 성형품의 표면처리법 KR910005862B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP?62-7526 1987-01-16
JP62007526A JPH062837B2 (ja) 1987-01-16 1987-01-16 ポリアセタ−ル樹脂成形品の表面処理法
JP62-7,526 1987-01-16

Publications (2)

Publication Number Publication Date
KR880009074A true KR880009074A (ko) 1988-09-14
KR910005862B1 KR910005862B1 (ko) 1991-08-06

Family

ID=11668226

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880000221A KR910005862B1 (ko) 1987-01-16 1988-01-14 폴리아세탈 수지 성형품의 표면처리법

Country Status (4)

Country Link
US (1) US4836889A (ko)
EP (1) EP0279504A3 (ko)
JP (1) JPH062837B2 (ko)
KR (1) KR910005862B1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2718957B2 (ja) * 1988-10-05 1998-02-25 ポリプラスチックス株式会社 結晶性熱可塑性樹脂成形品の静電塗装方法並びに塗装プラスチックス成形品
FR2703074B1 (fr) * 1990-11-27 1996-01-05 Eumail Procédé de traitement des polyacétals chromables par un mélange d'acides.
US5616231A (en) * 1996-05-08 1997-04-01 Aluminum Company Of America Electrobrightening process for aluminum alloys
DE19627614A1 (de) * 1996-07-09 1998-01-15 Hoppecke Zoellner Sohn Accu Verfahren zur Herstellung von Trennmaterialien
US5976396A (en) * 1998-02-10 1999-11-02 Feldman Technology Corporation Method for etching
NL1020666C2 (nl) * 2002-05-24 2003-11-25 Univ Eindhoven Tech Werkwijze voor het verwijderen van zware metalen uit een polymeersubstraat.
CN100419008C (zh) * 2003-06-20 2008-09-17 纳幕尔杜邦公司 用于电镀的改性聚缩醛
US20040258906A1 (en) * 2003-06-20 2004-12-23 Pascal Scaramuzzino Modified polyacetals for plating
JP4828891B2 (ja) * 2005-08-18 2011-11-30 東洋製罐株式会社 ポリアセタール樹脂成形物の金属めっき方法とそのめっき製品

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3235426A (en) * 1961-08-01 1966-02-15 Du Pont Method of rendering thermoplastic resins receptive to coatings
US3554880A (en) * 1968-01-11 1971-01-12 Du Pont Process for electroplating polyoxymethylene resins
US3905877A (en) * 1974-02-19 1975-09-16 Du Pont Process for electroplating polyoxymethylene
US3963590A (en) * 1975-02-25 1976-06-15 E. I. Du Pont De Nemours And Company Process for electroplating polyoxymethylene
US4464435A (en) * 1978-10-25 1984-08-07 Asahi Kasei Kogyo Kabushiki Kaisha Polyacetal resin composition excellent in heat stability and surface processability and process for surface treating same
JPS6036471B2 (ja) * 1980-04-30 1985-08-20 ポリプラスチツクス株式会社 ポリアセタ−ル樹脂の表面処理法
US4370197A (en) * 1981-06-24 1983-01-25 International Business Machines Corporation Process for etching chrome
JPS58101125A (ja) * 1981-12-10 1983-06-16 Mitsubishi Gas Chem Co Inc ポリアセタ−ル樹脂の表面処理法
US4448637A (en) * 1981-12-28 1984-05-15 Daicel Chemical Industries, Ltd. Etching method of conductive film
JPH062836B2 (ja) * 1986-08-06 1994-01-12 ポリプラスチックス株式会社 ポリアセタ−ル樹脂成形品の表面処理法

Also Published As

Publication number Publication date
JPS63175038A (ja) 1988-07-19
EP0279504A3 (en) 1989-12-06
US4836889A (en) 1989-06-06
JPH062837B2 (ja) 1994-01-12
KR910005862B1 (ko) 1991-08-06
EP0279504A2 (en) 1988-08-24

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