DE69231390D1 - Anisotropische Ablagerung von Dielektrika - Google Patents
Anisotropische Ablagerung von DielektrikaInfo
- Publication number
- DE69231390D1 DE69231390D1 DE69231390T DE69231390T DE69231390D1 DE 69231390 D1 DE69231390 D1 DE 69231390D1 DE 69231390 T DE69231390 T DE 69231390T DE 69231390 T DE69231390 T DE 69231390T DE 69231390 D1 DE69231390 D1 DE 69231390D1
- Authority
- DE
- Germany
- Prior art keywords
- dielectrics
- anisotropic deposition
- anisotropic
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/3143—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers
- H01L21/3145—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers formed by deposition from a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31608—Deposition of SiO2
- H01L21/31612—Deposition of SiO2 on a silicon body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/318—Inorganic layers composed of nitrides
- H01L21/3185—Inorganic layers composed of nitrides of siliconnitrides
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71237591A | 1991-06-10 | 1991-06-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69231390D1 true DE69231390D1 (de) | 2000-10-05 |
Family
ID=24861849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69231390T Expired - Lifetime DE69231390D1 (de) | 1991-06-10 | 1992-06-02 | Anisotropische Ablagerung von Dielektrika |
Country Status (4)
Country | Link |
---|---|
US (1) | US5302555A (de) |
EP (1) | EP0518544B1 (de) |
JP (1) | JPH0766186A (de) |
DE (1) | DE69231390D1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5829128A (en) * | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
US5643838A (en) * | 1988-03-31 | 1997-07-01 | Lucent Technologies Inc. | Low temperature deposition of silicon oxides for device fabrication |
DE69433836D1 (de) | 1993-12-28 | 2004-07-15 | Applied Materials Inc | Verfahren zur plasma-unterstützten chemischen Dampfabscheidung von Silizium-Oxynitridschichten |
US5518959A (en) * | 1995-08-24 | 1996-05-21 | Taiwan Semiconductor Manufacturing Company | Method for selectively depositing silicon oxide spacer layers |
US5599740A (en) * | 1995-11-16 | 1997-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Deposit-etch-deposit ozone/teos insulator layer method |
US6194038B1 (en) * | 1998-03-20 | 2001-02-27 | Applied Materials, Inc. | Method for deposition of a conformal layer on a substrate |
JP2002514004A (ja) * | 1998-05-01 | 2002-05-14 | セシュー ビー デス | 化学蒸着によって堆積された酸化物/有機ポリマー多層薄膜 |
US6316055B1 (en) * | 1998-05-01 | 2001-11-13 | Virginia Tech Intellectual Properties, Inc. | Near-room temperature thermal chemical vapor deposition of oxide films |
US6495208B1 (en) * | 1999-09-09 | 2002-12-17 | Virginia Tech Intellectual Properties, Inc. | Near-room temperature CVD synthesis of organic polymer/oxide dielectric nanocomposites |
US6891266B2 (en) * | 2002-02-14 | 2005-05-10 | Mia-Com | RF transition for an area array package |
US6911695B2 (en) * | 2002-09-19 | 2005-06-28 | Intel Corporation | Transistor having insulating spacers on gate sidewalls to reduce overlap between the gate and doped extension regions of the source and drain |
US6863731B2 (en) * | 2002-10-18 | 2005-03-08 | Controls Corporation Of America | System for deposition of inert barrier coating to increase corrosion resistance |
JP2011522381A (ja) * | 2008-05-30 | 2011-07-28 | コロラド ステート ユニバーシティ リサーチ ファンデーション | プラズマに基づく化学源装置およびその使用方法 |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
JP5807084B2 (ja) * | 2013-09-30 | 2015-11-10 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54135574A (en) * | 1978-03-23 | 1979-10-20 | Japan Synthetic Rubber Co Ltd | Probe for measuring characteristics of plasma* and method and device employing said probe |
JPS5648139A (en) * | 1979-09-28 | 1981-05-01 | Hitachi Ltd | Formation of plasma psg film |
JPS57192032A (en) * | 1981-05-22 | 1982-11-26 | Hitachi Ltd | Forming method for insulating film |
JPS5821324A (ja) * | 1981-07-30 | 1983-02-08 | Agency Of Ind Science & Technol | 水素添加した半導体薄膜成長用金属表面基板の前処理方法 |
JPS58181865A (ja) * | 1982-04-20 | 1983-10-24 | Citizen Watch Co Ltd | プラズマcvd装置 |
US4492736A (en) * | 1983-09-29 | 1985-01-08 | Atlantic Richfield Company | Process for forming microcrystalline silicon material and product |
CA1240215A (en) * | 1984-07-11 | 1988-08-09 | Edwin A. Chandross | Fabrication of devices with a silicon oxide region |
US4708884A (en) * | 1984-07-11 | 1987-11-24 | American Telephone And Telegraph Company, At&T Bell Laboratories | Low temperature deposition of silicon oxides for device fabrication |
US4702936A (en) * | 1984-09-20 | 1987-10-27 | Applied Materials Japan, Inc. | Gas-phase growth process |
JPH0697660B2 (ja) * | 1985-03-23 | 1994-11-30 | 日本電信電話株式会社 | 薄膜形成方法 |
US4845054A (en) * | 1985-06-14 | 1989-07-04 | Focus Semiconductor Systems, Inc. | Low temperature chemical vapor deposition of silicon dioxide films |
JPS632330A (ja) * | 1986-06-23 | 1988-01-07 | Fujitsu Ltd | 化学気相成長方法 |
JP2763100B2 (ja) * | 1988-02-03 | 1998-06-11 | 株式会社東芝 | 薄膜形成方法 |
JP2683692B2 (ja) * | 1988-05-24 | 1997-12-03 | 株式会社 半導体エネルギー研究所 | プラズマ気相反応方法 |
US4894352A (en) * | 1988-10-26 | 1990-01-16 | Texas Instruments Inc. | Deposition of silicon-containing films using organosilicon compounds and nitrogen trifluoride |
JPH02187024A (ja) * | 1989-01-13 | 1990-07-23 | Mitsubishi Electric Corp | 半導体装置の製造方法および該半導体装置の製造に用いられる処理装置 |
JPH06103691B2 (ja) * | 1989-02-20 | 1994-12-14 | 松下電器産業株式会社 | 薄膜の形成方法 |
US5013691A (en) * | 1989-07-31 | 1991-05-07 | At&T Bell Laboratories | Anisotropic deposition of silicon dioxide |
JPH03175632A (ja) * | 1989-12-04 | 1991-07-30 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JPH0740569B2 (ja) * | 1990-02-27 | 1995-05-01 | エイ・ティ・アンド・ティ・コーポレーション | Ecrプラズマ堆積方法 |
-
1992
- 1992-06-02 EP EP92305051A patent/EP0518544B1/de not_active Expired - Lifetime
- 1992-06-02 DE DE69231390T patent/DE69231390D1/de not_active Expired - Lifetime
- 1992-06-05 JP JP4169889A patent/JPH0766186A/ja active Pending
-
1993
- 1993-04-06 US US08/042,914 patent/US5302555A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0766186A (ja) | 1995-03-10 |
EP0518544A3 (en) | 1993-12-08 |
US5302555A (en) | 1994-04-12 |
EP0518544B1 (de) | 2000-08-30 |
EP0518544A2 (de) | 1992-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |