KR880001042A - 인규산 글라스(psg)코팅 형성 공정 - Google Patents
인규산 글라스(psg)코팅 형성 공정 Download PDFInfo
- Publication number
- KR880001042A KR880001042A KR1019870006346A KR870006346A KR880001042A KR 880001042 A KR880001042 A KR 880001042A KR 1019870006346 A KR1019870006346 A KR 1019870006346A KR 870006346 A KR870006346 A KR 870006346A KR 880001042 A KR880001042 A KR 880001042A
- Authority
- KR
- South Korea
- Prior art keywords
- psg
- process according
- gas
- reaction
- phosphoric acid
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000000576 coating method Methods 0.000 title claims description 4
- 239000011248 coating agent Substances 0.000 title claims 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 title 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 title 1
- 239000011521 glass Substances 0.000 title 1
- 239000012495 reaction gas Substances 0.000 claims 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 2
- 239000007789 gas Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000005365 phosphate glass Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000005368 silicate glass Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/469—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers
- H01L21/471—Inorganic layers
- H01L21/473—Inorganic layers composed of oxides or glassy oxides or oxide based glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02129—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31625—Deposition of boron or phosphorus doped silicon oxide, e.g. BSG, PSG, BPSG
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 따른 대기압력 CVD 반응기의 모식적인 도. 제7A도 및 7B도는 본 발명에 따른 단계적 공정범위를 종래와 비교하여 A1상에 부착된 PSG 코오팅의 횡단면도.
Claims (5)
- 화학적 증기 부착 방법으로 기판상에 인규산 글라스(PSG) 코오팅을 형성하는 공정에 있어서, 모노실란, 인화수소 및 산소로 구성되어 있는 반응 가스가 암모니아 가스와 혼합되어 반응용기 안으로 주입 되어지는 화학적 증기 부착 방법으로 기판상에 인규산 글라스 코이팅을 형성하는 공정.
- 청구범위 제1항에 있어서, 반응가스로 공급되는 가스들이 따로따로, 혹은 조합하여서 반응용기 안으로 주입되어지는 공정.
- 청구범위 제1항 또는 제2항에 있어서, 반응가스에 있어서, 암모니아 가스대 모노실란 가스에 대한 체적비가 0.1-100정도 내에 있는 공정.
- 청구범위 제1항 내지 제3항에 있어서, 화학적 증기부착반응이 300-450℃에서 행하여지는 공정
- 청구범위 제1항 내지 제4항 중에서 어느한 항에 있어서, 반도체 소자를 생산하는데 사용되는 공정.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61144919A JPS632330A (ja) | 1986-06-23 | 1986-06-23 | 化学気相成長方法 |
JP61-144919 | 1986-06-23 | ||
JP144919 | 1986-06-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880001042A true KR880001042A (ko) | 1988-03-31 |
KR900008970B1 KR900008970B1 (ko) | 1990-12-15 |
Family
ID=15373285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870006346A KR900008970B1 (ko) | 1986-06-23 | 1987-06-22 | 인규산 글라스(psg) 코팅 형성 공정 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4781945A (ko) |
EP (1) | EP0251650B1 (ko) |
JP (1) | JPS632330A (ko) |
KR (1) | KR900008970B1 (ko) |
DE (1) | DE3764554D1 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5112776A (en) * | 1988-11-10 | 1992-05-12 | Applied Materials, Inc. | Method for planarizing an integrated circuit structure using low melting inorganic material and flowing while depositing |
US5244841A (en) * | 1988-11-10 | 1993-09-14 | Applied Materials, Inc. | Method for planarizing an integrated circuit structure using low melting inorganic material and flowing while depositing |
DE69031854T2 (de) * | 1989-08-31 | 1998-04-16 | At & T Corp | Methode und Vorrichtung zur Ablagerung einer isolierten Schicht |
US5328872A (en) * | 1989-12-29 | 1994-07-12 | At&T Bell Laboratories | Method of integrated circuit manufacturing using deposited oxide |
DE69231390D1 (de) * | 1991-06-10 | 2000-10-05 | At & T Corp | Anisotropische Ablagerung von Dielektrika |
US5434110A (en) * | 1992-06-15 | 1995-07-18 | Materials Research Corporation | Methods of chemical vapor deposition (CVD) of tungsten films on patterned wafer substrates |
FR2695118B1 (fr) * | 1992-09-02 | 1994-10-07 | Air Liquide | Procédé de formation d'une couche barrière sur une surface d'un objet en verre. |
US5854131A (en) * | 1996-06-05 | 1998-12-29 | Advanced Micro Devices, Inc. | Integrated circuit having horizontally and vertically offset interconnect lines |
US5773361A (en) * | 1996-11-06 | 1998-06-30 | International Business Machines Corporation | Process of making a microcavity structure and applications thereof |
US6013584A (en) * | 1997-02-19 | 2000-01-11 | Applied Materials, Inc. | Methods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applications |
US6073576A (en) | 1997-11-25 | 2000-06-13 | Cvc Products, Inc. | Substrate edge seal and clamp for low-pressure processing equipment |
US6734564B1 (en) * | 1999-01-04 | 2004-05-11 | International Business Machines Corporation | Specially shaped contact via and integrated circuit therewith |
US20040134352A1 (en) * | 2003-01-13 | 2004-07-15 | David Stacey | Silica trap for phosphosilicate glass deposition tool |
DE102008035235B4 (de) * | 2008-07-29 | 2014-05-22 | Ivoclar Vivadent Ag | Vorrichtung zur Erwärmung von Formteilen, insbesondere dentalkeramischen Formteilen |
JP7294858B2 (ja) * | 2019-04-09 | 2023-06-20 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53112066A (en) * | 1977-03-11 | 1978-09-30 | Fujitsu Ltd | Plasma treatment apparatus |
JPS5559729A (en) * | 1978-10-27 | 1980-05-06 | Fujitsu Ltd | Forming method of semiconductor surface insulating film |
DE3173066D1 (en) * | 1980-08-29 | 1986-01-09 | Fujitsu Ltd | Method of forming phosphosilicate glass films |
US4451969A (en) * | 1983-01-10 | 1984-06-05 | Mobil Solar Energy Corporation | Method of fabricating solar cells |
-
1986
- 1986-06-23 JP JP61144919A patent/JPS632330A/ja active Granted
-
1987
- 1987-06-22 KR KR1019870006346A patent/KR900008970B1/ko not_active IP Right Cessation
- 1987-06-23 EP EP87305566A patent/EP0251650B1/en not_active Expired - Lifetime
- 1987-06-23 US US07/065,505 patent/US4781945A/en not_active Expired - Lifetime
- 1987-06-23 DE DE8787305566T patent/DE3764554D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR900008970B1 (ko) | 1990-12-15 |
JPS632330A (ja) | 1988-01-07 |
US4781945A (en) | 1988-11-01 |
EP0251650B1 (en) | 1990-08-29 |
EP0251650A1 (en) | 1988-01-07 |
JPH0260210B2 (ko) | 1990-12-14 |
DE3764554D1 (de) | 1990-10-04 |
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